na vam link
http://www.3dvelocity.com/reviews/no...nwood2.2a2.htm
i
http://www.hardocp.com/article.html?art=NA==
a za one koji ne vole se setati po linkovima evo i citata
"The hole is for pressure relief. When the IHS is epoxied to the Organic Land Grid Array, or "OLGA" for short, it releases gas as it cures. If Intel did not provide the hole, the pressure would build up and eventually blow out the still wet epoxy. This would cause mechanical stresses due to the incomplete epoxy line around the IHS to OLGA bond line. Once the epoxy has cured (before it leaves the factory) it is not an issue. So, Intel put in a hole. If it gets plugged up with thermal grease or something it is OK. I would not suggest filling it with anything that conducts electricity though."
i
the hole in the heat spreader is used to allow the air inside to expand when heated without causing damage due to pressure and though its primary use is during the manufacturing process it also serves to do the same thing under normal use.
nasao sam kontradiktornih stvari a nisam opet uspio naci intelov sluzben dokument na ovo drugo vise lici na njega dok ovo prvo ima vise smisla.....
pa si sad vi mislite