Vijesti i novosti o Intel procesorima i čipsetima - Stranica 208

The Exiled · 19.04.2025., 10:41

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Autor maXonja

Intel se još uopće koristi u desktop pc-evima? Tko to kupuje?

Najgore je kaj se i dalje ponašaju kao da je još uvijek 2006., pa sljedeći tjedan izbacuju Conroe koji će pomesti sve pred sobom, ali ovaj put na 18A procesu.

I ove tragikomedije s opet novim socketom i čipsetom dodatno podižu povjerenje u nadolazeću platformu, koja vrlo lako može ispasti i završiti isto ko i Arrow Lake.

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Intel details next-gen 18A fab tech: significantly more performance, lower power, higher density

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Intel is set to detail (PDF) the advantages of its 18A manufacturing technology (1.8nm-class) compared to its Intel 3 fabrication process at the upcoming VLSI Symposium 2025. As expected, the new production node will offer substantial benefits across power, performance, and area (PPA) metrics, thus providing tangible advantages both for client and data center products. Intel claims that its 18A fabrication process delivers 25% more performance at the same voltage (1.1V) and complexity, as well as 36% lower power at the same frequency and voltage of 1.1V for a standard Arm core sub-block compared to the same block fabricated on Intel 3 process technology. At a lower voltage (0.75V), Intel 18A provides 18% higher performance and 38% lower power. In addition, 18A consistently achieves 0.72X area scaling compared to Intel 3.

Intel's 18A manufacturing technology is the company's first node to rely on gate-all-around (GAA) RibbonFET transistors and feature PowerVia backside power delivery network (BSPDN), two features that enable major PPA advantages. Intel is reportedly on track to start high-volume manufacturing of compute chiplets for its codenamed Panther Lake processors for client PCs later this year and then chiplets for Clearwater Forest data center systems in early 2026. In addition, the company is on track to tape out the first third-party designs on 18A in mid-2025.

Izvor: Tom's Hardware

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Intel's "Nova Lake" processors reportedly slated for TSMC's 2nm node

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TSMC is pushing forward its plans to make 2 nm process chips in large quantities in the second half of the year, with major customer developments coming to light. After AMD placed its order, reports suggest Intel has also become one of TSMC's first 2 nm customers aiming to use this cutting-edge technology for its next-gen desktop processors. Intel, already a big TSMC customer for advanced processes sent out key compute tiles for its Core Ultra processors to TSMC using different processes like N3B, N5P, and N6. To be exact, these were Intel Core Ultra 200V "Lunar Lake" series laptop processors and Core Ultra 200S "Arrow Lake" series. While both companies didn't comment on the latest news, industry talk hints that they're cooperating on

Intel's upcoming Nova Lake desktop processor set to launch next year (rumors suggest that it could be the Compute Tile). With the codename "NVL-S" Nova Lake combines two groups of eight high-performance "Coyote Cove" P-cores with 16 "Arctic Wolf" E-cores. It also includes four ultra-low-power LPE cores in a separate SoC tile. It is expected that Nova Lake-S will use LGA 1954, which has 1,954 active lands and might have more than 2,000 total pads when you count debug pins.

TSMC's work on 2 nm technology is moving forward as expected. The company uses first-generation nanochip transistor technology to boost performance and reduce power consumption across process nodes with big clients finishing designing silicon IPs and starting validation steps. AMD shared that its next EPYC "Venice" chip will be the first high-performance computing processor to use TSMC's 2 nm process. AMD validated it at TSMC's Arizona plant and is on track to launch it in 2026. Also, word has it that Apple's future iPhone 18 lineup will have its A20 chip made with the same TSMC 2 nm process.

Izvor: TechPowerUp

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Intel to announce a 20% workforce cut this week

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Intel is preparing to announce plans to cut over 20% of its workforce this week in an attempt to reduce costs and cut down bureaucracy at the chipmaker, reports Bloomberg citing a source with knowledge of the matter. The move to eliminate over 20,000 positions from Intel is a part of the company's revival plan designed by chief executive Lip-Bu Tan. The restructuring aims to simplify operations and refocus the company on engineering drive culture after prolonged business challenges, according to the report. Lip-Bu Tan, who took leadership of the company last month, is pushing to purge excessive layers of management, eliminate redundant positions, and shift Intel back toward a product-focused approach while concentrating on key projects.

