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Citiraj:

The past month we have started our testing of Ampere's Altra Max M128-30, the company's new 128 core server processor, and in this article today are our initial benchmarks of this promising chip for high core count servers in both 1P and 2P configurations tested. With Ampere Altra Max the flagship processor is currently the M128-30 that has a 3.0GHz maximum clock speed for its 128 cores. Ampere Altra Max processors continue to use the Neoverse N1 cores, support eight channels of DDR4-3200 ECC memory, 128 lanes of PCIe Gen4, and other features in common with Altra. Like the Q80-33, the M128-30 does maintain the same 250 watt TDP rating. Ampere Altra Max processors are a drop-in upgrade to Ampere Altra with an updated BMC and system firmware.

Across a wide range of tests, the Ampere Altra Max M128-30 2P is proving to be very competitive with the AMD EPYC 7763 2P in workloads that scale well and make full use of ARMv8 capabilities. Given the Ampere Altra Q80-33 2P was already outperforming the Xeon Platinum 8380 2P Ice Lake server, it's to no surprise Ampere's lead there has widened even more substantially with now being able to offer 128 cores per socket. It's incredible to see the competitiveness of Ampere Altra Max in testing ARM Linux servers since the days of Calxeda and how far not only the hardware but also the ARM software ecosystem as a whole has come over the past 10~15 years in being able to truly take on x86_64 in the server space.

Izvor: Phoronix

Čovječe, 128 jezgri, kada će to postati mainstream.

Apple's M1 Pro, M1 Max SoCs investigated: New performance and efficiency heights:frend:

Citiraj:

Apple didn’t talk much about core performance of the new M1 Pro and Max, and this is likely because it hasn’t really changed all that much compared to the M1. We’re still seeing the same Firestrom performance cores, and they’re still clocked at 3.23GHz. The new chip has more caches, and more DRAM bandwidth, but under ST scenarios we’re not expecting large differences. Against the competition, the M1 Max either has a significant performance lead, or is able to at least reach parity with the best AMD and Intel have to offer. The chip however doesn’t change the landscape all too much.

What’s more interesting than ST performance, is MT performance. With 8 performance cores and 2 efficiency cores, this is now the largest iteration of Apple Silicon we’ve seen. Apple does have 2 additional cores versus the 8-core 11980HK or the 5980HS, the performance advantages of Apple’s silicon is far ahead of either competitor in most workloads. Again, to reiterate, we’re comparing the M1 Max against Intel’s best of the best, and also nearly AMD’s best (The 5980HX has a 45W TDP). The performance differences here are just insane, and really showcase just how far ahead Apple’s memory subsystem is in its ability to allow the CPUs to scale to such degree in memory-bound workloads.

Izvor: AnandTech

Ne znam koliko vas je naletjelo na ovu vijest, s obzirom na potrošnju el. energije ne bi me čudilo da od toga nešto i bude:

Microsoft and AMD are reportedly developing an Arm processor for laptops

https://www.notebookcheck.net/Micros....568434.0.html

Apple announces M1 Ultra: Combining two M1 Maxes for Workstation Performance:frend:

Citiraj:

Apple unveiled the fourth and final member of the M1 family of Apple Silicon SoCs, the M1 Ultra. Aimed squarely at desktops – specifically, Apple’s new Mac Studio – the M1 Ultra finds Apple once again upping the ante in terms of SoC performance for both CPU and GPU workloads. And in the process, Apple has thrown the industry a fresh curveball by not just combining two M1 Max dies into a single chip package, but by making the two dies present themselves as a single, monolithic GPU, marking yet another first for the chipmaking industry. Apple has bonded two M1 Max dies together on to a single chip, with all of the performance benefits doubling their hardware would entail.

At the heart of the new M1 Ultra is something a bit older: the M1 Max. Specifically, Apple is using two M1 Max dies here, and then bonding them together to form a massive amalgamation of 114B transistors. On the CPU front, this means Apple now offers a total of 20 CPU cores. This is comprised of 16 of their performance-focused Firestorm cores, and 4 of their efficiency-focused Icestorm cores. With 32 GPU cores, M1 Max was already setting records for a monolithic, integrated GPU. And now Apple has doubled things to 64 GPU cores on a single chip.

The secret ingredient that makes this all possible – and which Apple has been keeping under wraps until today – is that M1 Max has a very high speed interface along one of its edges. An interface that, with the help of a silicon interposer, allows two M1 Max dies to be linked up. Apple calls this packaging architecture UltraFusion, and it’s the latest example in the industry of 2.5D chip packaging. Thanks to UltraFusion, Apple has become the first vendor to ship a chip that transparently combines two otherwise separate GPUs. In particular, the company is touting that the M1 Ultra’s GPU performance exceeds that of NVIDIA’s GeForce RTX 3090, which at the moment is the single fastest video card on the market. And furthermore, that they’re able to do so while consuming a bit over 100 Watts, or 200 Watts less than the RTX 3090.

Izvor: AnandTech

Prvi benchmark pokazuje snagu M1 Ultra procesora.

https://www.macrumors.com/2022/03/08...ked-benchmark/

Ovo uzmite s rezervom dok ne potvrdi barem još jedan sajt. U svakom slučaju, impresivne brojke.

Kupnja ARM-a sa strane Nvidije ipak nije prosla te je obustavljena, jedna od posljedica su veliki broj otkaza koji slijede u ARM-u.

Citiraj:

Autor stitrek (Post 3591317)

Kupnja ARM-a sa strane Nvidije ipak nije prosla te je obustavljena, jedna od posljedica su veliki broj otkaza koji slijede u ARM-u.

Ne znam odakle si iskopao tu informaciju, ARM se nije ništa unazadio zbog toga. ARM i dalje živi od proizvodnje procesora (GPU, CPU, network...) i licenci koje naplaćuje. I nadalje se svi veliki igrači motaju oko ARM-a, Apple, Nvidia, Microsoft...

https://www.nextplatform.com/2022/02...m-partnership/

Pa nije teško provjeriti tu informaciju.

https://www.theguardian.com/business...e-uk-us-nvidia

Samo kao da lika to zanima. U jednom danu je pokušao nabiti postove za tržnicu pa je imao nešto za reći u svakoj temi....

Sent from my SM-A715F using Tapatalk

Citiraj:

Autor udarnik60 (Post 3591496)

OK, iako ja mislim da će uskoro objaviti da ipak neće otpuštati radnike, pogotovo što će i UK i EU i Intel pogurati proizvodnju čipova na europskom području. Ako se ne varam, ARM je trenutno jedini dizajner čipova na europskom području koji ima značajniju ulogu. S obzirom da će transport s azijskog područja i nadalje biti s velikim problemima, kao i sama proizvodnja koja će uvelike ovisiti o tome kako će se Kina politički ponašati u odnosu na Rusiju, bit će još velikih previranja po tržištu.

