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Staro 16.06.2018., 14:45   #4591
Manuel Calavera
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AMD Reaffirms 7nm EPYC ‘ROME’ Server Processors Sampling in 2H 2018, Availability in 2019 – To Bring Core Count Bump, More Bandwidth, Increase I/O


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Forrest Nord also mentioned that they are going to bring Zen 4 and Zen 5 architecture based processors in the post-2020 era. There were no details mentioned but it’s great to see that AMD is following a long-term roadmap which will make Intel think twice about their own roadmap which includes an entirely next-gen core architecture beyond 2020.

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Staro 18.06.2018., 17:56   #4592
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Autor Manuel Calavera Pregled postova
Pročitao sam da bi mogla ići do 17$ (mislim da se odnosi do kraja godine).

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Staro 19.06.2018., 19:23   #4593
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AMD Ryzen Threadripper 2990X Flagship 32 Core, 64 Thread 4.00 GHz

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[URL="https://wccftech.com/amd-ryzen-threadripper-2990x-32-core-64-thread-cpu-specs-performance-overclock-leak/"]

Evo, nakon današnje objave da izlazi i ova zvijer uskoro, ići će to još i više do 20$ ....
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Staro 19.06.2018., 19:28   #4594
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[URL="https://wccftech.com/amd-ryzen-threadripper-2990x-32-core-64-thread-cpu-specs-performance-overclock-leak/"]

Evo, nakon današnje objave da izlazi i ova zvijer uskoro, ići će to još i više do 20$ ....
Službeno je objavljeno da threadripper ide do 32 jezgre još prije 2 tjedna (baci oko na prošlu stranicu). Zbog toga, a ponajviše zbog sve većeg marketsharea epyca na serverskom tržištu se ovaj rast i dogodio (uz pokazanu slabost intela). Uglavnom već je ispod 17$, no kao što smo komentirali iza stalno se klacka za par dolara, prije ovoga uglavnom između 11 i 14$

Zadnje izmijenjeno od: Manuel Calavera. 19.06.2018. u 19:36.
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Staro 22.06.2018., 18:32   #4595
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TSMC ramping up 7nm chip production
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TSMC has started commercial production of chips built using 7nm process technology, according to company CEO CC Wei. The foundry is also scheduled to move a newer 5nm node technology to mass production at the end of 2019 or early-2020. The ramp-up of 7nm chip output will boost TSMC's overall production capacity to 12 million 12-inch equivalent wafers in 2018, up 9% from 10.5 million units in 2017, Wei indicated, without elaborating on specific orders and customers. TSMC will tape out more than 50 chip designs with its 7nm process technology by the end of 2018. AI, GPU and cryptocurrency applications take up the majority of the tape-outs, followed by 5G and application processors. TSMC will also start taping out chips built using an enhanced 7nm node with EUV in the second half of 2018. The foundry expects to move the node to risk production in the third quarter. The foundry has secured 7nm chip orders from about 20 customers including AMD, Bitmain, nVidia and Qualcomm. The majority of the orders will be carried out in the first half of 2019, the sources said.
Izvor: DigiTimes
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Staro 24.06.2018., 01:05   #4596
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wccf


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That much is already known but the more interesting revelations in this report are that TSMC is expecting to win orders for AMD CPUs too. The only CPU that AMD has in their pipeline and uses 7nm process is the upcoming Zen 2 architecture which will be a big leap for the company in terms of performance and efficiency. The Zen 2 architecture will be deployed first in the 7nm EPYC Rome processors which are arriving next year and compete favorably against the Intel’s yet to launch, 10nm Ice Lake-SP processors, based on AMD’s internal performance estimates.

If the contract for 7nm CPUs is official, then it won’t only be a huge win for TSMC but it would also be a big win for AMD themselves as TSMC is currently one of the topmost and state of the art, semiconductor manufacturing company and have delivered multiple products based on their FinFET technologies to companies such as Apple, NVIDIA, and Qualcomm. The 7nm TSMC process is expected to deliver a 35% increase in efficiency and yields compared to 16FF+. According to the US Technology Forum, 50% of the wafers will be completed this year and production capacity is expected to increase 3 times by next year.
...
Also, AMD can select and use Fabs of both TSMC and Global Foundries to create their next-gen processors. This is made possible by Global Foundries using similar 7nm pitches and SRAM cells that are very close in design to TSMC, allowing Zen 2 7nm processors to be developed on either Fab without major differences.

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Staro 27.06.2018., 08:39   #4597
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AMD tackles coming "Chiplet" revolution with new chip network scheme
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With Moore's Law being pronounced as within its death throes, historic monolithic die designs are becoming increasingly expensive to manufacture. It's no secret that both AMD and nVidia have been exploring an MCM (Multi-Chip-Module) approach towards diverting from monolithic die designs over to a much more manageable, "chiplet" design. This "chiplet" approach is easy to understand - smaller, leaner chips can be produced with higher yields than large, monolithic ones, which are more prone to silicon defects. This increased yield allows AMD to reduce manufacturing costs and increase production efficiency by using a single mask for a quad-core module, for instance.
However, as the number of modules in a given chip increase, so does complexity of signal processing and routing - two modules communicating with each other is relatively easy to achieve, but six or eight modules? The challenge becomes increasingly greater when joining different types of chips - from memory to processing dies and I/O controllers - in a single silicon slice. This is where interposers appear - and where AMD is taking strides towards achieving an active interposer design. For now, AMD says these active interposers ought to be reserved for high-performance designs - not surprising, given the added R&D cost over passive interposer or sans-interposer design. The dream to mix and match and reuse different IPs at will via a "simple" substrate, however, is very much alive.

AMD researchers proved that for 32-core processors - with possibilities of scaling with estimated monolithic die complexity versus the chiplet approach - could be achieved with much better yield and lower manufacturing cost in the chiplet + passive/active interposer design versus a monolithic 16nm die.
Izvor: TechPowerUp, Guru3D, IEEE Spectrum + PDF (1 - 2)

Zadnje izmijenjeno od: The Exiled. 15.07.2018. u 15:16.
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Staro 30.06.2018., 00:44   #4598
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Evo još malo dobrih vijesti...


[URL="https://wccftech.com/amd-ryzen-threadripper-cpu-prices-fall-e650-750-1950x/"]

Zadnje izmijenjeno od: BusMaster. 30.06.2018. u 00:47. Razlog: Pogrešni unos..sorry
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Staro 11.07.2018., 00:41   #4599
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