This round of layoffs follows a previous reduction of approximately 15,000 positions announced in August 2024. The reductions primarily affected non-engineering roles, including administrative staff, sales, marketing, and support functions. Manufacturing roles and key engineering teams were largely preserved during this round (according to media reports), as Intel pins a lot of hopes on its foundry ambitions and needs to develop competitive products. For now, it is unclear which positions will be cut this time. Intel had 108,900 employees as of December 28, 2024 (which included several thousands of Altera employees who are now employed by an independent company co-owned by Intel and Silver Lake), so the plan includes eliminating over 20,000 positions, a number that exceeds all mid-tier management positions at the company.

It is unclear whether this time the company will cut the number of engineers and projects that they are working on, though this looks like a likely scenario. Intel's quarterly results will offer the clearest look yet at new CEO Lip-Bu Tan's turnaround strategy for the embattled American chipmaker, and investors are hoping for early signs that he is reversing years of strategic lapses. The company is set to post its fourth consecutive quarterly revenue drop on Thursday.

Izvor: Tom's Hardware

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Intel CEO announces layoffs, restructuring, $1.5 billion in cost reductions, expanded return to office mandate

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Intel CEO Lip Bu-Tan announced a series of sweeping measures today, including an unspecified number of layoffs, a company restructuring, the elimination of non-core products, and a return-to-office mandate, as the company presented its first-quarter earnings report. Tan has only been at the helm of Intel for five weeks, but his core message is that the transformation of Intel's culture will be an extended process and requires eliminating the "bureaucracy suffocating the innovation and agility that we need to win."

Intel has not yet specified the number of employees it expects to lay off in the coming months, but did say the company will begin the adjustments in Q2 and will do so over several months. Intel last laid off 15% of its workforce, approximately 15,000 employees, in August 2024. It has been rumored that Intel plans to lay off 20% of its workforce in this round, which could equate to nearly 20,000 more employees. Intel is also reducing its operating expense target by $1.5 billion over the next two years. Intel will reduce its operating expenses to $17 billion in 2025, a $ 500 million cut, and aim for $16 billion in 2026, a further $1 billion reduction.

Tan restructured the upper echelon of the management team late last week, but Tan says he will continue to eliminate more layers of the management structure, noting that "many teams are eight or more layers deep, which creates unnecessary bureaucracy that slows us down." He also noted that one of the key KPIs for managers at Intel has been the size of their team, but he will eliminate that strategy, instead focusing on creating a leaner and more efficient structure.

Tan also noted that the current policy, which requires employees to be on site for three days per week, has not been followed consistently. The company will now require all employees to be in the office for four days per week, effective September 1. The focus on efficiency will also extend to significantly reducing internal administrative work, including eliminating unnecessary meetings and attendees. While Tan has only shared the broad outlines of his plans, they are expansive.

"I’m talking about the opportunity to fundamentally reinvent an industry icon. To pull off a comeback that will be studied in business schools for generations to come. To create new technologies and deploy them at scale to change the world for the better," Tan said. "It’s going to be hard. It will require painful decisions. But we will make them knowing it’s what we must do to serve our customers better as we build a new Intel for the future – and I have great confidence in the power of our team and our people to make it happen."

Izvor: Tom's Hardware

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Intel's biggest foundry customer is Intel itself — fueled by "Intel 7" node

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Intel just reported its Q1 revenue results, and there are interesting tidbits to dissect from the earnings call. Interestingly, Intel Foundry, long touted for a comeback, is generating most of its revenue from one customer and not the latest node. Intel's biggest customer is actually itself, with the predominant usage of the "Intel 7" node, which is Intel's version of 10 nm SuperFin node designed for "Alder Lake" and "Raptor Lake" consumer CPU generations, and "Sapphire Rapids" Xeon server generation. As Intel ramps up its 18A node production and external clients are getting their ASICs designs tested, the 18A is still not the major revenue driver of the Intel Foundry division. However, the demand for Intel 7 node is driven by the massive uptick in orders for Intel's 13th and 14th generation Raptor Lake processors. Tan on Thursday gave glimpses of his plans to reanimate Intel's culture of innovation by focusing on core engineering, stripping away unnecessary administrative work and cutting workforce. Tan did not provide much detail on how he will restore Intel's leadership position in manufacturing, nor on his plans to attract more external customers to the company's foundry. Tan remains focused on the contract manufacturing business and has recently met rival TSMC's CEO to discuss how the two companies could collaborate.

