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Staro 03.03.2022., 14:18   #9541
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Universal Chiplet Interconnect Express (UCIe) Announced: AMD, ARM, Intel, TSMC and Samsung all support 'Chiplets' for future processor design
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If there has been one prominent, industry-wide trend in chip design over the past half-decade or so, it has been the growing use of chiplets. The tiny dies have become an increasingly common feature as chip makers look to them to address everything from chip manufacturing costs to the overall scalability of a design. In short, chiplets are no longer experimental designs that need to be proven, but instead have become proven designs that chip makers can rely on. And with that increasing reliance on chiplet technology comes the need for design roadmaps and stability – the need for design standards.

To that end, today Intel, AMD, Arm, and all three leading-edge foundries are coming together to announce that they are forming a new and open standard for chiplet interconnects, which is aptly being named Universal Chiplet Interconnect Express, or UCIe. Taking significant inspiration from the very successful PCI-Express playbook, with UCIe the involved firms are creating a standard for connecting chiplets, with the goal of having a single set of standards that not only simplify the process for all involved, but lead the way towards full interoperability between chiplets from different manufacturers, allowing chips to mix-and-match chiplets as chip makers see fit. In other words, to make a complete and compatible ecosystem out of chiplets, much like today’s ecosystem for PCIe-based expansion cards.

To be sure, monolithic chips as a whole aren’t going away entirely (moving data remains expensive), but the economics of chip design are inexorably driving the use of chiplets in more cases. Meanwhile there is also a push for performance and efficiency that is driving the ongoing interest in chiplets. That also means that existing interconnect protocols, such as AMD’s Infinity Fabric, aren’t likely to be going anywhere, even with the introduction of UCIe. Protocols like IF are still far more complex and specialized than what PCIe/CXL are capable of, which makes sense given the very specific coherency requirements for linking up CPU cores and I/O dies. Put another way, the very cutting edge of chiplet design remains ahead of where UCIe 1.0 is starting things off.
Izvor: AnandTech i HPCwire
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Staro 03.03.2022., 14:44   #9542
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Pa zar će i Intel koristiti "ljepilo"?
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Staro 03.03.2022., 14:49   #9543
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Ne samo to, nego je cijela stvar prezentirana kao njihova ideja i inicijativa.
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Staro 03.03.2022., 15:37   #9544
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Ne samo to, nego je cijela stvar prezentirana kao njihova ideja i inicijativa.
Naravno, zašto se ne čudim
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Staro 10.03.2022., 15:34   #9545
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Russia’s invasion of Ukraine adds to pressure on chip supply chain https://www.ft.com/content/ac8733c4-...8-4997a77ad33f

Ukraine Crisis Cuts Neon Supply And Could Worsen Chip Shortage https://www.motor1.com/news/571764/u...p-crisis-neon/

TSMC 3nm Yield Problems May Derail AMD's CPU Plans https://www.tomshardware.com/news/ts...amds-cpu-plans

TSMC Potentially Facing 3nm Yield Problems, Could Spell Problems For AMD & NVIDIA, Opportunity for Intel https://wccftech.com/tsmc-potentiall...ity-for-intel/



Ukraine supplies 70 percent of the world's output of neon, a critical gas that runs lasers needed to manufacture microchips.





Nekoliko mjeseci "stari" ali itekako relevantni video uradci:





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Zadnje izmijenjeno od: Blue Spirit. 10.03.2022. u 16:57.
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Staro 10.03.2022., 16:27   #9546
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  • TSMC 3nm Yield Problems May Derail AMD's CPU Plans