ARM Announces the Cortex-X3, Cortex-A715 CPU Cores and Immortalis-G715 GPU:frend:

Citiraj:

Arm is announcing its new flagship Immortalis GPU today, its first to include hardware-based ray tracing on mobile. As PCs and the latest Xbox Series X and PS5 consoles are all gradually moving toward impressive ray-traced visuals, Immortalis-G715 is designed to be the Arm’s first GPU to deliver the same on Android phones and tablets. Built on top of Mali, a GPU that’s used by the likes of MediaTek and Samsung, Immortalis is designed with 10–16 cores in mind and promises a boost of 15 percent over the previous generation premium Mali GPUs. Arm sees Immortalis as the start of a transition to ray tracing on mobile following its success with the 8 billion Mali GPUs that have shipped to date.

Arm also has an update to its main Mali line with the Mali-G715. This GPU includes variable rate shading (VRS) to boost gaming performance and energy savings on mobile. VRS essentially renders the parts of a scene in a game that require more detail, so details in the background don’t need as much rendering power. Arm’s move to support hardware-based ray tracing on its GPUs is a significant step for mobile Android gaming. Ray tracing is currently limited to powerful GPUs that are typically found in gaming PCs or the latest Xbox Series X and PS5 consoles.

Izvor: TechPowerUp i The Verge

nVidia details Grace Hopper CPU Superchip design: 144 cores on 4N TSMC process:frend:

Citiraj:

nVidia's Grace CPU is the company's first CPU-only Arm chip designed for the data center and comes as two chips on one motherboard, totaling 144 cores, while the Grace Hopper Superchip combines a Hopper GPU and the Grace CPU on the same board. Among the most important disclosures, nVdiia finally officially confirmed that the Grace CPUs use the TSMC 4N process. TSMC lists the "N4" 4nm process under its 5nm node family, describing it as an enhanced version of the 5nm node. nVidia uses a specialized variant of this node, dubbed '4N,' that is optimized specifically for its GPUs and CPUs. The Grace CPU has 16 dual-channel LPDDR5X memory controllers, working out to 32 channels that support up to 512 GB of memory and up to 546 GB/s of throughput. nVidia says it selected LPDDR5X over HBM2e due to multiple factors, like capacity and cost. Meanwhile, LPDDR5X provides 53% more bandwidth and 1/8th the power-per-GB compared to standard DDR5 memory, making it the better overall choice.

There are really two reasons nVidia is building its own CPU. First, nVidia wants something that is a more efficient co-processor to the company’s GPUs in large systems. nVidia owns the hardware/ software stack much like Apple, so this is an attempt to become a truly full-stack provider. nVidia does not need Intel/ AMD’s new AI accelerators, it has its own. Likewise, it can build a chip with the right performance attributes to augment a GPU, rather than duplicating other parts. The second reason is more obvious now. nVidia needs to de-couple itself from Intel and AMD. Both are competing with nVidia in HPC and AI. At the same time, the Hopper H100 is waiting for Sapphire Rapids to launch before the DGX H100 can launch. As a result, we are expecting a mid-to-late Q1 2023 debut for Hopper. Given that the chips exist, (see below) nVidia needs a CPU solution so it can sell its GPUs.

Izvor: Tom's Hardware i ServeTheHome

ARM is the new RISC/Unix, RISC-V is the new ARM:kafa:

Citiraj:

When computer architectures change in the datacenter, the attack always comes from the bottom. And after more than a decade of sustained struggle, Arm Ltd and its platoons of licensees have finally stormed the glass house – well, more of a data warehouse (literally) than a cathedral with windows to show off technological prowess as early mainframe datacenters were – and are firmly encamped on the no longer tiled, but concrete, floors. The success of the proprietary minicomputers spawned a new breed of server makers, using computationally efficient RISC processors and operating systems that hewed to the Unix standard to various degrees that started off in scientific workstations in the mid-1980s. Intel expanded and hardened the X86 architecture, which was not initially as capacious or reliable as the RISC chips made by Sun, HP, Data General, ARM, and others. It didn’t need to be as computing on the Web was more distributed. What the Web-scale world needed was for datacenter compute to be was cheaper, and the X86 architecture was certainly cheaper than the RISC/Unix machines of the time. The relative affordability and absolute compatibility of the X86 architecture literally transformed the world.

And now the Arm CPU architecture that is in our tablets and smartphones and that took over as the embedded controller of choice from PowerPC, which displaced the Motorola 68K – and all four CPU architectures famously used in Apple machines – is pulling the X86 off that peak even as server volumes and revenues keep growing. If you ever wonder why Intel chief executive officer Pat Gelsinger is so hot to trot with opening up the Intel foundry business, this is why. Because, as we have been saying for more than a decade now, when Arm comes into the datacenter, another profit pool is going to be eliminated and the money is just going to end up in someone else’s pocket. Arm will very quickly become the CPU of choice on the clouds and among the hyperscalers unless Intel radically cuts prices on Xeon SP CPUs. With a 30 percent to 40 percent price/performance advantage for equivalent performance for a cloud instance, why would you deploy on an X86 instance instead of an Arm instance? Perhaps you buy a Xeon SP – and a back generation one at that – because AMD is sold out of Epyc CPUs and that is all you can get? Our point is that this is not just about mobile affecting servers.

John Cocke created a Reduced Instruction Set Computing architecture to try to make CPUs more efficient in the experimental 801 system in the 1970s, which ended up being used in IBM mainframe controllers and not much else. And along with the help of luminaries like David Patterson, Complex Instruction Set Computing (it wasn’t called until RISC made a distinction necessary) that prevailed in all CPU designs was replaced by the RISC method. Even the venerable X86 is a RISC computer at heart that is pretending to be a CISC machine, and has been for decades. We would not be surprised if IBM is, under the covers, doing the same thing with its System z mainframe motors.

The scale of Arm server deployments is on the order of hundreds of thousands of units against a few million units per quarter, but the Arm slice is growing fast. And the success of Arm is not being driven by performance per watt in the strictest sense, as was the drive early on with Arm server designs from a decade ago. This time, it is about an Arm CPU having equivalent or better performance than an X86 CPU, and much lower cost – and about the hyperscalers, cloud builders, and telcos having the option of customizing an Arm CPU design and having their own relationships with the few remaining advanced process chip foundries. This is all about IT organizations controlling their own fate.

Citiraj:

Google Cloud Tau T2A Ampere Altra vs. T2D AMD EPYC Performance

Citiraj:

Like with the AMD EPYC powered T2D series, T2A is also optimized for cost-effective performance of scale-out workloads. The T2A VMs come up to 48 vCPUs per virtual machine -- each vCPU backed by a physical CPU core. There is also 4GB of memory per vCPU, matching that of the T2D VMs and Amazon's M6g Graviton2-based instances. Google has talked up the T2A series, as it has with T2D, as being great for web servers, containerized microservices, data log processing, multimedia encoding/transcoding, and Java workloads. The T2D series overall came out slightly ahead of the T2A series due to the more mature x86_64 Linux software ecosystem. The Tau T2A instances show that Arm/AArch64 performance has certainly come a long way and in various workloads can compete with modern x86_64 competition while in other areas the software ecosystem has room for improvement and more tuning to occur for AArch64.