Izvor: TechPowerUp

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“No Quick Fixes” as Intel losses and restructurings continue

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Intel’s new chief executive officer, Lip-Bu Tan, has his work cut out for him, just like his predecessor, Pat Gelsinger, did several years ago. And given the even worse state that Intel is in – generating less cash on lower sales and therefore making it that much harder to raise cash to invest in the foundry that can make better chips in the future – Tan is in a might tighter spot than Gelsinger ever was. That said, the situation with Intel right now is not pretty, even if it will improve financially with layoffs and a flattening of the hierarchy of the company that Tan is now imposing and that could result in as much as 20 percent of the company being laid off on top of the 15 percent that have already been let go.

By the time Intel fixes this, half of the world’s CPUs will be homegrown arm chips being manufactured by the hyperscalers and cloud builders, and the remaining half could be split evenly between Intel and AMD. A decade ago, Intel had north of 97 percent revenue share for server CPUs. And it really does not have an AI accelerator that it can afford to make in volume and sell at a competitive price that customers want to buy, after two such attempts so far: the “Knights” family of many-core HPC processors from a decade ago and what we will call the Xe family of GPUs that have been installed in the “Aurora” supercomputer at Argonne National Laboratory and pretty much nowhere else. The latter was supposed to be converged with the “Gaudi” family of AI accelerators about now with “Falcon Shores” devices, and now the future is being pinned by an as-yet undefined “Jaguar Shores” accelerator further out in the future.

Izvor: The Next Platform

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Intel Foundry Roadmap Update - New 18A-PT variant that enables 3D die stacking, 14A process node enablement

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Intel's new CEO Lip Bu-Tan took to the stage at the company's Intel Foundry Direct 2025 event here in San Jose, California, to outline the company's progress on its foundry initiative. Tan announced that the company is now engaging lead customers for its upcoming 14A process node (1.4nm equivalent), the follow-on generation of its 18A process node. Intel already has several customers with plans to tape out 14A test chips, which now come with an enhanced version of the company's backside power delivery technology dubbed PowerDirect. Tan also revealed that the company's crucial 18A node is now in risk production with volume manufacturing on schedule for later this year.

Intel also revealed that its new 18A-P extension, a high-performance variant of the 18A node, is now running through the fab with early wafers. Additionally, the company is developing a new 18A-PT variant that supports Foveros Direct 3D with hybrid bonding interconnects, enabling the company to stack dies vertically on top of its most advanced leading-edge node. The Foveros Direct 3D technology is a key development because it provides a capability that rival TSMC already uses in production, most famously in AMD's 3D V-Cache products. In fact, Intel's implementation matches TSMC's offering in critical interconnect density measurements.

Izvor: Tom's Hardware

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Intel has limited customer commitments for latest chip manufacturing tech, CFO says

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The volume of processors Intel is set to produce for external customers using its upcoming manufacturing technology is currently "not significant", finance chief David Zinsner said on Tuesday. Committed volumes, or the amount of external customers' chips set to be produced by Intel using upcoming manufacturing tech, is presently not significant, Zinsner said at J.P. Morgan's Global Technology, Media and Communications conference being held in Boston, Massachusetts. Santa Clara, California-based Intel is striving to become a contract manufacturer of chips, but has struggled to progress with its 18A and latest 14A chip manufacturing technologies. However, last month the company said several customers planned to build test chips for the forthcoming process. "We get test chips, and then some customers fall out of the test chips... So committed volume is not significant right now, for sure," Zinsner said. The contract manufacturing unit, called foundry, is on track to break-even sometime in 2027 and would require external customers to generate low to mid-single digit billions in revenue to achieve that, Zinsner added.

Izvor: Reuters

The Exiled · 21.05.2025., 11:25

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Intel explores sale of networking and edge unit

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Intel has considered divesting its network and edge businesses as the chipmaker looks to shave off parts of the company its new chief executive does not see as crucial.
Talks about the potential sale of the group, once called NEX in Intel’s financial results, are a part of CEO Lip-Bu Tan’s strategy to focus its tens of thousands of employees on areas in which it has historically thrived: PC and data center chips. "That’s something we’re going to expand and build on," Tan told executives in Taipei on Monday at a celebration of Intel’s 40th year, adding that the firm had a share of about 68% of the PC chip market and 55% of that for data centers.

