[the_ghost]

Autor JC Denton

Vidim da se dosta vas napalilo na Zen3 + 3D V-Cache ili kako se vec zove... ja bas nisam dobio dojam da planiraju izac s tim? Rekao bih da je to prije bio technology demo. Bar sam ja to tako shvatio.

Tek toliko da Intel zna što ih čeka kad 3DCache "nalijepe" na poboljšanu Zen4 jezgru

https://twitter.com/anandtech/status...70424658087941

In a call with AMD, we have confirmed the following:

This technology will be productized with 7nm Zen 3-based Ryzen processors. Nothing was said about EPYC.
Those processors will start production at the end of the year. No comment on availability, although Q1 2022 would fit into AMD's regular cadence.
This V-Cache chiplet is 64 MB of additional L3, with no stepped penalty on latency. The V-Cache is address striped with the normal L3 and can be powered down when not in use. The V-Cache sits on the same power plane as the regular L3.
The processor with V-Cache is the same z-height as current Zen 3 products - both the core chiplet and the V-Cache are thinned to have an equal z-height as the IOD die for seamless integration
As the V-Cache is built over the L3 cache on the main CCX, it doesn't sit over any of the hotspots created by the cores and so thermal considerations are less of an issue. The support silicon above the cores is designed to be thermally efficient.
The V-Cache is a single 64 MB die, and is relatively denser than the normal L3 because it uses SRAM-optimized libraries of TSMC's 7nm process, AMD knows that TSMC can do multiple stacked dies, however AMD is only talking about a 1-High stack at this time which it will bring to market.