Najgore je kaj se i dalje ponašaju kao da je još uvijek 2006., pa sljedeći tjedan izbacuju Conroe koji će pomesti sve pred sobom, ali ovaj put na 18A procesu.

I ove tragikomedije s opet novim socketom i čipsetom dodatno podižu povjerenje u nadolazeću platformu, koja vrlo lako može ispasti i završiti isto ko i Arrow Lake.

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Intel details next-gen 18A fab tech: significantly more performance, lower power, higher density:kafa: Citiraj: Intel is set to detail (PDF) the advantages of its 18A manufacturing technology (1.8nm-class) compared to its Intel 3 fabrication process at the upcoming VLSI Symposium 2025. As expected, the new production node will offer substantial benefits across power, performance, and area (PPA) metrics, thus providing tangible advantages both for client and data center products. Intel claims that its 18A fabrication process delivers 25% more performance at the same voltage (1.1V) and complexity, as well as 36% lower power at the same frequency and voltage of 1.1V for a standard Arm core sub-block compared to the same block fabricated on Intel 3 process technology. At a lower voltage (0.75V), Intel 18A provides 18% higher performance and 38% lower power. In addition, 18A consistently achieves 0.72X area scaling compared to Intel 3. Intel's 18A manufacturing technology is the company's first node to rely on gate-all-around (GAA) RibbonFET transistors and feature PowerVia backside power delivery network (BSPDN), two features that enable major PPA advantages. Intel is reportedly on track to start high-volume manufacturing of compute chiplets for its codenamed Panther Lake processors for client PCs later this year and then chiplets for Clearwater Forest data center systems in early 2026. In addition, the company is on track to tape out the first third-party designs on 18A in mid-2025. Izvor: Tom's Hardware

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Intel's "Nova Lake" processors reportedly slated for TSMC's 2nm node:fiju: Citiraj: TSMC is pushing forward its plans to make 2 nm process chips in large quantities in the second half of the year, with major customer developments coming to light. After AMD placed its order, reports suggest Intel has also become one of TSMC's first 2 nm customers aiming to use this cutting-edge technology for its next-gen desktop processors. Intel, already a big TSMC customer for advanced processes sent out key compute tiles for its Core Ultra processors to TSMC using different processes like N3B, N5P, and N6. To be exact, these were Intel Core Ultra 200V "Lunar Lake" series laptop processors and Core Ultra 200S "Arrow Lake" series. While both companies didn't comment on the latest news, industry talk hints that they're cooperating on Intel's upcoming Nova Lake desktop processor set to launch next year (rumors suggest that it could be the Compute Tile). With the codename "NVL-S" Nova Lake combines two groups of eight high-performance "Coyote Cove" P-cores with 16 "Arctic Wolf" E-cores. It also includes four ultra-low-power LPE cores in a separate SoC tile. It is expected that Nova Lake-S will use LGA 1954, which has 1,954 active lands and might have more than 2,000 total pads when you count debug pins. TSMC's work on 2 nm technology is moving forward as expected. The company uses first-generation nanochip transistor technology to boost performance and reduce power consumption across process nodes with big clients finishing designing silicon IPs and starting validation steps. AMD shared that its next EPYC "Venice" chip will be the first high-performance computing processor to use TSMC's 2 nm process. AMD validated it at TSMC's Arizona plant and is on track to launch it in 2026. Also, word has it that Apple's future iPhone 18 lineup will have its A20 chip made with the same TSMC 2 nm process. Izvor: TechPowerUp

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Intel to announce a 20% workforce cut this week:hitthewal: Citiraj: Intel is preparing to announce plans to cut over 20% of its workforce this week in an attempt to reduce costs and cut down bureaucracy at the chipmaker, reports Bloomberg citing a source with knowledge of the matter. The move to eliminate over 20,000 positions from Intel is a part of the company's revival plan designed by chief executive Lip-Bu Tan. The restructuring aims to simplify operations and refocus the company on engineering drive culture after prolonged business challenges, according to the report. Lip-Bu Tan, who took leadership of the company last month, is pushing to purge excessive layers of management, eliminate redundant positions, and shift Intel back toward a product-focused approach while concentrating on key projects. This round of layoffs follows a previous reduction of approximately 15,000 positions announced in August 2024. The reductions primarily affected non-engineering roles, including administrative staff, sales, marketing, and support functions. Manufacturing roles and key engineering teams were largely preserved during this round (according to media reports), as Intel pins a lot of hopes on its foundry ambitions and needs to develop competitive products. For now, it is unclear which positions will be cut this time. Intel had 108,900 employees as of December 28, 2024 (which included several thousands of Altera employees who are now employed by an independent company co-owned by Intel and Silver Lake), so the plan includes eliminating over 20,000 positions, a number that exceeds all mid-tier management positions at the company. It is unclear whether this time the company will cut the number of engineers and projects that they are working on, though this looks like a likely scenario. Intel's quarterly results will offer the clearest look yet at new CEO Lip-Bu Tan's turnaround strategy for the embattled American chipmaker, and investors are hoping for early signs that he is reversing years of strategic lapses. The company is set to post its fourth consecutive quarterly revenue drop on Thursday. Izvor: Tom's Hardware

Citiraj:

Intel CEO announces layoffs, restructuring, $1.5 billion in cost reductions, expanded return to office mandate:nono: Citiraj: Intel CEO Lip Bu-Tan announced a series of sweeping measures today, including an unspecified number of layoffs, a company restructuring, the elimination of non-core products, and a return-to-office mandate, as the company presented its first-quarter earnings report. Tan has only been at the helm of Intel for five weeks, but his core message is that the transformation of Intel's culture will be an extended process and requires eliminating the "bureaucracy suffocating the innovation and agility that we need to win." Intel has not yet specified the number of employees it expects to lay off in the coming months, but did say the company will begin the adjustments in Q2 and will do so over several months. Intel last laid off 15% of its workforce, approximately 15,000 employees, in August 2024. It has been rumored that Intel plans to lay off 20% of its workforce in this round, which could equate to nearly 20,000 more employees. Intel is also reducing its operating expense target by $1.5 billion over the next two years. Intel will reduce its operating expenses to $17 billion in 2025, a $ 500 million cut, and aim for $16 billion in 2026, a further $1 billion reduction. Tan restructured the upper echelon of the management team late last week, but Tan says he will continue to eliminate more layers of the management structure, noting that "many teams are eight or more layers deep, which creates unnecessary bureaucracy that slows us down." He also noted that one of the key KPIs for managers at Intel has been the size of their team, but he will eliminate that strategy, instead focusing on creating a leaner and more efficient structure. Tan also noted that the current policy, which requires employees to be on site for three days per week, has not been followed consistently. The company will now require all employees to be in the office for four days per week, effective September 1. The focus on efficiency will also extend to significantly reducing internal administrative work, including eliminating unnecessary meetings and attendees. While Tan has only shared the broad outlines of his plans, they are expansive. "I’m talking about the opportunity to fundamentally reinvent an industry icon. To pull off a comeback that will be studied in business schools for generations to come. To create new technologies and deploy them at scale to change the world for the better," Tan said. "It’s going to be hard. It will require painful decisions. But we will make them knowing it’s what we must do to serve our customers better as we build a new Intel for the future – and I have great confidence in the power of our team and our people to make it happen." Izvor: Tom's Hardware

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Intel's biggest foundry customer is Intel itself — fueled by "Intel 7" node:rtfm: Citiraj: Intel just reported its Q1 revenue results, and there are interesting tidbits to dissect from the earnings call. Interestingly, Intel Foundry, long touted for a comeback, is generating most of its revenue from one customer and not the latest node. Intel's biggest customer is actually itself, with the predominant usage of the "Intel 7" node, which is Intel's version of 10 nm SuperFin node designed for "Alder Lake" and "Raptor Lake" consumer CPU generations, and "Sapphire Rapids" Xeon server generation. As Intel ramps up its 18A node production and external clients are getting their ASICs designs tested, the 18A is still not the major revenue driver of the Intel Foundry division. However, the demand for Intel 7 node is driven by the massive uptick in orders for Intel's 13th and 14th generation Raptor Lake processors. Tan on Thursday gave glimpses of his plans to reanimate Intel's culture of innovation by focusing on core engineering, stripping away unnecessary administrative work and cutting workforce. Tan did not provide much detail on how he will restore Intel's leadership position in manufacturing, nor on his plans to attract more external customers to the company's foundry. Tan remains focused on the contract manufacturing business and has recently met rival TSMC's CEO to discuss how the two companies could collaborate. Izvor: TechPowerUp