Intel has considered when and how to exit its NEX group and engaged third parties who may be interested in a deal. But it has not yet launched a formal deal process for the NEX unit, or solicited bidders. The company interviewed investment bankers to select an adviser for the sales process in recent weeks. But Intel has not yet hired a banker. Intel is exploring the idea of a sale because the businesses in its former NEX group no longer appear as relevant to the focus Tan has adopted for the company. The unit which makes chips for telecom equipment will no longer help Intel’s core strategy.

Intel’s networking business too may be sold, because companies such as Broadcom have a tight grip on crucial portions of that market. Intel has discussed the portfolio of businesses with the general aim of deciding if it would make strategic sense to partner with another company or sell a stake in it. The discussions within Intel are at an early stage and the company could decide to make other arrangements besides a sale for the NEX businesses. In the year's first quarter, Intel moved the NEX financial results into its data center and PC groups and now does not report the segment separately. The NEX group generated revenue of $5.8 billion in 2024, securities filings show.

Though Tan has told investors Intel plans to focus efforts on core operations that have historically been its largest revenue generators, the company has suffered significant losses in its share in the data center and PC areas. AMD Ryzen CPU market share up to 34%, EPYC server share at 39% by Mercury Research.

Izvor: Reuters

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Intel Core Ultra "Panther Lake" processor hands-on and up close at Computex 2025

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Intel at the 2025 Computex showed off its next-generation Core Ultra Series 3 processor, codenamed "Panther Lake." The mobile H-segment version of the chip comes with a slender rectangular package similar to "Arrow Lake-H" and "Meteor Lake." It is a tile-based disaggregated processor, but comes in a unique arrangement of tiles we haven't seen with the past two generations. The chip is dominated by two large tiles, one is very likely the Graphics + SoC tile, the smaller of the two being the Compute tile with the CPU cores, and the slender rectangular tiles being related to I/O. As for IP, "Panther Lake" introduces a new generation iGPU powered by the Xe3 "Celestial" graphics architecture.

The CPU complex consists of "Cougar Cove" P-cores, and "Darkmont" E-cores, both of which are expected to provide generational IPC improvements over the current "Lion Cove" and "Skymont." At Computex, we not only got to go hands-on with the mobile packages of "Panther Lake," but also see the chip in action, installed on a testing and platform validation system. The engineering goal with "Panther Lake," Intel says, is to offer efficiency similar to "Lunar Lake," but with performance generationally exceeding "Arrow Lake-H." The Compute tile is expected to be built on the new Intel 18A foundry node. Intel says "Panther Lake" is on track for mass-production in the second half of 2025, with the first consumer products expected at CES 2026.

Izvor: TechPowerUp

Sinac · 21.05.2025., 14:21

Koliko vidim, skraćena verzija Intelovih planova i svega navedenog je puno filozofiranja oko stvari koje su već sada cca godinu dana u zaostatku prema drugim igračima.

https://www.digitimes.com/news/a2025...atek-data.html

The Exiled · 21.05.2025., 14:26

Da i dalje je samo puno priče oko nečega kaj bi trebalo stići na tržište u Intelovoj realizaciji, dok su realno u zaostatku nekoliko godina za svima u svakom pogledu.

Sinac · 21.05.2025., 14:38

Sad će tek doći njihov Tick-Tock model razvoja na naplatu. Koliko spominju restrukturiranja i gašenja segmenata, zaključio bih da im direktorske fotelje stoje na nizbrdici prema izlazu iz sobe.

Dottore · 21.05.2025., 14:41

Ako krenu prodaja mrežnih odjela, ne bude dobro za wifi i LAN za nas koju koristimo.

The Exiled · 21.05.2025., 14:41

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Autor Dottore

Ako krenu prodaja mrežnih odjela, ne bude dobro za wifi i LAN za nas koju koristimo.

Iskreno, lako za to, već bude netko preuzel ko i sve ostalo kaj su dosad rasprodali, ali lagano im s vremenom ponestaje i tog materijala za prodaju.