Izvor: The Next Platform i Phoronix

Sad, ovoj situaciji kada se mijenja cijena el. energije, ispast će da će korisnici itekako početi voditi računa o potrošnji uređaja. Šteta što je Apple s M1 i M2 procesorima jedini koji je nešto značajnije napravio na desktop segmentu.

AMD-ov Zen 3+ Rembrandt se dosta dobro nosi s Apple M2 čudima tehnike, tak da, ako AMD ikada odluči taj SoC zapakirati u desktop APU, bog-bogova.:frend:

Citiraj:

Apple M2 vs. AMD Ryzen 7 Pro 6850U performance in nearly 200 benchmarks:chears:

Citiraj:

Over the span of 190 benchmarks carried out, the AMD Ryzen 7 PRO 6850U and Apple M2 were effectively dead-split when it came to the number of first place finishes... In 40% of the benchmarks, the Ryzen 7 PRO 6850U in its "performance" mode came out in front and picked up first place finishes in another 10% of the benchmarks with its stock configuration. Meanwhile 49% of the time, the Apple M2 performance either in the stock or performance governor configuration were out in front.

Izvor: Phoronix

Citiraj:

It was a nice improvement in performance-per-Watt with Rembrandt and further extends the AMD power efficiency wins over Intel Alder Lake P.

In addition to the power efficiency, most compelling with the Ryzen 7 PRO 6850U on Linux were the RDNA2-based Radeon 680M graphics as a big upgrade over Vega graphics.

Nadam se da će se AMD upustiti u daljnji razvoj Rembrandt tehnologije. Nije ni čudo da se Nvidia htjela dokopati ARM-a, gledam novu 4xxx seriju grafičkih kartica, je da su brze i moćne, ali to pojede struje da ti odmah mrak padne na oči, i bez redukcije struje. :D

SiPearl works with AMD on GPU support for ARM HPC chip:kafa:

Citiraj:

Chip designer SiPearl is working with AMD on software support to enable supercomputing systems that pair SiPearl's high-performance Rhea processor with AMD's Instinct GPU accelerators. SiPearl is the company involved with the European Processor Initiative (EPI) to develop an Arm-based processor for an exascale supercomputer designed and built in Europe, slated for 2023. This latest agreement sees the company enter a business collaboration with AMD towards a joint offering for exascale supercomputing systems using their respective technologies. AMD and SiPearl said they will start by working on the interoperability of AMD's ROCm software stack for developing GPU accelerated applications with SiPearl's Rhea microprocessor. The aim is to ensure that a software ecosystem is in place ready for such applications to run on any future supercomputer based on SiPearl CPUs combined with AMD Instinct GPUs.

This joint work will focus on porting and optimization of AMD's Heterogeneous Interface for Portability (HIP), created to let developers write portable code to target both AMD and Nvidia GPUs, the duo said. Beyond this, AMD and SiPearl said they'll "engage with OEMs adopting the Rhea microprocessor with AMD Instinct accelerators in their designs," which simply means they will work with any hardware company considering using this combination of silicon to build an actual HPC system. The two companies also said they hope to expand the joint work to include European research institutions supporting research modeling tools, which would enable developers to port and optimize their applications for any system using a SiPearl/AMD solution.

Izvor: The Register

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TSMC Expansion in Arizona to target 3-nm Node

Citiraj:

Taiwan Semiconductor Manufacturing Co. (TSMC) announced this week that it’s building the factory shell for a possible second fab at its Arizona site.

The world’s top chipmaker has already committed to a $12 billion investment for its 5-nm fab in Arizona.

Apple set to purchase chips from TSMC Arizona plant

Citiraj:

CEO Tim Cook said Cupertino has already decided to start purchasing from TSMC's plant in Arizona, which is set to come online sometime in 2024.

Apple pushes TSMC to make more advanced chips in US by 2024:frend:

Citiraj:

TSMC reportedly plans to make 4nm chips at its Arizona manufacturing plant when it goes online in 2024, a significant upgrade from the Asian foundry giant's previous commitment to focus on less advanced 5nm silicon at its first leading-edge US fab. The Taiwanese chipmaker has updated plans for its Phoenix fab at the behest of its customers including Apple, nVidia, and AMD. President Joe Biden is expected to join Apple CEO Tim Cook, nVidia CEO Jensen Huang, and AMD CEO Lisa Su at a ceremony in Arizona next Tuesday where TSMC will make the announcement.

TSMC is also anticipated to confirm at the event that it will construct a second fab at the Phoenix site to make 3nm chips, its most state-of-the-art silicon in production, according to the newsw wire. The company's founder, Morris Chang, said last week that TSMC was weighing the possibility. The developments mean the United States will have more advanced chipmaking capabilities sooner than anticipated. Intel is building out new fabs for advanced chips in Arizona and Ohio that are expected to go online in 2024 and 2025 respectively. Meanwhile, Samsung is constructing a leading-edge plant in Texas set for 2024 operation, and there's possibility of a massive expansion. Increased chipmaking capabilities and capacity have been top priorities of the US government, which seeks to rebalance the world's silicon supply chain and move reliance away from Asian manufacturing hubs by using $52 billion in subsidies approved this year to aid with new fab construction.

There has been a sense of urgency to move more chip production to the West, in part due to concerns that China could invade Taiwan and disrupt the island nation's chip manufacturers, which make up most of the world's advanced chipmaking capacity. The tech world has also been keen to diversify the global silicon supply chain due to disruptions caused by the COVID-19 pandemic. When Cook said earlier this month Apple plans to source chips from an Arizona fab in 2024, he said the goal was to reduce the iPhone maker's reliance on Taiwan fabs, according to an earlier report.

The accelerated ramp-up of TSMC's capabilities in the US is likely to create more pressure for Intel, which plans to compete with the Taiwanese company and other contract chip manufacturers like Samsung through its revitalized foundry business. Last week, we reported that Intel Foundry Services had a major leadership shakeup. Intel is racing to catch up with TSMC and Samsung in making more advanced chips after several years of manufacturing missteps. The company recently said it's on track to surpass its Asian rivals in process performance by 2025. But it may be a challenge for Intel to convince chip design rivals to use the company's manufacturing services.

Izvor: The Register

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Autor The Exiled (Post 3642533)

Apple pushes TSMC to make more advanced chips in US by 2024:frend:

Izvor: The Register

Priprema za možebitno Tajvan sra*e. Iako, sve je to mizerno, jedna(trenutno) tvornica u US a hrpa na Tajvanu i par u Kini.

Da, ali čak i obzirom na situaciju TSMC dosta brzo slaže nove pogone, dok eto Intel i dalje cmizdri, mada su dobili 52 milijarde pomoći, a konkurencija im je već prek puta i ne kasne.

