OK, ali cijela priča je nastala iz situacija koje su prijavljivali krajnji korisnici, nekolicina recenzenata je to fino istražila i potvrdila, a Intel se na kraju ogradil od svega i to je to.
Citiraj:
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There have been many reports that installing an Alder Lake processor into one of the cheaper Z690 or B660 models causes the CPU socket to bend and the IHS itself. There's also the potential to create permanent bends in the PCB area around the socket. This is not a good thing. The implications of this are two-fold. Firstly, from a cooling standpoint, it will and can lead to increased thermals due to the gaps this creates between the cold plate of the cooler and the IHS on the CPU. While thermal paste will generally fill some of the gaps, the problem is the nature of the gap and its size that the increased pressure the ILM creates. The second and perhaps the most fundamental part of this, it should NOT be happening. It should be noted that LGA1700 motherboards either use ILM's manufacturers by Lotes or Foxconn, but it's reported that both ILMs are affected by this issue.
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