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Autor Sinac

Sad će tek doći njihov Tick-Tock model razvoja na naplatu. Koliko spominju restrukturiranja i gašenja segmenata, zaključio bih da im direktorske fotelje stoje na nizbrdici prema izlazu iz sobe.

I to kaj veliš, a posebice kad stručLJak zvan Daniel Nenni opet i po ko zna koji put sastavlja analize kak je to bilo u slučaju Pata Gelsingera.

Naravno, sve se provelo po planu i programu, prijašnjeg direktora još nisu prežalili, dok bude za ovog novog dobro, ako ostane do 2027. kad bi po njemu trebali postati profitabilni.

Sinac · 27.05.2025., 08:00

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Autor The Exiled

I to kaj veliš, a posebice kad stručLJak zvan Daniel Nenni opet i po ko zna koji put sastavlja analize kak je to bilo u slučaju Pata Gelsingera.

Naravno, sve se provelo po planu i programu, prijašnjeg direktora još nisu prežalili, dok bude za ovog novog dobro, ako ostane do 2027. kad bi po njemu trebali postati profitabilni.

Pročitao sam ovo Danielovo filozofiranje odmah kad si ga i linkao, no sad ga po četvrti puta čitam i dođe mi da se zapitam koju travu puše tamo u Intelu ili troše nešto jače jer mi sve izgleda kao da su izgubili doticaj s realnošću. Ako očekuju da ih Trump financira iduće 2-3 godine, prešli su se jer će i Trumpu dop1zd1ti ovakav optimizam i smirenost na kojoj bi i Dalaj-Lama pozavidio dok im svima gori pod nogama.

Tajl3r · 27.05.2025., 14:36

Nemaju rješenje i proizvod da skine ryzen i ovo šta vrte iz šupljeg u prazno priču je samo njihov posao pa se ne treba čudit ,sve skupa je to jadno i tužno za nas kranje kupce di nemamo druge opcije .

Poslano sa mog SM-S918B koristeći Tapatalk

The Exiled · 27.05.2025., 17:37

IMHO još bi bilo i dobro da im je samo AMD konkurencija, ali u posljednjih deset godina Intel su okružili svi živi, dok istovremeno nemaju ništa konkretno za pokazati, bilo da je u pitanju odgovor na AMD, ARM, nVidiju ili TSMC. Direktori im se samo rotiraju s tim praznim frazama i PowerPoint prezentacijama, ovaj Daniel Nenni očito ima neke žešće nofce uložene u Intel, pa su mu sve "analize" u tom stilu, a sve skupa ni vrit, ni mimo. Na sav glas pričaju o superiornom 18A procesu i onima koji slijede kao da je to skroz gotova stvar, nema ništa bolje, ovo-ono, a onda odu kod TSMC-a i pretplate se na prednarudžbe njihovog 2nm izdanja, tak da kasnije lakše puste brigu na veselje.

The Exiled · 04.06.2025., 18:24

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Intel "Nova Lake-S" CPU to combine Xe3 and Xe4 IPs for graphics and media

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Intel's "Nova Lake-S" desktop processors are getting the finishing touches, with a likely arrival scheduled for the second half of 2026. As the successor to "Arrow Lake Refresh," Nova Lake-S introduces a modular design that separates graphics and media functions across distinct tiles. This approach builds on experience from "Meteor Lake," which splits its graphics engine from its media and display units onto separate chiplets. For Nova Lake-S, Intel plans to employ two different GPU architectures: Xe3 "Celestial" for graphics rendering and Xe4 "Druid" for media and display duties, all within a single package. Celestial will manage primary 3D rendering and gaming workloads, while Druid will handle display pipelines and hardware-accelerated video encoding and decoding. By utilizing a more advanced process node, such as TSMC's 2nm, Intel can optimize media engine performance without increasing costs for the entire GPU subsystem.

On the CPU side, Nova Lake-S is expected to span four primary SKU tiers. The flagship model could feature 52 cores (16 P-cores, 32 E-cores, and four LPE-cores). A 28-core version may target high-end laptops and desktops with eight P-cores, 16 E-cores, and four low-power E-cores. A 16-core variant could serve both the lower-power desktop and laptop segments, featuring four P-cores, eight E-cores, and four low-power E-cores. Finally, an 8-core entry-level part offers four P-cores and four low-power E-cores. Although it remains uncertain whether all SKUs will combine both Xe3 and Xe4 tiles, Intel's tile-based strategy makes it straightforward to mix and match GPU configurations for different market segments. Rumors also suggest that Intel may use its 18A node alongside TSMC's advanced processes for various tile elements. As Panther Lake mobile parts approach the second half of 2025 and Arrow Lake Refresh prepares for its desktop release, Nova Lake-S is the pinnacle of Intel's advanced chip packaging.