  • TSMC Potentially Facing 3nm Yield Problems, Could Spell Problems For AMD & NVIDIA, Opportunity for Intel
Na stranu Wccftech i njihovi kontradiktorni članci i popratne analize, ali super mi je kak Intel zajedno s novim CEO-om uporno cijelu stvar prikazuje kao da su oni totalno samostalni i potpuno neovisi, do te mjere da se većina toga kaj kruži diljem Interneta, doima kao da Intel sam proizvodi svoje EUV mašine i imaju poseban recept za nanometre, dok su danas više, nego ikad ovisni o TSMC konkurenciji. Ukoliko ASML ili TSMC i malo posrnu, tj. spotaknu se za milimetar, a kamoli da naprave totalno krivi korak, ode sve nizbrdo: Intel, AMD, nVidia, ARM, itd., svi zajedno imaju zajeb svih zajeba i nijedan od njihovih planova za nadolazeće proizvode više nema uporište. Intel je tu IMHO najviše pogođen, jer su i dosad sve najavljeno odgađali u nedogled, do te mjere da su naposljetku odlučili kompletno preimenovati vlastite proizvodne procese, jer jedino to ih vraća u poziciju gdje mogu reći da su konkurentni. I onda povrh svega ovaj CEO koji jednostavno ne prestaje pričati, sve zajedno pakira u kontekstu da su oni najbolji, ali surađuju s ASML-om i TSMC-om, tako da pomognu tim firmama, jer su baš super. Mislim, komedija samo takva, frajer uporno iz dana u dana priča kak su Intel krafne najbolje, ali da bi bile najbolje, mora prvo kod nekog drugog (ASML) dobiti najbolju opremu za pripremu tih krafni i najbolje sastojke, tako da onda treća strana (TSMC) zahvaljujući superiornoj poziciji na tržištu, može za Intel pripremiti te njihove najbolje krafne.

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Intel will rely on TSMC for its rebound
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Intel is increasing its reliance on erstwhile rival Taiwan Semiconductor Manufacturing Co. (TSMC) in its attempt to boost sales and eventually regain dominance as the world leader in manufacturing scale and chip process technology. California-based Intel will join Apple to order the world’s first 3-nm chips from TSMC as the Taiwan chip foundry ramps up its newest process this year, according to three analysts surveyed. Intel and Apple are likely to be the only two TSMC customers at that most-advanced node during the ramp-up, according to the analysts. Intel’s leap depends on TSMC’s help at the 5- and 3-nm nodes. One of the challenges will be combining chiplets from TSMC with other chiplets made internally by Intel into one device like the Ponte Vecchio; that will involve matching chiplets made in TSMC’s 5nm process with Intel’s own silicon, using Intel’s new packaging technologies, which include embedded multi-die interconnect bridge (EMIB) and Foveros.

