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NV GeForce GTX 260 redesign by Guru3d

• The number of PCB layers has been reduced from 10 to 8, perhaps to compress or remove blank, redundant or rudimentary connections
• A 4+2 phase NVVDD power design using the ADP4100 voltage regulator IC, the FBVDDQ circuit has been reduced from 2 phases to 1, and the MOSFET package has been changed from LFPAK to DPAK grouping, to reduce costs. The ADP4100 lacks the I2C interface, which means voltage control will be much more difficult than on current PCBs of the GeForce 260,280, 285 and 295
• The optional G200b support-brace has been removed
• While the length of the PCB remains the same, the height has been reduced to cut costs
• BIOS EEPROM capacity reduced from 1 Mbit (128 KB) to 512 Kb (64 KB)
• Cheaper DVI connectors