Vijesti i novosti o Intel procesorima i čipsetima - Stranica 212

The Exiled · 27.01.2026., 19:51

Citiraj:

Autor Disco

A pazi ti brzinu tog nedostižnog RAM-a, ma to će koštat sve skupa ko suho zlato.
Sretno im bilo. Šteta što je tako, jer je konkurencija potrebna.
Ali ajd, možda narančasti bude subvencionirao plave ili naredio micronu da im spusti cijene ili neki vrag. Nikad se ne zna.

Da, cijene budu za plakati, dok se TSMC i dalje angažira za dosta toga kaj bi prema PR i marketing pričama, Intel trebal sam za sebe, a bome i za druge proizvoditi. Svašta bude tu još u godinama koje dolaze, jer nema naznaka da budu se cijene stabilizirale, a kamoli smanjile. Meteor Lake model u ThinkPad T14 izdanju sam svojevremeno kad su taman izašli platil tadašnjih ~1.200€, a sad je taj rang u Panther Lake verzijama točno duplo skuplji i to ovak na papiru, prije nego se svi kroz marže i poreze namire kak spada s tim da je B390 iGPU najbolji dio te priče i IMHO glavni razlog za kupnju.

EDIT:

Citiraj:

nVidia to build GPUs on Intel Foundry from 2028

Citiraj:

nVidia's upcoming "Feynman" AI GPU will partially use Intel Foundry nodes, a DigiTimes report says. nVidia recently invested a 5% stake in Intel, and is exploring tapping into Intel Foundry manufacturing capacity. In particular, nVidia is interested in the Intel 18A and 14A foundry nodes for certain components of its upcoming "Feynman" AI GPU that launches in 2028, succeeding the current "Rubin" AI GPU. nVidia also intends to tap into Intel's EMIB technology for its chiplet interconnectivity, the report says.

The "Feynman" AI GPU will still be majorly TSMC-based, with its core IP being built on die(s) leveraging TSMC A16 (1.6 nm) foundry node, which is expected to make up 75% of the chip's value. The remaining silicon content will be built on Intel 18A or Intel 14A nodes, and the chip's final packaging is expected to take place in U.S. soil, at Intel Foundry. This way, it will be Intel handling the EMIB chiplet bonding. "Feynman" is expected to implement a newer memory standard, such as HBM4e or even HBM5, and significantly increase memory per package, so each chip can handle trillion-parameter scale models.

Izvor: DigiTimes

Citiraj:

mamutarka · 23.02.2026., 13:48

Intel Plans Return to Unified Core Design, No More Performance and Efficiency Core Split

https://www.techpowerup.com/346645/i...ncy-core-split

The Exiled · 23.02.2026., 19:34

Ništ, budemo vidjeli kaj točno su zamislili na tom polju, posebice, ako se stvarno ispostavi da se nakon (ismijanog) chiplet dizajna, okreću nečemu kaj (još) više nalikuje šrot AMD pristupu. Makar, lako za to, jer s ovim bi opet imali izgovor za još jedan novi socket i to svega dvije-tri godine od nadolazećeg LGA-1954.

Citiraj:

That brings us to the juicy bit: "Unified Core team." Intel has not publicly announced the existence of any such team. Now, Intel's internal team names don't always scream product branding, of course. This could just be a label for streamlining design methodology or verification setup. However, rumors have been swirling that point to a bigger shift: architectural alignment across Intel's disparate core types, a bit like how AMD tweaks its Zen cores into dense "c" variants for efficiency without a full split.

Leaks tie this to Intel's roadmap post-2027, where Griffin Cove (purportedly slated for Razer Lake CPUs) might be the swan song for dedicated P-cores, paving the way for a unified design in stuff like Titan Lake or Hammer Lake around 2028-2029. This would ditch the P/E-core hybrid that's defined Intel since Alder Lake, aiming for better power efficiency, simpler software optimization, and a shot at matching AMD's uniform-ish approach. Picture it less as "one core to rule them all" and more like a single architectural DNA spawning multiple phenotypes. You'd still have "slow" cores and "fast" cores, it's just that they share an architecture.

Izvor: HotHardware

EDIT:

Citiraj:

Intel Foundry boss leaves for Qualcomm

Citiraj:

In an unexpected turn of events, Kevin O'Buckley, the head of Intel Foundry, decided to jump ship for Qualcomm after just two years at the company. From now on, Intel Foundry will be headed by Naga Chandrasekaran, who was previously in charge of front-end process technology development and manufacturing. O’Buckley joined Intel as the company’s top Intel Foundry executive in May 2024, which made him the third executive to run the business since 2021. And he arrived just months after the company marked the official launch of Intel Foundry.

The executive saw changes to his responsibilities and position in Intel’s leadership structure several months ago. This happened last September, when Tan expanded the responsibilities of Chandrasekaran, who joined Intel later in 2024 to lead Intel Foundry’s manufacturing and supply chain operations, to Intel Foundry Services. This meant that O’Buckley would no longer report to the CEO and would instead serve as a direct report for Chandrasekaran, who remains on Tan’s executive leadership team.

Izvor: Tom's Hardware i CRN

Citiraj:

Intel numbers boss swears big Foundry wins are coming soon

Citiraj:

Intel's Foundry division is near to sealing a deal for its advanced packaging technology that would contribute billions of dollars a year to the struggling chipmaker, CFO David Zinsner said on Wednesday. Advanced packaging has become a focal point of semiconductor manufacturing amid the AI boom as accelerators have grown more complex, meaning many GPUs are composed of multiple compute and memory dies that must be fused together. Intel has invested heavily in its EMIB and Foveros 2.5D and 3D packaging tech to support multi-die processors like its Xeon CPUs and (now discontinued) Ponte Vecchio family of GPU Max accelerators. Perhaps more importantly, that tech isn't limited to chips Intel makes in its own fabs – the company has already used it to meld silicon manufactured in-house with chips made by TSMC.

Alongside advanced packaging demand, Intel CEO Lip-Bu Tan appears to have changed his tune regarding the external adoption of its 18A process tech. The chief executive, who celebrates his first year in the role later this month, had previously considered 18A for Intel’s own use only. Intel’s foundry biz planned to offer its next-gen manufacturing process, 14A, as its first mainstream commercial offering. But according to Zinsner, Tan's opinion of 18A changed over the past year. Intel 18A-P is an upgraded version of 18A that the company has suggested will deliver eight percent higher performance per watt, which compares favorably with TSMC's competing 2nm process. Despite offering good news for Foundry’s fortunes, Zinsner said the biz is still at least a year away from breaking even.

Izvor: The Register

Citiraj:

Xeon 696X on ASUS W890 – Early Look

Citiraj:

Intel has launched their range of Xeon 600 Workstation processors along with a new W890 chipset so it's time for a review to see how the new technology performs. We put the Asus Pro WS W890-SAGE through its paces with an Engineering Sample of the 64-core Xeon 696X and discovered a few unexpected results as we show in our video.

The Exiled · 07.04.2026., 19:24

Citiraj:

Intel will help build Elon Musk’s Terafab AI chip factory

Citiraj:

Musk needs AI chips to power his plans to build a “robot army” that includes self-driving cars and humanoid robots, as well as for the data centers he plans on launching into space. Now, it seems like the factory’s construction will fall on Intel, which is dealing with its own struggles. Intel is currently building two fabs in Arizona, as part of a $20 billion investment to grow its US footprint. Taiwan’s TSMC is also planning an enormous “Gigafab” north of Phoenix, with plans to operate as many as 12 advanced semiconductor plants.

Intel reportedly in talks with Google and Amazon over advanced packaging

Citiraj:

Intel is understood to be in active talks with Google and Amazon to provide advanced chip packaging services for their custom AI processors. The deals, if closed, would represent a major influx of external revenue for Intel Foundry, which CFO Dave Zinsner said at the recent Morgan Stanley TMT conference is "close to closing some deals that are in the billions of dollars per year, in terms of revenue on packaging." Google, Amazon, and Intel all declined to comment on the specific customer relationships.

Intel “Serpent Lake” CPUs to integrate nVidia graphics in 2028/2029

Citiraj:

Intel’s “Titan Lake” series CPUs are still a few years away. Intel plans to launch Nova Lake next year. If rumours are to be believed, this will be followed by Razer Lake and then Titan Lake. Serpent Lake is a branch/offshoot of Titan Lake. Moving forward, Intel’s hardware roadmap is aggressive. If Serpent Lake releases in late 2028 or early 2029, Intel will need to release new CPU platforms/architectures every year for the next few years. This is a rapid rate of progress for Intel. This is especially true after so many years where Intel has merely “refreshed” its existing CPU lineup. Raptor Lake was refreshed, and Arrow Lake has been refreshed. Now, Intel expects to launch Nova Lake, Razer Lake, and Titan Lake within the next few years. Clearly, Intel is fighting hard to regain its market dominance.

Intel Razor Lake-AX to challenge Apple Silicon

Citiraj:

Intel is reportedly working on a new CPU that aims to challenge AMD’s “Strix Halo” and Apple Silicon. With its huge 4326 socket, Razor Lake AX aims to bring together strong CPU and GPU hardware to deliver a strong single-package computing solution for the masses. Razor Lake is Intel’s successor to the Nova Lake processors. Nova Lake is set to launch later this year, replacing Panther Lake and Arrow Lake. With Razor Lake, we can expect new CPU core architectures, which means faster P-cores and E-cores.

Intel će pomoći Elonu, a država i nVidia će pomoći Intelu koji pomaže Elonu, ali možda se CPU i GPU dio za običan puk ipak sprovede po planu i programu.

23.02.2026., 13:48	#6332
mamutarka ODUZIMAM VAM RIJEČ Moj komp Datum registracije: Aug 2005 Lokacija: Zagreb Postovi: 13,660	Intel Plans Return to Unified Core Design, No More Performance and Efficiency Core Split https://www.techpowerup.com/346645/i...ncy-core-split __________________

Oglasni prostor
PC Ekspert Forum Oglas