Intel’s plan will count heavily on ASML’s high NA extreme ultraviolet (EUV) lithography tools. Intel is ASML’s first high-NA customer in an EUV business (which currently includes only a handful of customers, including TSMC, Samsung, Intel and Micron). TSMC foundry rivals Samsung and Intel are leading in the adoption of gate all around 3D technology combined with EUV in hopes of surpassing the FinFET and EUV knowhow that TSMC has used to maintain sales and process leadership.TSMC will start production of its “N3” (3 nm process) with its top-two clients Intel and Apple doing small-volume wafer production in late 2022, according to Credit Suisse analyst Randy Abrams in a report provided to EE Times. TSMC will see N3 revenue kicking in by the first quarter of 2023, around the time Samsung ramps up GAA.
Izvor: EETimes
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Staro 26.03.2022., 01:39   #9547
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Kad se mogu ocekivati Apu 6000 za desktop? Laptopi sa Apu Rdna 2 grafikom su vec u prodaji.
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Staro 30.03.2022., 13:57   #9548
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AMD Ryzen 7000 "Raphael" Zen 4 CPU enter mass-production by April-May?
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AMD Ryzen 7000 Zen 4 could come as early as summer the plant for assembling the CPUs (packaging) is said to have already made preparations for the start of production of Raphael aka Ryzen 7000 in April or May. With reference to earlier periods of four or five months between the start of production and the market launch, a window of August to October can be speculated. "Raphael" is a multi-chip module of "Zen 4" CCDs fabricated on the TSMC N5 (5 nm) node, combined with a cIOD built on a yet-unknown node. A plant in China performs packaging. The "Zen 4" CPU cores are expected to introduce an IPC increase, as well as higher clock speeds. Also on offer will be next-gen connectivity, including PCI-Express Gen 5 (including CPU-attached Gen 5 NVMe), and DDR5 memory. These processors will launch alongside Socket AM5 motherboards based on the new AMD 600 series chipsets.
Izvor: TechPowerUp
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Zadnje izmijenjeno od: The Exiled. 30.03.2022. u 14:45.
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Staro 09.05.2022., 19:05   #9549
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AMD's Phoenix APU will reportedly challenge Nvidia's mobile RTX 3060 with integrated graphics
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Phoenix is a mobile CPU from AMD that will feature Zen 4 CPU cores, feature PCIe 5.0 support, and will reportedly feature up to eight CPU cores and a powerful integrated graphics processor. It is claimed that this APU will feature AMD's RDNA 3 graphics architecture, adding to it design improvements over today's RDNA 2 based graphics chips. If AMD can deliver mid-level discrete gaming performance with their Phoenix APU, AMD will be able to offer OEMs a solution that will deliver ample gaming performance for many users, require a simplified cooling setup (as only a single processor needs to be cooled), and potentially enable the creation of slimmer gaming notebooks. AMD's Phoenix APU will outperform nVidia's RTX 2060 and AMD's RX 6500 XT. The iGPU reportedly clocks to 3GHz or more, and the CPU side of Phoenix reportedly had a base clock speed of 4 GHz and a single core boost clock speed of 5GHz. With Phoenix, AMD's is reportedly moving its mobile products to Zen 4 CPU cores and an RDNA 3 graphics component. Two architectural leaps within a single product generation. Beyond that, Phoenix will likely be manufactured using 5nm silicon, delivering additional power efficiency and performance benefits.
Izvor: OC3D
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Staro 13.05.2022., 08:21   #9550
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Staro 20.05.2022., 20:31   #9551
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AMD signals its intent to showcase Zen 4 at Computex 2022
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At Computex, AMD is likely to showcase their upcoming Ryzen 7000 series processors alongside their new AM5 motherboard platform. Multiple motherboard manufacturers have already confirmed that they will be showcasing X670 motherboards at Computex, which means that we should learn a lot more about AMD's future products at the event. AMD's Ryzen 7000 series processors will use Zen 4 cores, will deliver consumers higher clock speeds than their existing Zen 3 counterparts, support DDR5 memory, and support PCIe 5.0 connectivity. With their Ryzen 7000 series, AMD plans to deliver once of their largest generational performance leaps to date. AMD's Computex 2022 keynote will be hosted on May 23rd at 2 pm Taipei time. For viewers in the UK, this translates to 7 am UK time.
Izvor: OC3D
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Staro 23.05.2022., 15:47   #9552
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Kreće lagano vlakić za Zen4:





TLDR:

5,3-5,5ghz SC boost 5.0ghz AC boost
Svi Ryzeni će imati RDNA2 iGPU kao i Intelovi procovi
cca 15% veći IPC u odnosu na Zen3

2 chipseta tj kao fol 3:
-X670 extreme za OCere
-X670 normalan
-B650 PCIe 5.0 samo za nvme, grafa je valjda 4.0
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Zadnje izmijenjeno od: Disco. 23.05.2022. u 16:42.
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Staro 23.05.2022., 16:50   #9553
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Staro 23.05.2022., 18:15   #9554
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IPC će vjerojatno biti veći za 3-5%, ako uopće bude i toliko, AMD je sad samo rekao za ukupne ST performanse da su najmanje 15% više od Zen 3. To ukuljučuje IPC + clock.
za B650 može i slot za grafičku biti 5.0, ali nije obavezno. Ionako taj slot ide direkt iz CPU-a i nema veze s chipsetom.
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Staro 23.05.2022., 18:43   #9555
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IMHO na kraju budu IPC računice slične onima (1 - 2) za Zen 3, ali morali budemo pričekati službene recenzije za detalje, mada sve u svemu izgleda obećavajuće. Nagurali su dosta toga u novu platformu.
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  • Zen 4 will come with 1MB of L2 cache per CPU core, which is twice the amount of L2 cache as found on Zen 3 (and Zen 2) CPU cores

  • AMD is adding some instructions for manipulating data with common AI data formats such as bfloat16 and int8/int4

  • as a result of these cache, architectural (IPC), and clockspeed improvements, AMD is touting a greater than 15% increase in single-threaded performance