Citiraj:

“No Quick Fixes” as Intel losses and restructurings continue:pirate: Citiraj: Intel’s new chief executive officer, Lip-Bu Tan, has his work cut out for him, just like his predecessor, Pat Gelsinger, did several years ago. And given the even worse state that Intel is in – generating less cash on lower sales and therefore making it that much harder to raise cash to invest in the foundry that can make better chips in the future – Tan is in a might tighter spot than Gelsinger ever was. That said, the situation with Intel right now is not pretty, even if it will improve financially with layoffs and a flattening of the hierarchy of the company that Tan is now imposing and that could result in as much as 20 percent of the company being laid off on top of the 15 percent that have already been let go. By the time Intel fixes this, half of the world’s CPUs will be homegrown arm chips being manufactured by the hyperscalers and cloud builders, and the remaining half could be split evenly between Intel and AMD. A decade ago, Intel had north of 97 percent revenue share for server CPUs. And it really does not have an AI accelerator that it can afford to make in volume and sell at a competitive price that customers want to buy, after two such attempts so far: the “Knights” family of many-core HPC processors from a decade ago and what we will call the Xe family of GPUs that have been installed in the “Aurora” supercomputer at Argonne National Laboratory and pretty much nowhere else. The latter was supposed to be converged with the “Gaudi” family of AI accelerators about now with “Falcon Shores” devices, and now the future is being pinned by an as-yet undefined “Jaguar Shores” accelerator further out in the future. Izvor: The Next Platform

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Intel Foundry Roadmap Update - New 18A-PT variant that enables 3D die stacking, 14A process node enablement:sweating: Citiraj: Intel's new CEO Lip Bu-Tan took to the stage at the company's Intel Foundry Direct 2025 event here in San Jose, California, to outline the company's progress on its foundry initiative. Tan announced that the company is now engaging lead customers for its upcoming 14A process node (1.4nm equivalent), the follow-on generation of its 18A process node. Intel already has several customers with plans to tape out 14A test chips, which now come with an enhanced version of the company's backside power delivery technology dubbed PowerDirect. Tan also revealed that the company's crucial 18A node is now in risk production with volume manufacturing on schedule for later this year. Intel also revealed that its new 18A-P extension, a high-performance variant of the 18A node, is now running through the fab with early wafers. Additionally, the company is developing a new 18A-PT variant that supports Foveros Direct 3D with hybrid bonding interconnects, enabling the company to stack dies vertically on top of its most advanced leading-edge node. The Foveros Direct 3D technology is a key development because it provides a capability that rival TSMC already uses in production, most famously in AMD's 3D V-Cache products. In fact, Intel's implementation matches TSMC's offering in critical interconnect density measurements. Izvor: Tom's Hardware

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Intel has limited customer commitments for latest chip manufacturing tech, CFO says:stoopid: Citiraj: The volume of processors Intel is set to produce for external customers using its upcoming manufacturing technology is currently "not significant", finance chief David Zinsner said on Tuesday. Committed volumes, or the amount of external customers' chips set to be produced by Intel using upcoming manufacturing tech, is presently not significant, Zinsner said at J.P. Morgan's Global Technology, Media and Communications conference being held in Boston, Massachusetts. Santa Clara, California-based Intel is striving to become a contract manufacturer of chips, but has struggled to progress with its 18A and latest 14A chip manufacturing technologies. However, last month the company said several customers planned to build test chips for the forthcoming process. "We get test chips, and then some customers fall out of the test chips... So committed volume is not significant right now, for sure," Zinsner said. The contract manufacturing unit, called foundry, is on track to break-even sometime in 2027 and would require external customers to generate low to mid-single digit billions in revenue to achieve that, Zinsner added. Izvor: Reuters

Koliko vidim, skraćena verzija Intelovih planova i svega navedenog je puno filozofiranja oko stvari koje su već sada cca godinu dana u zaostatku prema drugim igračima.

https://www.digitimes.com/news/a2025...atek-data.html

Da i dalje je samo puno priče oko nečega kaj bi trebalo stići na tržište u Intelovoj realizaciji, dok su realno u zaostatku nekoliko godina za svima u svakom pogledu.

Sad će tek doći njihov Tick-Tock model razvoja na naplatu. Koliko spominju restrukturiranja i gašenja segmenata, zaključio bih da im direktorske fotelje stoje na nizbrdici prema izlazu iz sobe. :D

Ako krenu prodaja mrežnih odjela, ne bude dobro za wifi i LAN za nas koju koristimo.

Iskreno, lako za to, već bude netko preuzel ko i sve ostalo kaj su dosad rasprodali, ali lagano im s vremenom ponestaje i tog materijala za prodaju.
:):D

I to kaj veliš, a posebice kad stručLJak zvan Daniel Nenni opet i po ko zna koji put sastavlja analize kak je to bilo u slučaju Pata Gelsingera.

Naravno, sve se provelo po planu i programu, prijašnjeg direktora još nisu prežalili, dok bude za ovog novog dobro, ako ostane do 2027. kad bi po njemu trebali postati profitabilni.

Pročitao sam ovo Danielovo filozofiranje odmah kad si ga i linkao, no sad ga po četvrti puta čitam i dođe mi da se zapitam koju travu puše tamo u Intelu ili troše nešto jače jer mi sve izgleda kao da su izgubili doticaj s realnošću. Ako očekuju da ih Trump financira iduće 2-3 godine, prešli su se jer će i Trumpu dop1zd1ti ovakav optimizam i smirenost na kojoj bi i Dalaj-Lama pozavidio dok im svima gori pod nogama.

Nemaju rješenje i proizvod da skine ryzen i ovo šta vrte iz šupljeg u prazno priču je samo njihov posao pa se ne treba čudit ,sve skupa je to jadno i tužno za nas kranje kupce di nemamo druge opcije .


Poslano sa mog SM-S918B koristeći Tapatalk

IMHO još bi bilo i dobro da im je samo AMD konkurencija, ali u posljednjih deset godina Intel su okružili svi živi, dok istovremeno nemaju ništa konkretno za pokazati, bilo da je u pitanju odgovor na AMD, ARM, nVidiju ili TSMC. Direktori im se samo rotiraju s tim praznim frazama i PowerPoint prezentacijama, ovaj Daniel Nenni očito ima neke žešće nofce uložene u Intel, pa su mu sve "analize" u tom stilu, a sve skupa ni vrit, ni mimo. Na sav glas pričaju o superiornom 18A procesu i onima koji slijede kao da je to skroz gotova stvar, nema ništa bolje, ovo-ono, a onda odu kod TSMC-a i pretplate se na prednarudžbe njihovog 2nm izdanja, tak da kasnije lakše puste brigu na veselje.

Jel to sad ispada da ni E jezgre nisu dovoljno štedljive kad uvode LPE? :lol2:
Ono, znam da su sad naštancali brdo E jezgri unutar CPU-a, ali zar baš moraju ići ciclati na komade i komadiće? Za ovo mi se čini da će barem 2-3 verzije BIOS-a morati izdavati da riješe probleme sa sporom aktivacijom ostalih jezgri pri većem opterećenju, tako da predviđam za prvu generaciju da će biti "prvi mačići se u vodu bacaju".

Iskreno, oni sami više ne znaju kaj rade i čemu točno sve te najave služe, jer evo i opet s novim direktorom plove istim kursom.:)
Uopće nema sumnje da će dodatno šparne učinkovite jezgre uvelike pomoći u ostvarivanju zacrtanih ciljeva Intelovog novog vodstva.