To baš i nije tako, osim ako pod brzo misliš na godine (što zaista je brzo u tom kontekstu). Za sve što je ispod 8nm(il neki druge sitne vrijenosti, ne sjećam se) trebaju ASML tj. Leica strojevi. Ne postoji drugi dobavljač.

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Autor Exy (Post 3642677)

Ameri pokazuju tko je glavni, imat će najnapredniji proces na planetu na svom tlu. Europa naravno gleda i glumi gljivu.

Budemo uveli embargo na izvoz strojeva i to je to :D

Ameri pokazuju tko je glavni, imat će najnapredniji proces na planetu na svom tlu. Europa naravno gleda i glumi gljivu.

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Autor Pupo (Post 3642673)

Svi trebaju ASML, nema druge, ono kaj hoću reći da TSMC sve kaj najavi sprovode u realnost, jer taj 5nm FAB u Arizoni bude izbacival wafere, prije, nego Intel uopće krene s postavljanjem opreme u svoje fabrike, a u međuvremenu TSMC već složi 3nm koji ide sad usporedno s ovim 5nm koji se već priprema za proizvodnju. Znam da za to trebaju godine, tak jasno, samo velim da su već prošle te godine i TSMC je svoje najave ostvaril i općenito ih ostvaruje, dok Intel i dalje čeka da ih netko sprovede na pravi put ili da konkurencija jednostavno nestane prek noći.:)

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Autor Exy (Post 3642677)

Ameri pokazuju tko je glavni, imat će najnapredniji proces na planetu na svom tlu. Europa naravno gleda i glumi gljivu.

Da, pa samo Apple, AMD i nVidia (bome i Intel u zadnje vrijeme) tuku gadne pare za TSMC, a sve redom domaće američke firme, tak da imaju itekakav interes.

Da li postoji u EU tvornica wafera uopće, a da bas nisu iz devesprve?

Ima Intel svoje u Irskoj i GloFo u Dresdenu, ali i EU sad po uzoru na USA želi svoj CHIPS Act, pa da se sve više toga na modernim proizvodnim procesima slaže diljem Europe.

Intel Foundry and ARM to collaborate on 1.8nm mobile SoCs:kafa:

Citiraj:

Arm and Intel Foundry Services on Wednesday announced plans to conduct design technology co-optimization (DTCO) and system technology co-optimization (STCO) for Arm's mobile IP on the Intel 18A fabrication technology (1.8nm-class). The plan will enable clients of Arm and IFS to maximize performance, lower power consumption, and optimize die sizes of their upcoming SoCs involving Arm's IP. Under the agreement, Intel Foundry Services and Arm will co-optimize Arm's IP and Intel's 18A fabrication process to increase the performance, power, area, and cost advantages of the new node. The two companies will initially focus on mobile SoC designs, but may eventually expand their collaboration to automotive, aerospace, datacenter, Internet of Things, and government applications. As part of the pact, Arm and IFS will develop reference design and optimized process developers kits for mobile SoCs.

Citiraj:

The deal won’t see Intel’s Foundry Services division produce chipsets for ARM. Instead, it will make it easier for ARM licensees, including the likes of Qualcomm and MediaTek, to hire Intel to make chips in the future.:):D

When it comes to Intel's 18A fabrication process, there are a lot of things that can be optimized on node and design level to extract more PPAC advantages out of the node. One of the key innovations of Intel 18A is usage of gate-all-around (GAA) transistors that Intel calls RibbonFET. In GAA transistors, the channels are horizontally oriented and completely enclosed by gates. These GAA channels are created through epitaxy and selective material removal, enabling designers to fine-tune them by altering the transistor channels' width to get higher performance or lower power consumption. If everything works well, such control allows them to reduce transistor leakage current and performance variability — this provides great opportunities for DTCO.

Izvor: Tom's Hardware

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nVidia and AMD are planning Arm-based CPUs for consumer PCs: Intel's shares tumbled following the news:kafa:

Citiraj:

Forward-looking: An Arm revolution could be coming to the PC as soon as 2025. According to a new report, nVidia is planning to launch CPUs based on the architecture designed specifically to run Windows, while AMD also plans to go down the same route. It's concerning news for Intel, which saw its share price fall 5% on the back of the claims. Reuters' unnamed sources say that Nvidia, which already dominates the AI, HPC, and consumer graphics card industries, is expanding its portfolio to include Arm-based processors for client Windows PCs. AMD is also planning to make PC processors based on Arm's designs.

The report says that Microsoft is encouraging others to enter the Arm-based systems market once the current exclusivity deal it has with Qualcomm ends next year. In 2016, Microsoft chose the company to bring the full Windows experience to Arm-powered devices. "Microsoft learned from the 90s that they do not want to be dependent on Intel again, they do not want to be dependent on a single vendor," Jay Goldberg, chief executive of D2D Advisory, told Reuters. "If Arm really took off in PC (chips), they were never going to let Qualcomm be the sole supplier."

nVidia has plenty of experience with Arm-based processors. Its product stack includes the Grace-Hopper and Grace CPU Super Chips. There's also its Tegra SoC that powered tablets and phones and is still found in the Nintendo Switch and nVidia Shield. An early version of the Tegra was also used in Microsoft's first Surface tablet, the Surface RT, but the device never gained many fans and was discontinued a year later. AMD, meanwhile, uses Arm cores in products such as its Versal FPGAs. The company was even rumored to be working on an Arm-based Apple M1 rival back in 2020.

Izvor: TechSpot

Ako će Nvidia upariti svoj GPU i AI dio s ARM jezgrom, mislim da će i AMD i Intel i Apple imati poštenog konkurenta.

S obzirom kaj je Qualcomm najavil sa Elite X procevima, moglo bi biti prilično čupavo na tržištu u sljedećih godinu-dve.

Ak je istina kaj su najavili, ja ne vidim kak bu x86 preživel u laptopu u sljedećih 5 godina

Ak ne slože x86 virtualizaciju nitko to neće kupovati.

Virtualizacija već sad dela prilično dobro, s tim da već dost korištenih programa je već napravljeno za ARM

Citiraj:

Autor BinaryJesus (Post 3705784)

Ak ne slože x86 virtualizaciju nitko to neće kupovati.

Veći je problem Windowsa, nisu još dobro optimizirali. Na Linuxu i MacOSX rade jako dobro.

Ekipa koja je radila M1 prešli su na Qualcomm već tri godine. Veći problem je M2 i budući M3 sa viška memorije. Bit će smiješno M3 sa 12gb memorije.

Intel boss Pat Gelsinger calls Arm's PC threat "insignificant":hitthewal: - sve oko njega gori, ali Intelov glavni direktor i dalje u eter plasira kojekakve zanimljivosti.

nVidia Grace Hopper praktički nema konkurencije, šrot AMD i dalje uzima svoj komad tržišta, ARM se već ionak udomaćil na serverskom polju, ali ne - Pat i Mat u Intelu ne vjeruje da će ARM biti ikakav problem za njegovu firmu.