Izvor: TechPowerUp

Sinac · 05.06.2025., 13:44

Jel to sad ispada da ni E jezgre nisu dovoljno štedljive kad uvode LPE?

Ono, znam da su sad naštancali brdo E jezgri unutar CPU-a, ali zar baš moraju ići ciclati na komade i komadiće? Za ovo mi se čini da će barem 2-3 verzije BIOS-a morati izdavati da riješe probleme sa sporom aktivacijom ostalih jezgri pri većem opterećenju, tako da predviđam za prvu generaciju da će biti "prvi mačići se u vodu bacaju".

The Exiled · 05.06.2025., 23:56

Iskreno, oni sami više ne znaju kaj rade i čemu točno sve te najave služe, jer evo i opet s novim direktorom plove istim kursom.

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Intel draws a line in the sand to boost gross margins — new products must deliver 50% gross profit to get the green light. Lip-Bu Tan is "laser-focused" on getting Intel back to maximizing shareholder value. Intel will not be entertaining any projects that do not promise to double its money going forward. To accomplish this, Tan is also said to be investigating and potentially cancelling or changing unprofitable deals with other companies.

Uopće nema sumnje da će dodatno šparne učinkovite jezgre uvelike pomoći u ostvarivanju zacrtanih ciljeva Intelovog novog vodstva.

The Exiled · 14.06.2025., 18:14

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Intel tells employees when to expect factory layoffs + Intel Foundry layoffs could impact 'more than 10,000' factory workers

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Intel told its factory workers this month that it will begin laying off workers in mid-July, and that “initial” cuts will conclude by the end of that month. “These decisions are extremely difficult,” the executives wrote, “but they are necessary to help Intel achieve a more competitive market position and to put our company on a solid footing for the future.” Intel will start to lay off its fab personnel at its Silicon Forest campus in Oregon from the middle of July. The first round will conclude by the end of that month, but the company may perform another round of layoffs if it deems necessary. An internal message sent to employees at Intel's production facilities outlined that the company is restructuring its Intel Foundry manufacturing group to make it more focused on engineering and technical roles (i.e., cutting middle management). While no exact figures were provided, the communication acknowledged the seriousness of the decision and claimed it as a necessary step to improve the company's financial position.

Intel did not announce how many positions it plans to cut at Intel Foundry. However, people from other divisions indicated to Oregon Live that they expect similar reductions, though each unit would be allowed to manage the process independently as long as they meet specific cost-reduction targets. The most critical roles, such as engineers who develop and maintain cutting-edge process technologies, and high-skill technicians who manage complex equipment like EUV and High-NA EUV lithography systems, are essential to fab operations and unlikely to be affected by layoffs without risking delays in technology development or production uptime. However, Intel may reduce headcount among roles that have become more redundant due to automation or operational streamlining. These include fab operators, administrative staff, logistics personnel, and lower-skill technicians in highly automated areas.

On the one hand, by targeting non-core functions and consolidating support roles, Intel can cut costs while preserving the technical expertise needed to keep its most advanced manufacturing lines running. On the other hand, cutting lower-skilled personnel may reduce operational flexibility, slow response times during equipment issues, and increase workload for remaining employees. Keeping in mind that these fabs run 24/7, even small delays in maintenance or logistics can lead to costly downtime. Nonetheless, it looks like for Intel, desperate times call for desperate measures.