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Intel "Nova Lake‑S" Series: Seven SKUs, Up to 52 Cores and 150 W TDP:sweating: Citiraj: Expected to arrive in the second half of 2026, Nova Lake‑S will offer configurations ranging from mainstream quad‑core models to a flagship with 52 cores. Initial information suggests that Intel will employ a tile-based design, separating LPE cores from P-Cores and E-Cores to optimize flexibility and yield. At the top of the lineup is the rumored Core Ultra 9 model, possibly designated 385K. It will combine 16 P-cores, 32 E-cores, and four LPE-cores for a total of 52 cores, as previously rumored. With a TDP of 150 W, it will be the most powerful SKU Intel prepared for this generation. Below the flagship, Intel appears to be planning a Core Ultra 7 SKU with 14 P-cores, 24 E-cores, and four LPE cores, totaling 42 cores. https://i.postimg.cc/nrvx1kLN/RUl-Oi...a-Gikr-thm.jpg The Core Ultra 5 series may include three variants: a 28-core version with eight P-cores, 16 E-cores, and four LPE-cores; a 24-core version with eight P-cores, 12 E-cores, and four LPE-cores; and an 18-core model with six P-cores, eight E-cores, and four LPE-cores. Entry-level Core Ultra 3 parts would feature either a 16-core configuration with four P-cores, eight E-cores, and four LPE-cores, or a 12-core option with four P-cores, four E-cores, and four LPE-cores, both targeting a 65 W power envelope. All desktop SKUs are expected to feature four LPE cores on a separate die, suggesting a multi-tile package similar to Meteor Lake. Power demands will range from 65 W in entry-level segments to 150 W for high-end parts. Intel is reportedly preparing a new LGA 1954 socket even as it readies an Arrow Lake-S refresh for late 2025. Intel has also reportedly designated Xe3 "Celestial" for graphics rendering and Xe4 "Druid" for media and display duties. Izvor: TechPowerUp

Citiraj:

Intel showcases 18A node performance: 25% faster and 40% lower power draw:fiju: Citiraj: Intel's presentation at the VLSI Symposium in Japan offered a detailed look at the upcoming Intel 18A process, which is set to enter mass production in the second half of 2025. This node combines Gate-All-Around transistors with the PowerVia backside power delivery network, resulting in a completely new metal stack architecture. By routing power through the rear of the die, Intel has been able to tighten interconnect pitches on critical layers while relaxing spacing on the top layer, improving yield and simplifying fabrication. In standardized power, performance, and area tests on an Arm core sub-block, Intel 18A demonstrated roughly 15% higher performance at the same power draw compared to Intel 3. When operating at 1.1 volts, clock speeds increase by up to 25% without incurring additional energy costs, and at around 0.75 volts, performance can rise by 18%, or power consumption can drop by nearly 40%. https://i.postimg.cc/LqGXy0qW/31sp-UNMZa-KZNv2-Av.jpg https://i.postimg.cc/RJLZZSPr/Intel-...LSI-2025-1.jpg https://i.postimg.cc/vcGmSnBG/Intel-...LSI-2025-6.png https://i.postimg.cc/hXyhmGKc/Td9-Ahlo-Hsw-M1-QSMe.jpg https://i.postimg.cc/mcPkyGrM/t-IWft0j-Lwxwrk-Cdh.jpg Under the hood, the process features significant cell height reductions: performance‑tuned cells measure 180 nanometers tall, while high‑density designs sit at 160 nanometers, both smaller than their predecessors. The front‑side metal layers have been reduced from between 12 and 19 on Intel 3 to between 11 and 16 on Intel 18A, with three additional rear metal layers added for PowerVia support. Pitches on layers M1 through M10 have been tightened from as much as 60 nanometers down to 32 nanometers before easing again in the upper layers. Low-NA EUV exposure is used on layers M0 through M4, cutting the number of masks required by 44% and simplifying the manufacturing flow. Intel plans to debut 18A in its low‑power "Panther Lake" compute chiplet and the efficiency‑core‑only Clearwater Forest Xeon 7 family. A cost-optimized 17-layer variant, a balanced 21-layer option, and a performance-focused 22-layer configuration will address different market segments. Izvor: TechPowerUp

Intel 18A proces na papiru izgleda odlično, posebice u usporedbi s planiranim otkazima za ~10.000 ljudi iz toliko im bitnih proizvodnih pogona nikad važnije domaće proizvodnje, ali sva sreća, pa se ljudi iz proizvodnih pogona ne bave nečim važnim, dok se istovremeno slaže opet nova garnitura raznih direktorskih pozicija.:hitthewal:

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Intel to outsource marketing to Accenture and AI, resulting in more layoffs:kafa: Citiraj: Employees at Intel's marketing division were informed that many of their roles will be handed over to Accenture, which will use AI to handle tasks traditionally done by Intel staff, reports OregonLive. The decision is part of a company-wide restructuring plan that includes job cuts, automation, and streamlining of execution. The marketing division has been one of Intel's key strengths since the company began communicating directly with end users with the launch of its "Intel Inside" campaign in 1991. However, it looks like the company will drastically cut its human-driven marketing efforts going forward, as it plans to lay off many of its marketing employees, believing that Accenture's AI will do a better job connecting Intel with customers. The number of positions affected was not disclosed, but Intel confirmed changes will significantly alter team structures, with only 'lean' teams remaining. Workers will be told by July 11 whether they will remain with the company. Among other things, the aim of the restructuring is to free up internal teams to focus on strategic, creative, and high-value projects, rather than routine functions. Therefore, Intel intends to use Accenture's AI in various aspects of marketing, including information processing, task automation, and personalized communications. Intel has acknowledged the shift to Accenture and explained that this will not only cut costs but will modernize its capabilities and strengthen its brand. How exactly the usage of AI instead of real people can reinforce the brand hasn't been explained yet. In messages to staff published by OregonLive, Intel indicated that part of the restructuring may involve existing employees training Accenture contractors by explaining how Intel's operations work. This knowledge transfer would occur during the transitional phase of the outsourcing plan, although it is unclear how long this phase will take. Izvor: The Oregonian

Citiraj:

Intel winds down automotive division, prepares for major layoffs:hitthewal: Citiraj: Intel has confirmed plans to phase out its in-house automotive chip team and lay off most of the employees in that segment. In a memo to staff on Tuesday, the company stated that it will honor existing contracts with vehicle manufacturers and suppliers but will essentially dissolve the unit that designed and marketed its small automotive platform. This move supports Intel's new strategy under new CEO Lip-Bu Tan to concentrate on client computing and data center operations. "We are refocusing on our core client and data center portfolio to strengthen our product offerings and meet the needs of our customers," the statement said. "As part of this work, we have decided to wind down the automotive business within our Client Computing Group. We are committed to ensuring a smooth transition for our customers." Officially, Intel is eliminating excessive management layers, but a CRN report indicates that the company is surprisingly laying off chip design engineers and architects. Among the job categories being eliminated are 22 physical design engineers, three physical design engineering managers, and several logic and product development engineers. The company is also removing roles such as cloud software architects and engineering managers, in addition to positions tied to business and project management, including a vice president of IT and multiple technology strategy leads. Employees in California are engaged in the development of CPU and GPU products. Intel's automotive division has never generated a major share of revenue, and the company does not report its results separately. Still, Intel highlights that over 50 million vehicles worldwide use its processors for services such as infotainment, electric vehicle management, and driver assistance. Despite that footprint, the division remains small compared with the rest of Intel's diverse chip portfolio. Importantly, the decision does not affect Mobileye, which Intel spun off and took public in 2023. Mobileye continues to operate independently, even though Intel retains nearly all of the voting shares. Intel has already informed its manufacturing staff of plans to cut up to 20% of its workforce starting in July. It will also outsource much of its marketing function to Accenture, relying on AI to manage campaigns. These actions are much needed for Intel's determination to make operations leaner and sharpen its focus on the markets where it remains strongest. Izvor: The Oregonian i Tom's Hardware