Citiraj:

"Intel quarterly figures: A loss in sales, a business closure, a good outlook and an increase in shares. Intel CEO Gelsinger dismisses 'pretty insignificant' Arm PC challenge."

Da, baš nemaju razloga za brigu. :)

Evo im ovo:
https://www.apple.com/newsroom/2023/...ring-m3-chips/

To je to, isti taj CEO od prvog dana priča kak bude vratil Apple opet na Intel, kaj po pitanju CPU-a, kaj po pitanju proizvodnje Apple custom-made SoC rješenja.:):D

Hajde malo da dignem thread... :)

Vec sam pisao o tome kako mi se svidio ARM Chromebook ovdje: https://www.reddit.com/r/chromeos/co...stop_worrying/ a sada imam nesto sasvim novo pa ce mozda nekome biti zanimljivo. E sad imam nesto sasvim novo...

TLDR; (ne samo Appleov) ARM je zaista postao first class citizen u klasicnom workstation smislu i zaista se moze ucinkovito raditi na njemu ako imate neke specificne potrebe.

Pa da pocnemo - NXP LX2160A ima 16 jezgara do 2.2 GHz, 8MB L2 cachea i 8MB L3 "platform cache" i razne mrežne kombinacije u SoC-u. LX2160A je nominalno klasicni embedded procesor ali je optimiziran za mrežna rješenja. SoC ima dual channel DDR4-3200 kontroler i podržava ECC, a TDP je 30W. Naravno, kako sam rekao, radi se o mrežnom SoC-u (100GbE i svaštanešto), ali je SolidRunov SoM koji je na njihovoj ClearFog CX LX2 ITX ploči s ATX konektorom i PCI-E konektorom. Konkretno, radi se o ovom hardveru: https://www.solid-run.com/arm-server...x2-workstation

To sada vec pomalo zvuci kao nesto na sto bi covjek mogao natociti i nesto sto nije stravicno unutar embedded svijeta. Pa sam se malo poigrao, i to je na kraju rezultiralo time da sam slozio puni funkcionalni solidno brzi ARM workstation.

Chip lijepo radi overclockiran, takt 2.2 GHz (original 2 GHz), FSB 800 MHz (original 700 MHz) Ovih 200njak MHz gore mu sasvim dobro dodje (testovi ispod) Isto tako, malo Grunfovanja je bilo potrebno, ali u konacnici sam zadovoljan rezultatom.

Meni je cijena hardvera (barem sto se SolidRun hardvera tice) bila "transparentna" (hardver je kupljen, odradio je svoju svrhu i skuplja manje prasine samo zato sto je u ladici), a "dodatnog" hardvera sam se nakupovao u visini ~150€. Prije svega, tu je Thermaltake Mini ITX Core X1 kuciste koje je *apsolutno* smece i ne vrijedi niti 60€ koliko sam ga platio. Nije mi se dalo kombinirati s nekim relativno starim napajanjima koje sam imao u uredu pa sam odabrao jeftini EVGA 450W BR za 50€, a s obzirom da me uzasno iritirao hladnjak koji je na SoM-u, iskoristio sam stari LC-Power LC-CC-95 cooler. Takodjer, na Njuskalu sam uzeo Asusovu RT 550 2GB sto je sasvim dovoljno za dva monitora koliko mi treba, a ipak nije predpotopna kao nekakva ATI kartica koju sam nasao da bih isprobao AMD boot uopce.

Slike su ovdje, a ispod ide malo brojeva. Imate sliku "originalne" plocice i onda mojeg Grunf moda, koji je efektivno full load spustio sa ~70°C na ~50° C.

SolidRun HoneyComb LX2 (NXP Layerscape LX2160A) as a Workstation

OpenBenchmark.org Timed Linux Kernel Compilation 1.15.0 - average of 3 runs

Code:

2x Intel Xeon Gold 6148         -        59.90 s

2x Intel Xeon E5-2680 v4        -        92.92 s

AMD Ryzen Threadripper 2920X    -        97.52 s

2x Intel Xeon E5-2620 v4        -       160.17 s

NXP LX2160A@2.2GHz              -       854.50 s

NXP LX2160A                     -       913.06 s

Geekbench 6

https://browser.geekbench.com/v6/cpu...ine=%205134441 vs. iEi PUZZLE-M801
https://browser.geekbench.com/v6/cpu...ine=%205134441 vs. Lenovo Lenovo Duet 5
https://browser.geekbench.com/v6/cpu...ine=%205134441 2.0GHz vs. 2.2GHz

lshw

Code:

arm-ripper

    description: Mini Tower Computer

    product: SolidRun CEX7 Platform

    vendor: SolidRun Ltd.

    version: Rev 1

    serial: Serial Not Set

    width: 64 bits

    capabilities: smbios-3.2.0 dmi-3.2.0 smp cp15_barrier setend swp tagged_addr_disabled

    configuration: boot=normal chassis=mini-tower

  *-core

       description: Motherboard

       physical id: 0

     *-firmware

          description: BIOS

          vendor: EFI Development Kit II / SolidRun

          physical id: 1

          version: EDK II

          date: Mar  3 2024

          size: 96KiB

          capabilities: pci upgrade bootselect acpi usb uefi

     *-cpu

          description: CPU

          product: ARM (0xd08)

          vendor: NXP

          physical id: 1008

          bus info: cpu@0

          version: Cortex-A72

          slot: BGA-1156

          size: 2GHz

          capacity: 2200MHz

          clock: 100MHz

          capabilities: lm

          configuration: cores=16 enabledcores=16

        *-cache

             description: L1 cache

             physical id: 1000

             slot: L1 Instruction

             size: 48KiB

             capacity: 48KiB

             capabilities: internal varies instruction

             configuration: level=1

     *-memory

          description: System Memory

          physical id: 100b

          slot: System board or motherboard

          size: 63GiB

          capabilities: ecc

          configuration: errordetection=ecc

        *-bank

             description: DIMM DDR4 3200 MHz (0.3 ns) [empty]

             physical id: 0

             slot: RIGHT SIDE

             width: 64 bits

             clock: 3200MHz (0.3ns)

     *-nvme

          description: NVMe device

          product: SAMSUNG MZVLB256HAHQ-000L7

          vendor: Samsung Electronics Co Ltd

          physical id: 2

          bus info: pci@0002:01:00.0

          logical name: /dev/nvme0

          logical name: /dev/fb0

          version: 1L2QEXD7

          serial: S41GNX0M370758

          width: 64 bits

          clock: 33MHz

          capabilities: nvme pm msi pciexpress msix nvm_express bus_master cap_list fb

          configuration: depth=32 driver=nvme latency=0 mode=1920x1080 nqn=nqn.2014.08.org.nvmexpress:144d144dS41GNX0M370758      SAMSUNG MZVLB256HAHQ-000L7 state=live visual=truecolor xres=1920 yres=1080

          resources: iomemory:940-93f irq:361 memory:9400000000-9400003fff

        *-namespace:0

             description: NVMe disk

             physical id: 0

             logical name: hwmon1

        *-namespace:1

             description: NVMe disk

             physical id: 2

             logical name: /dev/ng0n1

        *-namespace:2

             description: NVMe disk

             physical id: 1

             bus info: nvme@0:1

             logical name: /dev/nvme0n1

             size: 238GiB (256GB)

             capabilities: gpt-1.00 partitioned partitioned:gpt

             configuration: guid=2800354e-92d4-40ba-a255-a2328ca44f8a logicalsectorsize=512 sectorsize=512 wwid=eui.0025388391b9723f