Izvor: The Oregonian i Tom's Hardware

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Intel "Nova Lake‑S" Series: Seven SKUs, Up to 52 Cores and 150 W TDP

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Expected to arrive in the second half of 2026, Nova Lake‑S will offer configurations ranging from mainstream quad‑core models to a flagship with 52 cores. Initial information suggests that Intel will employ a tile-based design, separating LPE cores from P-Cores and E-Cores to optimize flexibility and yield. At the top of the lineup is the rumored Core Ultra 9 model, possibly designated 385K. It will combine 16 P-cores, 32 E-cores, and four LPE-cores for a total of 52 cores, as previously rumored. With a TDP of 150 W, it will be the most powerful SKU Intel prepared for this generation. Below the flagship, Intel appears to be planning a Core Ultra 7 SKU with 14 P-cores, 24 E-cores, and four LPE cores, totaling 42 cores.
The Core Ultra 5 series may include three variants: a 28-core version with eight P-cores, 16 E-cores, and four LPE-cores; a 24-core version with eight P-cores, 12 E-cores, and four LPE-cores; and an 18-core model with six P-cores, eight E-cores, and four LPE-cores. Entry-level Core Ultra 3 parts would feature either a 16-core configuration with four P-cores, eight E-cores, and four LPE-cores, or a 12-core option with four P-cores, four E-cores, and four LPE-cores, both targeting a 65 W power envelope. All desktop SKUs are expected to feature four LPE cores on a separate die, suggesting a multi-tile package similar to Meteor Lake. Power demands will range from 65 W in entry-level segments to 150 W for high-end parts. Intel is reportedly preparing a new LGA 1954 socket even as it readies an Arrow Lake-S refresh for late 2025. Intel has also reportedly designated Xe3 "Celestial" for graphics rendering and Xe4 "Druid" for media and display duties.

Izvor: TechPowerUp

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Intel showcases 18A node performance: 25% faster and 40% lower power draw

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Intel's presentation at the VLSI Symposium in Japan offered a detailed look at the upcoming Intel 18A process, which is set to enter mass production in the second half of 2025. This node combines Gate-All-Around transistors with the PowerVia backside power delivery network, resulting in a completely new metal stack architecture. By routing power through the rear of the die, Intel has been able to tighten interconnect pitches on critical layers while relaxing spacing on the top layer, improving yield and simplifying fabrication. In standardized power, performance, and area tests on an Arm core sub-block, Intel 18A demonstrated roughly 15% higher performance at the same power draw compared to Intel 3. When operating at 1.1 volts, clock speeds increase by up to 25% without incurring additional energy costs, and at around 0.75 volts, performance can rise by 18%, or power consumption can drop by nearly 40%.

Under the hood, the process features significant cell height reductions: performance‑tuned cells measure 180 nanometers tall, while high‑density designs sit at 160 nanometers, both smaller than their predecessors. The front‑side metal layers have been reduced from between 12 and 19 on Intel 3 to between 11 and 16 on Intel 18A, with three additional rear metal layers added for PowerVia support. Pitches on layers M1 through M10 have been tightened from as much as 60 nanometers down to 32 nanometers before easing again in the upper layers. Low-NA EUV exposure is used on layers M0 through M4, cutting the number of masks required by 44% and simplifying the manufacturing flow. Intel plans to debut 18A in its low‑power "Panther Lake" compute chiplet and the efficiency‑core‑only Clearwater Forest Xeon 7 family. A cost-optimized 17-layer variant, a balanced 21-layer option, and a performance-focused 22-layer configuration will address different market segments.

Izvor: TechPowerUp

Intel 18A proces na papiru izgleda odlično, posebice u usporedbi s planiranim otkazima za ~10.000 ljudi iz toliko im bitnih proizvodnih pogona nikad važnije domaće proizvodnje, ali sva sreća, pa se ljudi iz proizvodnih pogona ne bave nečim važnim, dok se istovremeno slaže opet nova garnitura raznih direktorskih pozicija.

21.05.2025., 14:26	#6214
The Exiled McG Moj komp Datum registracije: Feb 2014 Lokacija: Varaždin Postovi: 8,000	Da i dalje je samo puno priče oko nečega kaj bi trebalo stići na tržište u Intelovoj realizaciji, dok su realno u zaostatku nekoliko godina za svima u svakom pogledu. __________________ AMD Ryzen 9 9950X \| Noctua NH-U12A chromax.black \| MSI MAG B650 Tomahawk Wi-Fi \| 128GB Kingston FURY Beast DDR5-5200 \| 256GB AData SX8200 Pro NVMe \| 2x4TB WD Red Plus \| Fractal Define 7 Compact \| Seasonic GX-750 AMD Ryzen 5 7600 \| Noctua NH-U12A chromax.black \| MSI MAG B650 Tomahawk Wi-Fi \| 128GB Kingston FURY Beast DDR5-5200 \| 256GB AData SX8200 Pro NVMe \| 2x12TB WD Red Plus \| Fractal Define 7 Compact \| eVGA 650 B5