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Intel Nova Lake CPUs to feature bLLC Cache, rivaling AMD 3D V-Cache:fiju: Citiraj: Intel is working on its next generation of desktop processors called Nova Lake, which are expected to include a new cache feature named big Last Line Cache, or bLLC. This technology aims to boost gaming and multitasking performance by increasing the L3 cache size, similar to AMD’s 3D V-Cache found in their X3D processors. Two upcoming Nova Lake models will combine 8 high-performance cores with 4 low-power efficiency cores. One will have 20 extra efficiency cores, and the other 12, both operating with a 125-watt power limit. The bLLC technology already exists in Intel’s Clearwater Forest server CPUs. In those chips, the cache is embedded in a base tile underneath the core tiles, which helps improve performance without causing the heat and clock speed issues that come from stacking cache on top of cores. This design mirrors AMD’s 9000-series X3D processors, which attach their 3D V-Cache to the bottom of the CPU dies. The Nova Lake-S series is set to launch in late 2026 or early 2027 and will include at least six desktop models using a new LGA 1954 socket. The lineup will range from a high-end Core Ultra 9 485K with 52 cores and a 150-watt TDP, down to a Core Ultra 3 415K with 12 cores running at 125 watts. Out of these, two models are expected to feature the bLLC cache, which should help close the performance gap with AMD’s 3D V-Cache chips in gaming and demanding workloads. Izvor: Guru3D

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Intel Nova Lake performance leak claims 10% single and 60% multi-threaded uplift:stoopid: Citiraj: Potential Intel Nova Lake CPU performance figures are now roaming the internet, stating over 10% ST and 60% MT performance increase. it looks like Intel is aiming for greater than 10% Single-Threaded gains and over 60% multi-threaded performance with its next-gen Nova Lake-S Desktop CPUs. Now, do keep in mind that the 10% figure is for the single-threaded performance, and not IPC. The Nova Lake-S CPUs feature the latest Coyote Cove P-Cores and Arctic Wolf E-Cores, both of which are new architectures and expected to deliver big gains. According to Intel, the chips are being designated as the "Ultimate Performance and Efficiency" package with "Leadership Gaming Performance". So Nova Lake-S might just be able to tackle AMD's current Ryzen lineup, though by the time of its release, the chips will be competing with next-gen Ryzen's based on the Zen 6 core architecture. Intel is expected to launch Nova Lake in 2026. Before that, a refresh of Arrow Lake is still planned, but it may only include a few K-series models. Izvor: Wccftech

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Intel's new CEO explores big shift in chip manufacturing business:sweating: Citiraj: Intel's new chief executive is exploring a big change to its contract manufacturing business to win major customers in a potentially expensive shift from his predecessor's plans. If implemented, the new strategy for what Intel calls its "foundry" business would entail no longer marketing certain chipmaking technology, which the company had long developed, to external customers. Since taking the company's helm in March, CEO Lip-Bu Tan has moved fast to cut costs and find a new path to revive the ailing U.S. chipmaker. By June, he started voicing that a manufacturing process that prior CEO Pat Gelsinger bet heavily on, known as 18A, was losing its appeal to new customers, said the sources, who spoke on condition of anonymity. To put aside external sales of 18A and its variant 18A-P, manufacturing processes that have cost Intel billions of dollars to develop, the company would have to take a write-off. Intel declined to comment on such "hypothetical scenarios or market speculation." It said the lead customer for 18A has long been Intel itself, and it aims to ramp production of its "Panther Lake" laptop chips later in 2025, which it called the most advanced processors ever designed and manufactured in the United States. Persuading outside clients to use Intel's factories remains key to its future. As its 18A fabrication process faced delays, rival TSMC's N2 technology has been on track for production. Tan's preliminary answer to this challenge: focus more resources on 14A, a next-generation chipmaking process where Intel expects to have advantages over Taiwan's TSMC. The move is part of a play for big customers like Apple and nVidia which currently pay TSMC to manufacture their chips. Tan has tasked the company with teeing up options for discussion with Intel's board when it meets as early as this month, including whether to stop marketing 18A to new clients. The board might not reach a decision on 18A until a subsequent autumn meeting in light of the matter's complexity and the enormous money at stake. Intel declined to comment on what it called rumor. In a statement, it said: "Lip-Bu and the executive team are committed to strengthening our roadmap, building trust with our customers, and improving our financial position for the future. We have identified clear areas of focus and will take actions needed to turn the business around." Last year was Intel's first unprofitable year since 1986. It posted a net loss attributable to the company of $18.8 billion for 2024. Like Gelsinger, Tan inherited a company that had lost its manufacturing edge and fell behind on crucial technology waves of the past two decades: mobile computing and artificial intelligence. The company is targeting high-volume production later this year for 18A with its internal chips, which are widely expected to arrive ahead of external customer orders. Meanwhile, delivering 14A in time to win major contracts is by no means certain, and Intel could choose to stick with its existing plans for 18A. Intel is tailoring 14A to key clients' needs to make it successful, the company said. Shifting away from selling 18A to foundry customers would represent one of his biggest moves yet. However, according to some industry analysts, the 18A process is roughly equivalent to TSMC's so-called N3 manufacturing technology, which went into high-volume production in late 2022. If Intel follows Tan's lead, the company would focus its foundry employees, design partners and new customers on 14A, where it hopes for a better chance to compete against TSMC. Izvor: Reuters

Citiraj:

Intel CEO says he's betting the entire company's future on its 18A process Gelsinger fires back at recent stories about 18A's poor yields, schools social media commenters on defect densities and yields Intel mulls changes to chip-making biz: potential write-off of Intel 18A would cost billions Intel now reportedly focusing on 14A production as 18A proves to be a billion dollar failure Intel considers abandoning 18A node for 14A chipmaking process

:):D

OK, sad kad je 18A proces praktički mrtav, kakav im je daljnji plan i program (1 - 2 - 3 - 4 - 5) ili slijedi još jedna promjena glavnog direktora u vječnoj rotaciji nadobunih likova.:)

Citiraj:

Intel’s former CEO Pat Gelsinger says he underestimated the impact of AI:hitthewal: Citiraj: Well, Intel's ex-CEO did acknowledge the company's "delayed" response towards AI, as he has now claimed that the impact of the technology was miscalculated at his time. If you look at what Intel has done with AI, it has been nothing short of disappointment, especially in the realm of AI accelerators and rack-scale solutions, since even after several years, Team Blue has failed to present a competitive solution. Sure, the company does offer its Gaudi AI accelerators to the market, but they have witnessed little adoption from cloud companies, which shows that Intel isn't near to competitors at all when it comes to the hottest industry. Now, in a report by Nikkei Asia, it is revealed that Intel's former CEO Pat Gelsinger has admitted to the company's lackluster approach towards AI during his tenure. Intel's reluctance towards AI is much more evident when Gelsinger initially presumed "inference" to be everything, when nVidia and others were busy with model training. Intel's ex-CEO at that time claimed that the firm was ready to capitalize on the inferencing demand when it came, and even called out CUDA as a "moat". Despite such claims, we never really saw anything from Intel in the AI segment worthy of competing with nVidia, except for their Xeon server CPUs, mainly since they were a "multi-decade" product of Team Blue. Fast forward to what is happening with Intel and AI right now. The company's optimistic accelerator project, Falcon Shores, had been canceled, and the new CEO is looking to enter the rack-scale market with Jaguar Shores. Competitors like nVidia and AMD have already been offering their solutions for many years now, and Intel is nowhere to be seen in an industry that has generated hundreds of billions over the past quarters. And now, Team Blue is struggling to maintain its current business, let alone expand into new frontiers. Interestingly, Intel's ex-CEO still believes that having an internal semiconductor manufacturing unit is the way to approach product design, despite the financial obligations it carries. Intel has been heavily criticized for its "IDM 2.0" strategy, and it seems like the new CEO, Lip-Bu Tan, is decoupling from it by focusing less on the foundry business and more on design, one of Intel's core businesses. It is certain that we are going to see drastic changes with Intel moving into the future, one that would likely have noticeable consequences. Izvor: Nikkei Asia

Citiraj:

Intel "Diamond Rapids" Xeon CPU to feature up to 192 P-cores and 500 W TDP:sweating: Citiraj: Intel's next-generation "Oak Stream" platform is preparing to accommodate the upcoming "Diamond Rapids" Xeon CPU generation, and we are receiving more interesting details about the top-end configurations Intel will offer. According to the HEPiX TechWatch working group, the Diamond Rapids Intel Xeon 7 will feature up to 192 P-cores in the top-end SKU, split across four 48-core tiles. Intel has dedicated two primary SKU separators, where some models use eight-channel DDR5 memory, and the top SKUs will arrive with 16-channel DDR5 memory. Using MRDIMM Gen 2 for memory will enable Intel to push transfer rates to 12,800 MT/s per DIMM, providing massive bandwidth across 16 channels and keeping the "Panther Cove" cores busy with sufficient data. Intel planned the SoC to reach up to 500 W in a single socket. As the first mass-produced 18A node product, Diamond Rapids will be the first to support Intel's APX, also featuring numerous improvements to the efficiency of AMX. Intel also plans to embed native support for more floating-point number formats, such as nVdiia's TF32, and lower-precision FP8. As most of the world's inference is good enough to run on a CPU, Intel aims to accelerate basic inference operations for smaller models, enabling power users to run advanced workloads on CPUs alone. With a 1S, 2S, and 4S LGA 9324 configuration, Diamond Rapids will offer 768 cores in a single server rack, with a power usage of only 2000 W. Supporting external accelerators will be provided via the PCIe Gen 6 connector. Scheduled for arrival in 2026, Intel will likely time the launch to coincide with its upcoming "Jaguar Shores" AI accelerators, making a perfect pair for a complete AI system. Izvor: TechPowerUp

Ide im u svim poljima :



Intel Begins Massive Layoffs in Foundry, Auto Unit, and Marketing

Nažalost, došlo je do toga da se sad već ozbiljno priča o gašenju kompletnih fabrika, dok im ovi najavljeni i sad realizirani otkazi podižu cijenu dionica, jer eto - što firma lošije stoji, tim bolje za dioničare.

EDIT:

Citiraj:

Intel is not a top 10 chipmaker anymore, according to new CEO Lip-Bu Tan:stoopid: Citiraj: Intel has been in a dire state these past few years, with seemingly nothing going right. Its attempt to modernize x86 with a hybrid big.LITTLE architecture, ŕ la ARM, failed to make a meaningful impact, only made worse by last-gen's Lunar Lake chips barely registering a response against AMD’s cache-stacked X3D lineup. On the GPU front, the Blue Team served an undercooked product far too late that, while not entirely hopeless, was nowhere near enough to challenge the industry’s dominant players. The final nail may have come with Intel’s recent loss of contract manufacturing for its upcoming flagship 18A node. All of this compounds into a grim reality, seemingly confirmed by new CEO Lip-Bu Tan in a leaked internal conversation today. According to OregonTech, it's borderline a fight for survival for the once-great American innovation powerhouse as it struggles to even acknowledge being among the top contenders anymore. Despite Tan's insistence, Intel would still rank fairly well given its extensive legacy. While companies like AMD, nVidia, Apple, TSMC, and even Samsung might be more successful today, smaller chipmakers like Broadcom, MediaTek, Micron, and SK Hynix are not above the Blue Team in terms of sheer impact. Regardless, talking to employees around the world in a QnA session, Intel's CEO shared these bleak words: "Twenty, 30 years ago, we are really the leader. Now I think the world has changed. We are not in the top 10 semiconductor companies." As evident from the quote, this is a far cry from a few decades ago when Intel essentially held a monopoly over the CPU market, making barely perceptible upgrades each generation in order to sustain its dominance. At one time, Intel was so powerful that it considered acquiring nVidia for $20 billion. The GPU maker is now worth $4 trillion. It never saw AMD as an honorable competitor until it was too late, and Ryzen pulled the carpet from underneath the Blue Team's feet. Now, more people choose to build an AMD system than ever before. Not only that, but AMD also powers your favorite handhelds like the Steam Deck and Rog Ally X, alongside the biggest consoles: Xbox Series and PlayStation 5. AMD works closely with TSMC, another one of Intel's competitors, as the company makes its own chips in-house. This vertical alignment was once a core strength for the firm, but it has turned into more of a liability these days. Faltering nodes that can't quite match the prowess of Taiwan have arguably held back Intel's processors from reaching their full potential. In fact, starting in 2023, the company tasked TSMC with manufacturing the GPU tile on its Meteor Lake chips. This partnership extended to TSMC, essentially making the entire compute tile for Lunar Lake—and now, in 2025, roughly 30% of fabrication has been outsourced to TSMC. A long-overdue admission of total failure that could've been prevented had Intel been allowed to make CPUs with external manufacturing in mind from the start. Its own foundry was the limiting factor, and now the rot has already set in. As such, Intel has been laying off thousands across the world in a bid to cut costs. Costs that have skyrocketed due to the high R&D spending for future nodes, and with the company facing a $16 billion loss in Q3 last year, it can't survive on freeballing anymore. Intel's resurrection has to be a "marathon," said Tan, as he hopes to turn around the company culture and "be humble" in listening to shifting demands of the industry. Intel wants to be more like AMD and nVidia, who are faster, meaner, and more ruthless competitors these days, especially with the advent of AI. Of course, artificial intelligence has been around for a while, but it wasn't until OpenAI's ChatGPT that a second big bang occurred, ushering in a new era of machine learning. An era almost entirely powered by nVidia's datacenter GPUs, highlighting another sector where Intel failed to capitalize on its position. Intel, instead plans to shift its focus toward edge AI, aiming to bring AI processing directly to devices like PCs rather than relying on cloud-based compute. Tan also highlighted agentic AI—an emerging field where AI systems can act autonomously without constant human input—as a key growth area. He expressed optimism that recent high-level hires could help steer Intel back into relevance in AI, hinting that more talent acquisitions are on the way. “Stay tuned. “A few more people are coming on board,” said Tan. At this point, nVidia is simply too far ahead to catch up to, so it's almost exciting to see Intel change gears and look to close the gap in a different way. That being said, Intel now lags behind in datacenter CPUs, too where AMD's EPYC lineup has overtaken them in the past year, further dwindling the company's confidence. Also last year, Intel's board forced former CEO Pat Gelsinger out of the company and replaced him with Lip-Bu Tan, who seems to have a very different, more streamlined vision for the company. Instead of focusing on several different facets like CPU, GPU, foundry, and more, at once, Lip wants to home in on what the company can do well at one time. This development follow's long-stemming rumors of Intel splitting in two and forming a new foundry division that would act as an independent subsidiary, turning the main Intel into a fabless chipmaker. Both AMD and Apple, Intel's rivals in the CPU market operate like this, and nVidia has also always used TSMC or Samsung to build their graphics cards. It would be interesting to see the Blue Team shed off weight and move like a free animal in the biome. However, it's too early to speculate given that 18A, Intel's proposed savior, is still a year away, so until Nova Lake launches, we'll just be witnesses to a new Titanic. Izvor: Tom's Hardware

Citiraj:

Intel "Nova Lake-S" tapes out on TSMC N2 node:pirate: Citiraj: Intel's next-generation client CPU staple product, "Nova Lake-S", has reportedly taped out of TSMC's fabs in Taiwan. Our previous speculation from the rumor mill suggested that Intel would utilize its own internal 18A node, with help from TSMC's 2nm high-volume manufacturing. According to SemiAccurate, Intel has taped out a compute tile on TSMC's N2 node, meaning that Nova Lake-S will likely utilize a mix of 18A and TSMC N2 for its compute tiles. A possible reason for this decision is that Intel is building a chain of fall-backs to rely on in case its 18A node doesn't deliver, or it anticipates demand so high that its internal manufacturing capacity can't provide. Either way, clients can expect the product to be delivered on time in H2 of 2026, but under the hood, some interesting solutions may be present. As far as the exact date, the time from a tapeout to final product is months away. Right now, the taped-out silicon tile is being powered on in Intel's labs and tested, running various test cases that stress out the silicon for multiple use cases and check for correctness of operation. Typically, power on takes a few weeks to a month to achieve, and final high-volume manufacturing will commence only a few months later. From that point, another two to three months are needed for manufacturing and shipping the product, meaning that Q3 of 2026 is the most likely target for Nova Lake-S. As a reminder, the CPU will combine 52 cores (16 P-cores, 32 E-cores, and four LPE-cores) paired with 8,800 MT/s memory controller and Xe3 "Celestial" for graphics rendering and Xe4 "Druid" for media and display duties, making it definitely an interesting product, as well as a difficult manufacturing target due to the heterogenous complexity. Izvor: TechPowerUp