           *-volume:0 UNCLAIMED

                description: Windows FAT volume

                vendor: mkfs.fat

                physical id: 1

                bus info: nvme@0:1,1

                version: FAT32

                serial: 5917-3eb7

                size: 1073MiB

                capacity: 1074MiB

                capabilities: boot fat initialized

                configuration: FATs=2 filesystem=fat

           *-volume:1

                description: EXT4 volume

                vendor: Linux

                physical id: 2

                bus info: nvme@0:1,2

                logical name: /dev/nvme0n1p2

                logical name: /

                logical name: /var/snap/firefox/common/host-hunspell

                version: 1.0

                serial: 44b70ed7-c365-4823-98ee-b83baf35ce91

                size: 237GiB

                capabilities: journaled extended_attributes large_files huge_files dir_nlink recover 64bit extents ext4 ext2 initialized

                configuration: created=2024-03-01 19:59:31 filesystem=ext4 lastmountpoint=/ modified=2024-03-04 00:27:02 mount.fstype=ext4 mount.options=ro,noexec,noatime mounted=2024-03-04 00:27:02 state=mounted

     *-display

          description: VGA compatible controller

          product: Lexa PRO [Radeon 540/540X/550/550X / RX 540X/550/550X]

          vendor: Advanced Micro Devices, Inc. [AMD/ATI]

          physical id: 0

          bus info: pci@0004:01:00.0

          logical name: /dev/fb0

          version: c7

          width: 64 bits

          clock: 33MHz

          capabilities: pm pciexpress msi vga_controller bus_master cap_list rom fb

          configuration: depth=32 driver=amdgpu latency=0 resolution=1920,1080

          resources: iomemory:a40-a3f iomemory:a40-a3f irq:380 memory:a480000000-a4ffffffff memory:a400000000-a4001fffff ioport:10000(size=256) memory:a040000000-a04003ffff memory:a040040000-a04005ffff

     *-multimedia

          description: Audio device

          product: Baffin HDMI/DP Audio [Radeon RX 550 640SP / RX 560/560X]

          vendor: Advanced Micro Devices, Inc. [AMD/ATI]

          physical id: 0.1

          bus info: pci@0004:01:00.1

          logical name: card0

          logical name: /dev/snd/controlC0

          logical name: /dev/snd/hwC0D0

          logical name: /dev/snd/pcmC0D10p

          logical name: /dev/snd/pcmC0D3p

          logical name: /dev/snd/pcmC0D7p

          logical name: /dev/snd/pcmC0D8p

          logical name: /dev/snd/pcmC0D9p

          version: 00

          width: 64 bits

          clock: 33MHz

          capabilities: pm pciexpress msi bus_master cap_list

          configuration: driver=snd_hda_intel latency=0

          resources: iomemory:a40-a3f irq:382 memory:a410200000-a410203fff

        *-input:0

             product: HDA ATI HDMI HDMI/DP,pcm=3

             physical id: 0

             logical name: input21

             logical name: /dev/input/event6

        *-input:1

             product: HDA ATI HDMI HDMI/DP,pcm=7

             physical id: 1

             logical name: input22

             logical name: /dev/input/event7

        *-input:2

             product: HDA ATI HDMI HDMI/DP,pcm=8

             physical id: 2

             logical name: input23

             logical name: /dev/input/event8

        *-input:3

             product: HDA ATI HDMI HDMI/DP,pcm=9

             physical id: 3

             logical name: input24

             logical name: /dev/input/event9

        *-input:4

             product: HDA ATI HDMI HDMI/DP,pcm=10

             physical id: 4

             logical name: input25

             logical name: /dev/input/event10

     *-pnp00:00

          product: PnP device NXP0016

          vendor: NXP Semiconductors bv.

          physical id: 3

          capabilities: pnp

          configuration: driver=system

     *-pnp00:01

          product: PnP device NXP0016

          vendor: NXP Semiconductors bv.

          physical id: 4

          capabilities: pnp

          configuration: driver=system

     *-pnp00:02

          product: PnP device PNP0c02

          physical id: 5

          capabilities: pnp

          configuration: driver=system

  *-usbhost:0

       product: xHCI Host Controller

       vendor: Linux 6.5.0-21-generic xhci-hcd

       physical id: 1

       bus info: usb@1

       logical name: usb1

       version: 6.05

       capabilities: usb-2.00

       configuration: driver=hub slots=1 speed=480Mbit/s

     *-usb

          description: Keyboard

          product: USB Receiver

          vendor: Logitech

          physical id: 1

          bus info: usb@1:1

          version: 29.01

          capabilities: usb-2.00

          configuration: driver=usbhid maxpower=98mA speed=12Mbit/s

        *-input:0

             product: Logitech Wireless Keyboard PID:4023

             physical id: 0

             logical name: input17

             logical name: /dev/input/event3

             logical name: input17::capslock

             logical name: input17::compose

             logical name: input17::kana

             logical name: input17::numlock

             logical name: input17::scrolllock

             capabilities: usb

        *-input:1

             product: Logitech Wireless Mouse

             physical id: 1

             logical name: input20

             logical name: /dev/input/event4

             logical name: /dev/input/mouse0

             capabilities: usb

  *-usbhost:1

       product: xHCI Host Controller

       vendor: Linux 6.5.0-21-generic xhci-hcd

       physical id: 2

       bus info: usb@2

       logical name: usb2

       version: 6.05

       capabilities: usb-3.00

       configuration: driver=hub slots=1 speed=5000Mbit/s

  *-usbhost:2

       product: xHCI Host Controller

       vendor: Linux 6.5.0-21-generic xhci-hcd

       physical id: 3

       bus info: usb@3

       logical name: usb3

       version: 6.05

       capabilities: usb-2.00

       configuration: driver=hub slots=1 speed=480Mbit/s

     *-usb

          description: USB hub

          product: CY4609

          vendor: Cypress Semiconductor Corp.

          physical id: 1

          bus info: usb@3:1

          version: 50.10

          capabilities: usb-2.10

          configuration: driver=hub slots=4 speed=480Mbit/s

        *-usb:0

             description: Keyboard

             product: Logitech HID compliant keyboard System Control

             vendor: Logitech

             physical id: 2

             bus info: usb@3:1.2

             logical name: input16

             logical name: /dev/input/event1

             logical name: input16::capslock

             logical name: input16::numlock

             logical name: input16::scrolllock

             logical name: input18

             logical name: /dev/input/event2

             logical name: input19

             logical name: /dev/input/event5

             version: 1.80

             capabilities: usb-1.10 usb

             configuration: driver=usbhid maxpower=100mA speed=2Mbit/s

        *-usb:1

             description: USB hub

             product: USB 2.0 Hub

             vendor: Microchip Technology, Inc. (formerly SMSC)

             physical id: 3

             bus info: usb@3:1.3

             version: b.b3

             capabilities: usb-2.00

             configuration: driver=hub maxpower=2mA slots=4 speed=480Mbit/s

  *-usbhost:3

       product: xHCI Host Controller

       vendor: Linux 6.5.0-21-generic xhci-hcd

       physical id: 4

       bus info: usb@4

       logical name: usb4

       version: 6.05

       capabilities: usb-3.00

       configuration: driver=hub slots=1 speed=5000Mbit/s

     *-usb

          description: USB hub

          vendor: Cypress Semiconductor Corp.

          physical id: 1

          bus info: usb@4:1

          version: 50.10

          capabilities: usb-3.00

          configuration: driver=hub slots=4 speed=5000Mbit/s

        *-usb

             description: Mass storage device

             product: SanDisk 3.2Gen1

             vendor: USB

             physical id: 1

             bus info: usb@4:1.1

             logical name: scsi4

             version: 1.00

             serial: 0501643331fb46db684b470e50a4b5c094a79c387f7326976d702543b9aa666308ce000000000000

             capabilities: usb-3.00 scsi emulated scsi-host

             configuration: driver=usb-storage maxpower=896mA speed=5000Mbit/s

           *-disk

                description: SCSI Disk

                product: SanDisk 3.2Gen1

                vendor: USB

                physical id: 0.0.0

                bus info: scsi@4:0.0.0

                logical name: /dev/sda

                version: 1.00

                serial: 0501643331fb46db684b

                size: 14GiB (15GB)

                capabilities: removable

                configuration: ansiversion=6 logicalsectorsize=512 sectorsize=512

              *-medium

                   physical id: 0

                   logical name: /dev/sda

                   size: 14GiB (15GB)

                   capabilities: partitioned partitioned:dos

                   configuration: signature=17b3f8f1

                 *-volume

                      description: Windows FAT volume

                      vendor: mkfs.fat

                      physical id: 1

                      logical name: /dev/sda1

                      logical name: /media/bubba/F(X)

                      version: FAT32

                      serial: 6f90-6712

                      size: 14GiB

                      capacity: 14GiB

                      capabilities: primary fat initialized

                      configuration: FATs=2 filesystem=fat label=F(X) mount.fstype=vfat mount.options=rw,nosuid,nodev,relatime,uid=1000,gid=1000,fmask=0022,dmask=0022,codepage=437,iocharset=iso8859-1,shortname=mixed,showexec,utf8,flush,errors=remount-ro state=mounted

  *-input

       product: Power Button

       physical id: 5

       logical name: input0

       logical name: /dev/input/event0

       capabilities: platform

  *-network

       description: Ethernet interface

       physical id: 6

       logical name: eth0

       serial: d0:63:b4:04:67:8b

       size: 1Gbit/s

       capacity: 1Gbit/s

       capabilities: ethernet physical tp mii 10bt-fd 100bt-fd 1000bt-fd autonegotiation

       configuration: autonegotiation=on broadcast=yes driver=fsl_dpaa2_eth driverversion=6.5.0-21-generic duplex=full firmware=7.17 ip=192.168.101.217 link=yes multicast=yes port=twisted pair speed=1Gbit/s

lspci/lsusb

Code:

0002:01:00.0 Non-Volatile memory controller: Samsung Electronics Co Ltd NVMe SSD Controller SM981/PM981/PM983

0004:01:00.0 VGA compatible controller: Advanced Micro Devices, Inc. [AMD/ATI] Lexa PRO [Radeon 540/540X/550/550X / RX 540X/550/550X] (rev c7)

0004:01:00.1 Audio device: Advanced Micro Devices, Inc. [AMD/ATI] Baffin HDMI/DP Audio [Radeon RX 550 640SP / RX 560/560X]



Bus 004 Device 003: ID 0781:5583 SanDisk Corp. Ultra Fit

Bus 004 Device 002: ID 04b4:6500 Cypress Semiconductor Corp. 

Bus 004 Device 001: ID 1d6b:0003 Linux Foundation 3.0 root hub

Bus 003 Device 004: ID 0424:2514 Microchip Technology, Inc. (formerly SMSC) USB 2.0 Hub

Bus 003 Device 003: ID 046d:c30e Logitech, Inc. UltraX Keyboard (Y-BL49)

Bus 003 Device 002: ID 04b4:6502 Cypress Semiconductor Corp. CY4609

Bus 003 Device 001: ID 1d6b:0002 Linux Foundation 2.0 root hub

Bus 002 Device 001: ID 1d6b:0003 Linux Foundation 3.0 root hub

Bus 001 Device 002: ID 046d:c534 Logitech, Inc. Unifying Receiver

Bus 001 Device 001: ID 1d6b:0002 Linux Foundation 2.0 root hub

PassMark@2.0GHz

Code:

                   PassMark PerformanceTest Linux (11.0.1002)





Cortex-A72 (aarch64)

16 cores @ 0 MHz  |  62.1 GiB RAM

Number of Processes: 16  |  Test Iterations: 1  |  Test Duration: Medium

--------------------------------------------------------------------------------

CPU Mark:                          5080

  Integer Math                     51534 Million Operations/s

  Floating Point Math              20042 Million Operations/s

  Prime Numbers                    22.9 Million Primes/s

  Sorting                          23638 Thousand Strings/s

  Encryption                       1422 MB/s

  Compression                      41362 KB/s

  CPU Single Threaded              552 Million Operations/s

  Physics                          530 Frames/s

  Extended Instructions (NEON)     3422 Million Matrices/s



Memory Mark:                       1215

  Database Operations              4340 Thousand Operations/s

  Memory Read Cached               7530 MB/s

  Memory Read Uncached             6116 MB/s

  Memory Write                     7613 MB/s

  Available RAM                    57643 Megabytes

  Memory Latency                   106 Nanoseconds

  Memory Threaded                  24879 MB/s

--------------------------------------------------------------------------------

PassMark@2.2GHz

Code:

                   PassMark PerformanceTest Linux (11.0.1002)





Cortex-A72 (aarch64)

16 cores @ 0 MHz  |  62.1 GiB RAM

Number of Processes: 16  |  Test Iterations: 1  |  Test Duration: Medium

--------------------------------------------------------------------------------

CPU Mark:                          5554

  Integer Math                     56907 Million Operations/s

  Floating Point Math              22186 Million Operations/s

  Prime Numbers                    23.0 Million Primes/s

  Sorting                          25588 Thousand Strings/s

  Encryption                       1577 MB/s

  Compression                      45227 KB/s

  CPU Single Threaded              608 Million Operations/s

  Physics                          537 Frames/s

  Extended Instructions (NEON)     3786 Million Matrices/s



Memory Mark:                       1315

  Database Operations              4656 Thousand Operations/s

  Memory Read Cached               8286 MB/s

  Memory Read Uncached             6661 MB/s

  Memory Write                     8377 MB/s

  Available RAM                    61744 Megabytes

  Memory Latency                   99 Nanoseconds

  Memory Threaded                  25074 MB/s

--------------------------------------------------------------------------------

perf 2.0GHz

Code:

 Performance counter stats for 'sleep 1':



              1.83 msec task-clock                       #    0.002 CPUs utilized             

                 1      context-switches                 #  546.999 /sec                      

                 0      cpu-migrations                   #    0.000 /sec                      

                69      page-faults                      #   37.743 K/sec                     

           3615631      cycles                           #    1.978 GHz                       

           1926895      instructions                     #    0.53  insn per cycle            

         branches                                                              

             19690      branch-misses                                                         



       1.003565332 seconds time elapsed



       0.003576000 seconds user

       0.000000000 seconds sys

perf 2.2GHz

Code:

 Performance counter stats for 'sleep 1':



              1.70 msec task-clock                       #    0.002 CPUs utilized             

                 1      context-switches                 #  588.361 /sec                      

                 0      cpu-migrations                   #    0.000 /sec                      

                68      page-faults                      #   40.009 K/sec                     

           3688141      cycles                           #    2.170 GHz                       

           1937926      instructions                     #    0.53  insn per cycle            

         branches                                                              

             17850      branch-misses                                                         



       1.003154450 seconds time elapsed



       0.003193000 seconds user

       0.000000000 seconds sys

glmark2

Code:

=======================================================

    glmark2 2023.01

=======================================================

    OpenGL Information

    GL_VENDOR:      AMD

    GL_RENDERER:    AMD Radeon RX 550 / 550 Series (polaris12, LLVM 15.0.7, DRM 3.54, 6.5.0-21-generic)

    GL_VERSION:     4.6 (Compatibility Profile) Mesa 23.2.1-1ubuntu3.1

    Surface Config: buf=32 r=8 g=8 b=8 a=8 depth=24 stencil=0 samples=0

    Surface Size:   1920x1080 windowed

=======================================================

[build] use-vbo=false: FPS: 2858 FrameTime: 0.350 ms

[build] use-vbo=true: FPS: 3525 FrameTime: 0.284 ms

[texture] texture-filter=nearest: FPS: 3434 FrameTime: 0.291 ms

[texture] texture-filter=linear: FPS: 3445 FrameTime: 0.290 ms

[texture] texture-filter=mipmap: FPS: 3439 FrameTime: 0.291 ms

[shading] shading=gouraud: FPS: 3240 FrameTime: 0.309 ms

[shading] shading=blinn-phong-inf: FPS: 3235 FrameTime: 0.309 ms

[shading] shading=phong: FPS: 3185 FrameTime: 0.314 ms

[shading] shading=cel: FPS: 3131 FrameTime: 0.319 ms

[bump] bump-render=high-poly: FPS: 2981 FrameTime: 0.336 ms

[bump] bump-render=normals: FPS: 3462 FrameTime: 0.289 ms

[bump] bump-render=height: FPS: 3423 FrameTime: 0.292 ms

[effect2d] kernel=0,1,0;1,-4,1;0,1,0;: FPS: 2201 FrameTime: 0.454 ms

[effect2d] kernel=1,1,1,1,1;1,1,1,1,1;1,1,1,1,1;: FPS: 996 FrameTime: 1.005 ms

[pulsar] light=false:quads=5:texture=false: FPS: 3011 FrameTime: 0.332 ms

[desktop] blur-radius=5:effect=blur:passes=1:separable=true:windows=4: FPS: 1203 FrameTime: 0.831 ms

[desktop] effect=shadow:windows=4: FPS: 2183 FrameTime: 0.458 ms

[buffer] columns=200:interleave=false:update-dispersion=0.9:update-fraction=0.5:update-method=map: FPS: 658 FrameTime: 1.520 ms

[buffer] columns=200:interleave=false:update-dispersion=0.9:update-fraction=0.5:update-method=subdata: FPS: 1029 FrameTime: 0.972 ms

[buffer] columns=200:interleave=true:update-dispersion=0.9:update-fraction=0.5:update-method=map: FPS: 1113 FrameTime: 0.899 ms

[ideas] speed=duration: FPS: 2348 FrameTime: 0.426 ms

[jellyfish] : FPS: 2264 FrameTime: 0.442 ms

[terrain] : FPS: 266 FrameTime: 3.770 ms

[shadow] : FPS: 2912 FrameTime: 0.344 ms

[refract] : FPS: 430 FrameTime: 2.330 ms

[conditionals] fragment-steps=0:vertex-steps=0: FPS: 3456 FrameTime: 0.289 ms

[conditionals] fragment-steps=5:vertex-steps=0: FPS: 3441 FrameTime: 0.291 ms

[conditionals] fragment-steps=0:vertex-steps=5: FPS: 3451 FrameTime: 0.290 ms

[function] fragment-complexity=low:fragment-steps=5: FPS: 3435 FrameTime: 0.291 ms

[function] fragment-complexity=medium:fragment-steps=5: FPS: 3410 FrameTime: 0.293 ms

[loop] fragment-loop=false:fragment-steps=5:vertex-steps=5: FPS: 3358 FrameTime: 0.298 ms

[loop] fragment-steps=5:fragment-uniform=false:vertex-steps=5: FPS: 3397 FrameTime: 0.294 ms

[loop] fragment-steps=5:fragment-uniform=true:vertex-steps=5: FPS: 3113 FrameTime: 0.321 ms

=======================================================

                                  glmark2 Score: 2636 

=======================================================

Ovo nije loše, kada gledam opterečenje pri reprodukciji Youtube i temperature su sasvim pristojne.

Citiraj:

Autor Dottore (Post 3732353)

Ovo nije loše, kada gledam opterečenje pri reprodukciji Youtube i temperature su sasvim pristojne.

Cak i ovo LC djubre moze ohladiti 30W TDP-a, iako se pri ozbiljnom dugotrajnom loadu popne do ~55C… Iskreno, veca poanta je bila da ne buci i da ne moram opet do trgovine po novi Grunf mod, tako da ovo radi sasvim OK!

Ej Bubba, dottore mi skrenuo paznju na ovaj tvoj mini projektic... Stvarno, svaka cast... :) Podsjetio si me na mene kada sam kemijao sa overvoltanjem ventilatora i ostale pizd*rije koje sam radio kad sam bijo mlad... sustipletican... itd itd... :D

Citiraj:

Autor calypso (Post 3736528)

Brate moj dobri, pa upravo si ti bio moj prvi idol u tim pizdarijama kada si me iz osnovne skole pokupio i vodao po Flyu, pokazivao cuda i svasta... <3 #noHomo :*