  • Cinebench is a single benchmark, and for the moment we don't have any further information on what core architectural changes AMD has made
Izvor: AnandTech
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Zadnje izmijenjeno od: The Exiled. 23.05.2022. u 18:54.
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Staro 24.05.2022., 10:13   #9556
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Ma kakogod bi IMHO trebalo pričekati Zen5, a i više detalja o Zen4.
Heatspreader mi izgleda grozno i tu će biti fešta kada se pasta zavuče posvuda.
Nadam se da su ovaj put poradili na disipaciji topline, pa da će se toplina bolje prenositi nego na Zen 2 i 3.
A i vidim ne spominje se 3DC, dakle i u ovoj genreaciji će to biti za ''gaming'' CPU-e izgleda, to sam i pomislio.
Najbolja stvar mi je iGPU, to je spas ako crkne grafa.
Spominje se da će to biti nešto jako rudimentarno, a da bi trebali izaći i APUi sa jačim RDNA iGPU-ima.
No to su sve nagađanja dok ne dobijemo potvrdu.
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Staro 24.05.2022., 11:18   #9557
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IPC će vjerojatno biti veći za 3-5%, ako uopće bude i toliko, AMD je sad samo rekao za ukupne ST performanse da su najmanje 15% više od Zen 3. To ukuljučuje IPC + clock.
za B650 može i slot za grafičku biti 5.0, ali nije obavezno. Ionako taj slot ide direkt iz CPU-a i nema veze s chipsetom.
Postavlja se pitanje kako nisu mogli izvući više od 5nm procesa, nove platforme, ddr5, i većeg power limita. Imam osjećaj da su sve resurse usmjerili na AM5 platformu koja je lijepo opremljena, hrpa usb portova i čega sve ne, a Zen 4 onako usput napravili kao testni procesor, i da će Zen 5 biti prvi punokrvni procesor na toj platformi.
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Staro 24.05.2022., 13:37   #9558
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IPC će vjerojatno biti veći za 3-5%, ako uopće bude i toliko, AMD je sad samo rekao za ukupne ST performanse da su najmanje 15% više od Zen 3. To ukuljučuje IPC + clock.
za B650 može i slot za grafičku biti 5.0, ali nije obavezno. Ionako taj slot ide direkt iz CPU-a i nema veze s chipsetom.
U pravu si, ne spominju 15% IPC, nego singlethread, a clock je značajno viši, što znači da je IPC pomak mali

Također uspoređuju sa običnim Zen 3, ne i sa ovim 3d chache, pa je pitanje koliko i dali će to biti brže od 5800X3D u singlethreadu, gamingu....

Ispada da bi takve performanse, odnosno malo bolje samo postale standard po svim linijama, a ne kao ovaj 5800X3d, kao poseban skupi gaming cpu

BTW ovaj zen 4 je dizajniran naknadno, jer su u doba Jim Kellera udarili temelje sve do zen 3. Nadam se da zen arhitektura ne posustaje, no bez nekog velikog IPC pomaka, tu nije ni napravljen core/thread bump, tako da iskreno nisam nešto jako impresioniran. Jedino je clock impresivan, no tu je vjv node odradio svoje

Priča se da ni Raptor Lake nema neki veliki IPC bump (cca 5%), što nije u skladu s drugim leakovima, tako da je sve upitno. No i intelu će clock rasti, te bi efikasnost trebala biti bolja
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Staro 24.05.2022., 13:48   #9559
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Da, ovo se više čine kao poboljšanja proizvodnog procesa nego pomaci u arhitekturi.

Pitanje je da li će stavljati taj dodatni cache, imaju li taj dizajn planiran (odnosno već mora biti gotov) ili dolazi kasnije kao refresh, i kako će to tehnički funkcionirati pokraj povećane potrošnje (170W). Možda je dobitak od cachea manji od dobitka na frekvenciji, pa ga nema smisla stavljati na ovako vruć procesor?
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Staro 24.05.2022., 15:23   #9560
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Čisto da se poCjetimo: Kaj se same Zen 4 arhitekture tiče, obzirom da pripremaju 96 i 128-core modele EPYC modele, posustajanja nema, jedino desktop ostaje na "samo" 16C/32T kombinaciji, ako se i to do jeseni ne presloži, jer nije ovo prvi put da AMD nešto pokaže, a na kraju imaju još toga za dodati, a da nije bilo u procurenim materijalima diljem neta. Sve u svemu IMHO, AMD nakon svega kaj su dosad plasirali na tržište, ne bude odustal samo tako, mada bude se Zen arhitektura u jednoj od svojih nadolazećih iteracija sigurno izmijenila skoro kompletno. Mislim, od 2017. i Intelovog ismijavanja, u 5 godina smo došli do toga da Intel radi iste stvari koje je AMD prezentiral s prvom Zen generacijom, tak očito nekog vraga rade kak spada: chiplet dizajn, MCM pristup svemu, stacked + infinity cache i ko zna kaj još imaju spremno za godine koje dolaze.
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Staro 24.05.2022., 15:44   #9561
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Da, ovo se više čine kao poboljšanja proizvodnog procesa nego pomaci u arhitekturi.