• Intel axes thousands of technicians and engineers in sweeping U.S. layoffs
  
  
• Intel’s “Mega-Plans” for U.S. Chip Production Falter as the Company Prepares for Layoffs

Citiraj:

No more hybrid-core CPUs from Intel by 2028:fiju: Citiraj: Intel is slated to end its hybrid P- and E-core designs in 2028 with the launch of the Titan Lake architecture, by doing so, the brand is set to move back to a unified core design, retiring the short-lived hybrid approaches after seven years of existence, just as users and software/game developers started becoming familiar with its quirks. Intel will pivot away from its hybrid core design debuted back in 2021 with the 12th Gen Core CPUs codenamed Alder Lake. If true, the Razor Lake architecture scheduled for 2027 will be the last hybrid combo running Griffin Cove P cores and Golden Eagle E cores. These unified cores are said to boast higher PPA (Power, Performance, Area) and PPW (Performance Per Watt), resulting in compact and efficient offerings. However, despite the naming, these cores won’t be all identical. Intel is seemingly following AMD’s footsteps, offering regular and compact variants similar to Zen 5 and Zen 5c. Some could be dense, packed in four-core clusters with a shared L2 cache, while others could clock higher with shared or dedicated L2/L3 caches. The non-dense variants are likely to be found in dual-core clusters, and rarely alone. The choice will depend on the final product and the single-threaded performance required. These unified cores are said to be more power-efficient than P cores, partly due to improvements in manufacturing processes. PPA gains should offset the higher power draw and increase in die size, allowing Intel to squeeze many cores in a small area without throwing efficiency out the window. Silicon_Fly adds that if Intel uses a leading-edge node for Titan Lake alongside the aforementioned compact variant, it could offer up to 100 cores per CPU, split in 48 + 48 + 4 LP E cores. Ditching the hybrid design should help Intel reduce complexity and cost, the latter being very important as the brand faces financial struggles. Intel would no longer need two parallel teams working on two core designs at the same time, simplifying organisation and removing duplicated engineering efforts. Streamlined R&D department should also result in faster product iteration, transplanting any improvement to all market segments, from laptops to servers. AMD’s homogeneous approach has shown its strengths on Ryzen processors, which allowed the Red Team to provide powerful chips at competitive prices. This also ensured feature parity between platforms, allowing AMD to offer features such as AVX‑512 on consumer products, unlike Intel which started limiting it to the server lineups. Titan Lake’s unified cores will mark the end of Intel’s hybrid era. Now, whether this transition will result in better overall products is still to be determined. More details about this unified microarchitecture should emerge with time. Izvor: Club386

• Intel allegedly planning more Oregon layoffs — new report says retreating operation could become a liability to the state
  
  
• TSMC's quarterly sales hit a record $30 billion — contract chipmaker plans over 15 new fabs to meet still-growing AI demand

Citiraj:

Intel's chip contracting plan in spotlight on earnings day:fiju: Citiraj: Faced with slumping quarterly sales and a burgeoning loss, Intel shareholders will want to know new CEO Lip Bu-Tan's plans for the chipmaker's nascent contract manufacturing business. Intel is set to report its sixth consecutive net loss on Thursday, while revenue is expected to drop for a fifth straight quarter, according to estimates from LSEG data. The storied chipmaker, once synonymous with America's chipmaking heft, has lagged due to years of strategic missteps. Rival nVidia has leaped ahead in the booming artificial intelligence chip industry, while rival AMD has been gaining share in Intel's mainstay personal computer and server semiconductor markets. CEO Tan has been focusing on a next-generation chipmaking process called 14A to win big external customers, shifting away from 18A, a technology that his predecessor Pat Gelsinger had spent billions of dollars to develop. Such a move could lead to a big writedown, an expense that would surely displease investors even as Intel has signaled that the new technology will help it be more competitive against Taiwan's TSMC, the world's biggest chipmaking factory. Longer-term commentary on the company's plans for the 14A technology "will hold more weight this earnings call than anything else". Intel is expected to report a net loss of about $1.25 billion for the April-June quarter, while its sales are expected to drop more than 7% to $11.92 billion. Last year was Intel's first unprofitable year since 1986. Writedowns could amount to hundreds of millions, if not billions, of dollars, according to analysts, and might impact the timeline for the foundry to break even. Intel's finance boss David Zinsner said in May he expected the unit to break even in 2027 and that would require external customers to generate low- to mid-single-digit billions in revenue. Intel's foundry unit is expected to generate $4.49 billion in sales in the second quarter, though a majority of this would come from chips Intel produces for itself, analysts said. Izvor: Reuters

Citiraj:

Intel reveals it’ll shed 24,000 employees this year and retreat in Germany, Poland, and Costa Rica:stoopid: Citiraj: In April, Intel attempted to announce layoffs without announcing layoffs. “We have not set any headcount reduction target,” Intel spokesperson Sophie Metzger told The Verge. But the company has laid off thousands of employees since — and today, in the company’s Q2 2025 earnings, it has revealed that Intel will dramatically shrink as a result of those layoffs. Intel says it will retreat from planned projects in Germany and Poland, end its assembly and test operations in Costa Rica, and finish 2025 with just around 75,000 employees in total. Since Intel employed 109,800 people at the end of 2024, that means the company is pushing out around 33,000 people this year — shrinking the entire company by roughly one-third. It’s just the latest revelation about how deep Intel’s new CEO Lip-Bu Tan is willing to cut as he attempts to flatten the organization after years of troubles and a lackluster response to the AI boom; in late June, Intel shut down its automotive chipmaking business and revealed it’d lay off up to 20 percent of silicon factory workers; in July, it spun out its RealSense computer vision business. Now, in Costa Rica, where Intel employs over 3,400 people, the company will “consolidate its assembly and test operations in Costa Rica into its larger sites in Vietnam.” In Germany and Poland, where it was planning to spend tens of billions of dollars respectively on “mega-fabs” that would employ 3,000 workers, and on an assembly and test facility that would employ 2,000 workers, the company will “no longer move forward with planned projects” and is apparently axing them entirely. Intel has had a presence in Poland since 1993, however, and the company did not say its R&D facilities there are closing. (Intel had previously pressed pause on the new Germany and Poland projects “by approximately two years” back in 2024.) The company is also cutting back in Ohio: “Intel will further slow the pace of construction in Ohio to ensure spending is aligned with market demand.” It’s not clear if the layoffs will slow now that we’re over halfway through the year. Intel states today that it has already “completed the majority of the planned headcount actions it announced last quarter to reduce its core workforce by approximately 15 percent,” but 15 percent would not take us close to the headcount of 75,000 that Intel is projecting by year’s end. So far, partially because of the $1.9 billion that Intel is incurring to do these layoffs and this restructuring, Intel is still losing money this quarter. It’s reporting a $2.9 billion loss on $12.9 billion in quarterly revenue (which is itself flat year over year). Amidst the ongoing AI boom, Intel’s data center business is only up 4 percent year-over-year to $3.9 billion, while its PC chips are down 3 percent to $7.9 billion. Intel’s foundry business where it does chipmaking for other customers is up 3 percent to $4.4 billion. The company says it’s on track to shrink its expenses by $17 billion over the full year, and that at least one of its next flagship laptop chips is on track, too: “The first Panther Lake processor SKU remains on track to begin shipping later this year, with additional SKUs coming in the first half of 2026.” Tan says he’s personally taking on responsibility for each new chip design with a new policy that he says is already in effect: “every major chip design needs to be personally reviewed and approved by me before tape out.” Izvor: The Verge

Citiraj:

Intel will cancel 14A and following nodes if it can't win a major external customer:hitthewal: Citiraj: Intel may slow down or even cancel development of its 14A process technology (1.4nm-class) if it fails to land a major external customer for this production node, or if the fabrication process fails to meet crucial milestones. This is the first time Intel has admitted to considering withdrawing from the leading-edge semiconductor technology race for a major node, essentially leaving leading-edge process technologies to TSMC and possibly Samsung Foundry. The Intel 14A node is planned as the successor to the 18A and 18A-P nodes, and is aimed at both internal products and external clients. However, the company made clear that it may halt or abandon 14A development if it cannot secure a large external partner or achieve critical progress targets. This represents a major shift in Intel's strategy toward market-driven node development, where new technologies must demonstrate commercial viability before being developed and before appropriate tools are purchased to enable high-volume manufacturing. If Intel ultimately cancels 14A and its successors, it expects to continue building the majority of its products in-house on nodes up to 18A-P through at least 2030. This is expected to support a wide range of offerings, while limiting capital deployment to technologies and fabs. However, it remains to be seen what happens to Intel's margins if its most advanced products are made by external foundries (i.e., TSMC) using their leading-edge nodes. Izvor: Tom's Hardware

• US chipmaking nears death: Intel warns it may give up on cutting-edge chips
  
  
• Intel to separate networking unit as new CEO Tan overhauls business
  
  
• Intel shares slide on quarterly loss, foundry business exit risk

Citiraj:

Citiraj: Intel has planned to lay off an additional 30% of its workforce, bringing the headcount down to 75,000 employees, they have said to drop out of the cutting-edge chip race (18A/14A process nodes) if they don't see major interests from external customers, and well, their financials are in dire straits. So, where does Intel, along with its newest CEO, Lip-Bu Tan, go from here? First Panther Lake mobile SKU launching in late 2025 Panther Lake ramp & more SKUs planned in early 2026 Nova Lake aims to bridge high-end desktop CPU gap with AMD Nova Lake launches in late 2026 for mobile and desktop platforms Intel 18A to be the main driver for at least three generations of client/enterprise products Diamond Rapids P-Core CPUs with up to 256 cores in 2H 2026 Clearwater Forest E-Core CPUs with up to 288 cores in mid 2026 Coral Rapids P-Core to replace Diamond Rapids by 2028-2029 SMT coming back to P-Core with Coral Rapids server being the first to reintroduce it Consolidation and building upon x86 CPU and Xe GPUs Intel 14A targets 2028-2029 timeframe, tackles TSMC's A14

U prijevodu, P.L.A.N._i_P.R.O.G.R.A.M. i dalje "napreduje" bez obzira na sve, a novi direktor lično provjerava i po potrebi odobrava sve izmjene i promjene.:):D

Na stranu sad da mu sve dosad rečeno djeluje kao čestitke, želje i pozdravi po uzoru na prijašnje direktore koji su također obećavali konkretne pomake.

Citiraj:

Intel's 14A chip process in jeopardy, while cutting jobs and pulling back global expansion Intel abandons chip plants in Germany and Poland, confirms more layoffs Intel puts the process horse back in front of the foundry cart Intel CEO Lip-Bu Tan’s turnaround efforts fail to impress banking giant JPMorgan Intel to throw networking biz over the side of its rapidly shrinking ship Intel looking to spin and sell its networking and edge business Intel plans deep job cuts, could drop chip manufacturing

Citiraj:

Three senior execs to retire from Intel Foundry, including respected semiconductor veteran Gary Patton:sweating: Citiraj: Intel on Friday informed its staff that three high-ranking executives from its manufacturing arm, Intel Foundry, are set to retire, Reuters reports. The exit of three corporate vice presidents will have a significant impact on the internal structure of Intel Foundry. Two of the three senior executives, Kaizad Mistry and Ryan Russell, are corporate vice presidents in the Technology Development Group. The third is Gary Patton, who served as the CVP and GM of the Design Technology Platform organization in the Technology Development Group. Patton is a well-known and respected semiconductor industry veteran, having served at IBM, GlobalFoundries, and, more recently, Intel. Kaizad Mistry and Ryan Russell have been part of the technical leadership behind Intel's process technology development and were responsible for various aspects of the Technology Development Group, including overseeing the ongoing efforts and setting strategic goals. Starting late 2024, Garry Patton was promoted to lead all of Intel Foundry's design enablement engineering efforts. As CVP and GM of the newly created Design Technology Platform organization, he was responsible for delivering the full set of design platform solutions required by Intel's Foundry customers. Essentially, he was responsible for developing process design kits (PDKs), validating support for EDA tools, creating IP libraries, and establishing design rules. Fundamentally, his job was to ensure that customer designs developed using Intel's PDKs, EDA tools (well, these came from third parties), and IP were compatible with Intel's process technologies and met performance and power goals, and could be reliably manufactured at high yield. Patton joined Intel after five years at GlobalFoundries and 20 years at IBM Microelectronics. Izvor: Tom's Hardware

Citiraj:

Intel’s former ‘Inventor of the Year’, who specialized in glass substrates, has now joined Samsung, Team Blue is ready to abandon its core team & vision:stoopid: Citiraj: Intel might have lost a major talent with its recent moves, as the company's core employee responsible for glass substrates and the EMIB technology has now joined rival Samsung. Team Blue has made some of the more drastic decisions with the company's structuring and vision in recent times, which are mainly driven by a single unified goal: to reduce operating losses and increase shareholder value. Achieving this objective has brought in cancellation of optimistic projects, large-scale layoffs, and more importantly, key personalities moving from the company, and one such example is Gang Duan, who is a former principal engineer at Intel, responsible for Substrate Packaging Technology. Duan's shift to Samsung shows that Intel's "decades" of work towards a particular technology could very well be abandoned, and while this might benefit them in the short term, it could have serious impacts with time, especially since Intel has failed to remain competitive in any segment for now. Izvor: Wccftech

Citiraj:

Intel is reportedly struggling with its next-gen Panther Lake chips, as the 18A yield rates are making it difficult to scale production for retail launch Intel’s credit rating slashed to just two notches above junk status: Fitch now wants to see “successful product ramps” and “net debt reduction” Intel's bad news year rolls on as new 18A chip manufacturing node is reportedly in trouble with 10% yields Intel's 18A process hit by low yields and quality issues, putting manufacturing comeback in doubt

Intel 18A proizvodni proces se po svemu sudeći polako, ali sigurno pretvoril u još jedan 10nm fijasko, ali nema brige, ionako je novi direktor još prošli mjesec najavil da se od 18A odustaje, te da je prava stvar, novi i bolji 14A proces koji, ako se ne pokaže interesantim vanjskim klijentima, također ide na listu otpisanih. Nakon toga se u Intel ponovno vraćaju Raja Koduri, Ryan Shrout i Pat Gelsinger, jer to je cijelo ovo vrijeme zapravo bila pomno zamišljena taktika od strane Jim Kellerovog šalabathera koja omogućuje Intelov povratak na vrh.:):D

I još potvrda da je 18A fijasko:

https://www.reuters.com/world/asia-p...ay-2025-08-05/ :nono:

Loše za nas. Ak žele opstati trebat će im sve više TSMC kapaciteta, a to je valjda sve veća cijena za krajnjeg kupca od svih koji tamo štancaju.

Nažalost u ovom trenutku su izglednije ovakve citirane vratolomije iz nastavka, nego da Intel sam napravi sve potrebne izmjene i promjene, jer oni i dalje samo pričaju o sljedećoj generaciji, a onda kad to treba stići na tržište, krenu priče o odgađanju, jer ona opet sljedeća generacija bude vrijedna čekanja, dok se u međuvremenu rotiraju direktori, a konkurencija grabi sve više i više, odnosno Intelu ostaje sve manje i manje.

