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The Exiled · Jučer, 18:46

Citiraj:

AMD EPYC Turin 128 Core Comparison: EPYC 9745 "Zen 5C" vs. EPYC 9755 "Zen 5"

Citiraj:

For those on an AMD EPYC 9005 series server platform where the motherboard can only accommodate up to 400 Watt TDP CPUs rather than 500 Watt, or you are very focused on power/thermals, the EPYC 9745 is an interesting option for squeezing in 128 Zen 5C cores at a 400 Watt TDP. Via custom TDP (cTDP) tuning is even the ability to lower that down to 320 Watts for even lower power/thermal requirements. With Zen 5C cores, the EPYC 9745 also has just half the L3 cache (256MB) as the EPYC 9755. But you have the same 128 cores / 256 threads and the same ISA with AVX-512 and the like while having a 400 Watt TDP or as low as 320 Watt cTDP.

The EPYC 9745 is a very interesting 128-core / 256-thread processor. It offered much of the performance of the EPYC 9755 with its Zen 5 cores but with Zen 5C was a nice advantage to the performance-per-Watt. When taking the geometric mean of 555 benchmarks in total, the AMD EPYC 9745 was delivering about 90% the performance of its 128 core EPYC 9755 sibling. Considering that the EPYC 9745 has just 80% the TDP rating of the EPYC 9755, that's a nice showing for the EPYC 9745 with its dense cores. When pulling back to the 320 Watt lowest cTDP, it was around 98% the performance of the 400 Watt default.

Across the mix of different workloads tested, the EPYC 9745 consumed 73% the power of the EPYC 9755 across the mix of workloads tested. The peak CPU power was at 379 Watts for the EPYC 9745 compared to 497 Watts with the EPYC 9755. With the 320 Watt cTDP power configuration was the additional power savings. Overall the AMD EPYC 9745 offered good performance relative to the EPYC 9755 with its full Zen 5 cores and higher TDP while offering quite a nice lead in performance-per-Watt across the many workloads tested.

Izvor: Phoronix

Citiraj:

ASML looks beyond EUV, plans new tools for larger chips and 3D packaging

Citiraj:

The company's next moves include building machines for advanced chip packaging and exploring ways to produce even larger silicon dies, shifting ASML from its narrow role as the world's sole EUV supplier into a broader supplier of AI-era chipmaking tools. CTO Marco Pieters, who took over in October 2025 after a 40-year tenure by Martin van den Brink, described the effort as a long-term strategy rather than a short-term adjustment. ASML's EUV machines have been the foundation for TSMC and Intel as they push chip features well below 5 nanometers. After more than a decade of research and billions in development, ASML's second-generation EUV tools are near production, with a third in early research.

Engineers at ASML are now exploring optical and mechanical redesigns to expand that printable field, potentially enabling the creation of physically larger, more powerful chips. What once seemed a routine manufacturing step: connecting chips to circuit boards – is now one of the semiconductor industry's most critical bottlenecks. The first product signaling this diversification arrived last year: the XT:260 scanner, designed for advanced memory chips used in AI applications. Engineers are now investigating additional systems that could extend those capabilities to even more complex logic and stacking operations.

To focus more heavily on engineering, ASML streamlined its technology division and  Christophe Fouquet – CEO since 2024 – has aligned the corporate roadmap around expansion beyond EUV lithography. The confluence of optics, motion systems, and silicon handling gives ASML a technical foundation few can match.

Izvor: TechSpot