Pitanje je da li će stavljati taj dodatni cache, imaju li taj dizajn planiran (odnosno već mora biti gotov) ili dolazi kasnije kao refresh, i kako će to tehnički funkcionirati pokraj povećane potrošnje (170W). Možda je dobitak od cachea manji od dobitka na frekvenciji, pa ga nema smisla stavljati na ovako vruć procesor?
Osim u gamingu taj cache nije donio neka poboljšanja u ostalim benchmarcima. Čak je u masu benchmarka 3d sporiji od običnog zbog manjeg clocka. Tako da defintivno jest bolji pomak u arhitekturi zen4 pa onda pomaka bude u svemu cca 15%, nego stackati taj cache. Naravno uvijek mogu poslije izbaciti te 3d gaming verzije
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Staro 24.05.2022., 16:21   #9562
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Tak i bude, 3D cache Zen 4 modeli kasnije, a 3D cache općenito je primarno namijenjen EPYC modelima, dok usput ima koristi od toga na drugim sistemima i sustavima.
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Staro 24.05.2022., 18:07   #9563
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Postavlja se pitanje kako nisu mogli izvući više od 5nm procesa, nove platforme, ddr5, i većeg power limita. Imam osjećaj da su sve resurse usmjerili na AM5 platformu koja je lijepo opremljena, hrpa usb portova i čega sve ne, a Zen 4 onako usput napravili kao testni procesor, i da će Zen 5 biti prvi punokrvni procesor na toj platformi.
Premalo informacija imamo za bilo kakav zaključak. Službeno su rekli samo da je 15% brži u 1T CB R23 benchu (Ryzen 9 5950X vs 16 jezgreni Ryzen 7000) i da je brži u blenderu od 12900K. Bilo je za očekivati da će trošiti više zbog iGPU i PCIE 5.0 podrške.
Ryzen 7 5800X3D ima cca 35% slabiji rezultat u 1T CB R23 testu od 12900KS, ali u igrama su izjednačeni.
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U pravu si, ne spominju 15% IPC, nego singlethread, a clock je značajno viši, što znači da je IPC pomak mali
Također uspoređuju sa običnim Zen 3, ne i sa ovim 3d chache, pa je pitanje koliko i dali će to biti brže od 5800X3D u singlethreadu, gamingu....
Mislim da AMD mudro šuti i skriva performanse u igrama. CB R23 nema koristi od velikog cachea. Zen 4 će vjerojatno imati all-core boost od 5+ GHz (barem 8 jezgreni model) i ima duplo više L2 cachea. Mislim da će to biti dovoljno da u igrama bude brži od 5800X3D.
5800X3D ima all-core clock od oko 4,3 GHz, 5800X ~4,6 GHz.
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Staro 24.05.2022., 18:20   #9564
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Premalo informacija imamo za bilo kakav zaključak. Službeno su rekli samo da je 15% brži u 1T CB R23 benchu (Ryzen 9 5950X vs 16 jezgreni Ryzen 7000) i da je brži u blenderu od 12900K. Bilo je za očekivati da će trošiti više zbog iGPU i PCIE 5.0 podrške.
Ryzen 7 5800X3D ima cca 35% slabiji rezultat u 1T CB R23 testu od 12900KS, ali u igrama su izjednačeni.