EDIT:

Izgleda da je Intel prepušten sam sebi (snađi se druže), jer TSMC i dalje ne pokazuje neki pretjerani interes za spašavanje.:)

Citiraj:

President Donald Trump, in a talk with CNBC yesterday, announced that Taiwan's TSMC is investing $300 billion in the US to build chip manufacturing plants. TSMC's primary investment is in Arizona, where the firm aims to build six new chip fabrication plants through a $165 billion foreign direct investment, which is the largest of its kind in US history. The latest bout of US trade negotiations has also reignited rumors of a Taiwanese investment in Intel. Such rumors were rife earlier this year, with several sources claiming that TSMC might set up a joint venture with Intel to bail out the latter from its chip manufacturing difficulties. However, a Taiwanese investment in Intel is unlikely, as the firm's problem isn't a lack of funds but the inability to execute advanced manufacturing technology.

I onda ko če ih kupit amd,nvidia,država ili neko peti

Poslano sa mog SM-S918B koristeći Tapatalk

Kak je krenulo, sve je moguće, ali realno nikome osim države ne treba to Intelovo sidro oko vrata. AMD je sličnu kalvariju prošel prije dvadesetak godina sa svojim fabrikama, dok je nVidia od samog početka fabless, tak da nemaju nekakvu računicu. AMD svakak ne treba još jedan potencijalni rub propasti, jer su bili prisiljeni spašavati konkurenciju, koja je svojevremeno tijekom najžešćeg monopola plaćala grde nofce Dellu, HP-u i OEM društvu općenito, samo da ne nude AMD proizvode.

I pored svih problema koji su ih snašli, Intel zajedno s novim direktorom ima i dodatne peripetije.

nV je naučila još od prvog dana, na primjeru 3DFXa to sa fabless-om i da većinu rizika prebace AiB partnerima. ;)
Oni njima fino strovale čipove, a za dalje ih boli briga, tj dalje rade na driverima i to je to.
A i Ati se u jednom trenu opametio....ili je to čak napravio tek AMD kada ih je kupio...neda mi se guglat, a ne sjećam se.
Za Jensena se može svašta pričati, ali je frajer majstor i IMHO mu trenutno nema ravnog u biznisu.

A Intel, pa ne mogu vjerovati da se oni nikako ne mogu izvući iz ovih govana. Pa što ne mogu skinuti gaće i spustiti cijenu, nema mesa ili koji vrag?
Kako AMD ima slične tj čini mi se i niže cijene...koji vrag se dešava u tom Intelu.
Ne kužim tu politiku držanja visokih cijena, skucajte to dole i postanite best buy kao svojevremeno Zen, i onda laganini dalje prema konkurentnosti. A oni bi se izgleda sexali bez da im uđe....je, moš misliti.

IMHO nije toliko problem da oni samo snize cijene, jer i s tim su već naveliko krenuli, posebice za desktop i server segmente, već da im je kompletna ponuda totalno nekonkurentna, dok istovremeno očito nemaju neku novu arhitekturu na pomolu koja bi zajedno sa stvarno superiornim proizvodnim procesom natjerala sve moguće u njihove fabrike i postupno odmahnula TSMC-ovim pogonima. Intel je na ovaj ili onaj način tijekom posljednjih 20, a ponajviše zadnjih 10 godina spiskal sve šanse koje su im se pružale da se uistinu zaokrenu u nekom novom smjeru, umjesto da žive na staroj slavi, otkupu vlastitih dionica i tom prokletom mijenjanju glavnih direktora po uzoru na "naše" trenere i izbornike, jer tak jasno nije problem u momčadi i taktikama na terenu, već u jednom jedinom čovjeku.

Kak god se okrene, ušli su u ovaj začarani krug da više nitko ne dolazi na njihova vrata, jer imaju najbolje, a u isto vrijeme Intel kuca na vrata TSMC konkurencije da im proizvedu sve kaj trebaju. Mislim, pa Arrow Lake je kompletno proizveden na TSMC 3nm, 5nm i 6nm procesu, ovisno o chipletu i opet ni to nije bilo dosta da skrše AMD Zen 4 i 5, a o 3D cache i Threadripper modelima da i ne pričamo, samo da bi naposljetku i ta LGA-1851 platforma bila za jedno ljeto i ćao đaci, lijepo čekajte Nova Lake skupa sa novim socketom i čipsetom, dok šrot AMD već skoro deset godina aktivno podržava AM4, a bome slično bude i za AM5 kak je krenulo, tak da nema sumnje u isto za AM6 kad 2028. stigne na tržište.

Čini se da žućo želi silom spasiti Intel.

Svašta oni pokušavaju s Intelom, ali nitko ne grize, dok TSMC rađe i dalje ulaže u tzv. američku domaću proizvodnju.:)

Qualcomm je novac uložio u Alphawave, ne znam hoće li imati dovoljno sredstava za ulaganje u Intel. Nekako mi se čini da je Intel debelo prokockao sve prilike za oporavak na neki ekonomski razuman način.

https://futurumgroup.com/insights/qu...e-acquisition/

Sada će biti u Intelu natezanja oko udjela, patenata, tehnologije, ljudstva, političkih pritisaka... Nadam se da će biti dovoljno pametni da shvate da je vrag odnio šalu.

Qualcomm je s vremenom također kompletno izgubil interes u potencijalno ulaganje ili preuzimanje Intela. Izgleda da se nitko ne želi dovesti blizu te financijske crne rupe.

EDIT:

Citiraj:

Trump calls on Intel CEO to resign:sweating: Citiraj: U.S. President Donald Trump called for the immediate resignation of Intel's new CEO, Lip-Bu Tan, saying he was "highly conflicted" after questions arose about his ties to Chinese firms and sparking doubts over the future of the American chip-making icon. The move comes a day after Reuters reported U.S. Republican Senator Tom Cotton sent a letter to Intel's board chair with questions about Tan's ties to Chinese firms and a recent criminal case involving his former firm Cadence Design. Once the dominant force in chip-making, the company is in the middle of a strategy shift meant to revive its fortunes after it fell behind Taiwanese rival TSMC in manufacturing. Intel also has virtually no presence in the booming market for AI chips dominated by nVidia Tan, who took over the CEO role in March after the ousting of his predecessor Pat Gelsinger late last year, has set a goal of slashing the chipmaker's workforce to 75,000 people by year-end, a reduction of around 22%. Intel also vowed to take a more disciplined approach to manufacturing investment. Izvor: Reuters

Nije dugo trebalo da se pojavi novi politički pritisak, a kaj točno budu postigli s još jednom smjenom direktora ...

Kažem ja, tko zna tko sve pije iz Intelove fontane. Tu vjerojatno ima ljudi koje nije briga što će biti s Intelom. Jedino im je bitno da lova ide dok ide a dovoljno su jaki i močni da održavaju ovakvo stanje. Takve ljude niti najmanje ne zanimaju ulaganja nego što prije izvuci što možeš pogotovo u ovakvoj situaciji. To je vjerojatno jedan od utega.

Dobro im je išlo dok su imali vrhunski proizvodni process a konkurencija je bila slaba. Činilo se da su nedodirljivi. Lako se bilo opustiti u tome.

Onda je došao Ryzen a ubrzo su (navodno) zeznuli s tranzicijom na 10nm. Priča se jako brzo preokrenula.

Meni se osobno činilo da se AMD zeznuo kada se riješio svojih tvornica chipova. Mislio sam da je to bio potez očajnika. Ali, čini se da su dugoročno napravili dobru stvar :)

Intel 10nm proces su pošteno sfušali, do te mjere da su uz višegodišnje odgode i kašnjenja, morali koristiti 14nm+++ iteracije, a AMD je u međuvremenu stigel do treće Zen generacije, da bi Intel uz opet novog direktora svoj 10nm proces jednostavno preimenoval u Intel 7, tak da se lakše paše uz TSMC 7nm proces korišten za AMD-ove procesore. I zato sad ove Intel 18A avanture neodoljivo podsjećaju na njhove 10nm izlete, samo da bi sve skupa potencijalno bilo kompletno otkazano u korist tzv. boljeg 14A procesa, koji se također prema riječima direktora još stigne baciti u smeće, ako ne bude interesa vanjskih klijenata.

I uz sve kaj su sami zakuhali, sad imaju i dodatne cirkusarije.
Možda ne bi bilo loše da se Intel ugleda na Apple, pa preCedniku daju neki kič, tak da ga lakše skinu s vrata.:hitthewal: