[The Exiled]

AMD unlikely to transfer orders away from TSMC

AMD is unlikely to transfer its 5nm or 3nm chip orders from TSMC to Samsung Electronics, and its ongoing tight supply of processors is due mainly to ABF substrate shortages rather than insufficient capacity support from its current foundry partner. AMD Ryzen 5000 CPUs marked the biggest ramp ever in the company's history, shipping almost 1 million units in a single quarter despite the fact that their supply was heavily constrained. ABF, otherwise known as “Ajinomoto Build-up Film” is a resin substrate that acts as an insulator in all modern ICs. The ABF is a highly durable and rigid film that resists expansion and contraction with changes in temperature, making it ideal for use as a substrate between the nanometer-scale and millimeter-scale components of a processor or IC. The AFB substrate consists of multiple layers of microcircuits, known as a “build-up substrate” which allows the formation of these miniature components as its surface is receptive to laser processing and direct copper plating. Most modern chipmakers use ABF to design the smaller components of their CPUs and GPUs.

Izvor: DigiTimes