21.05.2025., 14:41	#6216
Dottore Extrema Thule Moj komp Datum registracije: Feb 2005 Lokacija: 「 ✖ ✖ ✖ 」 Postovi: 7,582	Ako krenu prodaja mrežnih odjela, ne bude dobro za wifi i LAN za nas koju koristimo. __________________

27.05.2025., 17:37	#6220
The Exiled McG Moj komp Datum registracije: Feb 2014 Lokacija: Varaždin Postovi: 8,000	IMHO još bi bilo i dobro da im je samo AMD konkurencija, ali u posljednjih deset godina Intel su okružili svi živi, dok istovremeno nemaju ništa konkretno za pokazati, bilo da je u pitanju odgovor na AMD, ARM, nVidiju ili TSMC. Direktori im se samo rotiraju s tim praznim frazama i PowerPoint prezentacijama, ovaj Daniel Nenni očito ima neke žešće nofce uložene u Intel, pa su mu sve "analize" u tom stilu, a sve skupa ni vrit, ni mimo. Na sav glas pričaju o superiornom 18A procesu i onima koji slijede kao da je to skroz gotova stvar, nema ništa bolje, ovo-ono, a onda odu kod TSMC-a i pretplate se na prednarudžbe njihovog 2nm izdanja, tak da kasnije lakše puste brigu na veselje. __________________ AMD Ryzen 9 9950X \| Noctua NH-U12A chromax.black \| MSI MAG B650 Tomahawk Wi-Fi \| 128GB Kingston FURY Beast DDR5-5200 \| 256GB AData SX8200 Pro NVMe \| 2x4TB WD Red Plus \| Fractal Define 7 Compact \| Seasonic GX-750 AMD Ryzen 5 7600 \| Noctua NH-U12A chromax.black \| MSI MAG B650 Tomahawk Wi-Fi \| 128GB Kingston FURY Beast DDR5-5200 \| 256GB AData SX8200 Pro NVMe \| 2x12TB WD Red Plus \| Fractal Define 7 Compact \| eVGA 650 B5

21.05.2025., 14:21	#6213
Sinac ...samo te gledam... Moj komp Datum registracije: Mar 2007 Lokacija: Zagreb Postovi: 2,804	Koliko vidim, skraćena verzija Intelovih planova i svega navedenog je puno filozofiranja oko stvari koje su već sada cca godinu dana u zaostatku prema drugim igračima. https://www.digitimes.com/news/a2025...atek-data.html

21.05.2025., 14:38	#6215
Sinac ...samo te gledam... Moj komp Datum registracije: Mar 2007 Lokacija: Zagreb Postovi: 2,804	Sad će tek doći njihov Tick-Tock model razvoja na naplatu. Koliko spominju restrukturiranja i gašenja segmenata, zaključio bih da im direktorske fotelje stoje na nizbrdici prema izlazu iz sobe.

27.05.2025., 14:36	#6219
Tajl3r Dobro je sve. Moj komp Datum registracije: Sep 2012 Lokacija: 00001 Postovi: 2,405	Nemaju rješenje i proizvod da skine ryzen i ovo šta vrte iz šupljeg u prazno priču je samo njihov posao pa se ne treba čudit ,sve skupa je to jadno i tužno za nas kranje kupce di nemamo druge opcije . Poslano sa mog SM-S918B koristeći Tapatalk

05.06.2025., 13:44	#6222
Sinac ...samo te gledam... Moj komp Datum registracije: Mar 2007 Lokacija: Zagreb Postovi: 2,804	Jel to sad ispada da ni E jezgre nisu dovoljno štedljive kad uvode LPE? Ono, znam da su sad naštancali brdo E jezgri unutar CPU-a, ali zar baš moraju ići ciclati na komade i komadiće? Za ovo mi se čini da će barem 2-3 verzije BIOS-a morati izdavati da riješe probleme sa sporom aktivacijom ostalih jezgri pri većem opterećenju, tako da predviđam za prvu generaciju da će biti "prvi mačići se u vodu bacaju".