Mislim da AMD mudro šuti i skriva performanse u igrama. CB R23 nema koristi od velikog cachea. Zen 4 će vjerojatno imati all-core boost od 5+ GHz (barem 8 jezgreni model) i ima duplo više L2 cachea. Mislim da će to biti dovoljno da u igrama bude brži od 5800X3D.
5800X3D ima all-core clock od oko 4,3 GHz, 5800X ~4,6 GHz.
Cache čuda radi da, no i Intel se fokusirao na cache u RPL arhitekturi, i imat će ih više nego Zen 4, zato je upitno da li će i u igrama biti išta bolje, jedino da u startu nude 3dcache.
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Staro 24.05.2022., 22:16   #9565
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Staro 25.05.2022., 19:55   #9566
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Jao, koji lik . Konačno mu se ostvarila prognoza o "Zen 2" na 5GHz od prije 2 godine.
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Staro 26.05.2022., 19:52   #9567
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Why Ryzen was amazing and the haters were all wrong
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The plan as we understood it back in 2017 when Ryzen first burst onto the scene was that those investing in a 300-series AM4 motherboard would be able to upgrade to a 2nd or 3rd generation Ryzen CPU, or any other chip released up until 2020. This remains a big deal and in our opinion platform longevity was part of Ryzen's competitive advantage and success story. We have faced a lot of criticism for recommending AMD, especially in the earlier days, though of course that goes both ways as recent recommendations for Intel Alder Lake CPUs have caught their own blow back, but, we're not here to discuss that today. Therefore it's fair to say at this point, if you bought into Ryzen back in 2017 you made the right choice and I have to admit early on I was a bit skeptical of Ryzen as it didn't exactly burst onto the scene issue free, but many of the bugs did get ironed out and today even using a Ryzen 5000 series processor on a 300-series motherboard is a great experience.
Izvor: TechSpot
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AMD Clarifies Ryzen 7000 "Zen 4" TDP and Power Limits: 170W TDP, 230W PPT
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The mention of "170 W" in one of the slides of AMD's Computex 2022 reveal of the upcoming Ryzen 7000 "Zen 4" desktop processors, caused quite some confusion as to what that figure meant. AMD issued a structured clarification on the matter, laying to rest the terminology associated with it. Apparently, there will be certain SKUs of Socket AM5 processors with TDP of 170W. This would be the same classical definition of TDP that AMD has been consistently using. The package-power tracking (PPT), a figure that translates as power limit for the socket, is 230W.

This does not necessarily mean that there will be a Ryzen 7000-series SKU with 170W TDP. AMD plans to give AM5 a similar life-cycle to AM4, which is now spanning five generations of Ryzen processors, and the 170W TDP and 230W PPT figures only denote design goals for the socket. AMD, in a statement, explained why it needed to make AM5 capable of delivering much higher power than AM4 could—to enable higher CPU core-counts in the future, more on-package hardware, and for new capabilities like power-hungry instruction-sets (think AVX-512). AMD has been calculating PPT as 1.35 times TDP, since the very first generation of Ryzen chips. For a 105W TDP processor, this means 140W PPT, and the same formula continues with Ryzen 7000 series (230W is 1.35x 170W).
Izvor: TechPowerUp
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Staro 26.05.2022., 22:44   #9568
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Adored opet nastavlja sa svojim teorijama . Jedini način da AMD ponudi više od 16 jezgri je kombinacija Zen 4 chipleta s 8 jezgri i Zen 4c chipleta sa 16 jezgri. Time bi dobili 24 jezgre, kao i Raptor Lake, ali možda više threadova (48), ako Zen 4c podržava SMT.

AMD Answers Our Zen 4 Tech Questions, with Robert Hallock
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16-core, 32-thread is the maximum core configuration for the Ryzen 7000 at launch?
That is correct.

What are your thoughts on 3D Vertical Cache (3DV Cache) for Zen 4?
3DV Cache will absolutely be a continuing part of our roadmap. It is not a one-off technology. We are a big believer in packaging as a competitive advantage for AMD, something that could meaningfully enhance performance for people, but we have nothing specific to announce for Zen 4 yet.

Is integrated graphics standard on most SKUs?
IGP is standard. It's included on all 6 nanometer IO dies, which has a small number of compute units built in, specifically to enable video encode & decode and multiple display outputs. Integrated graphics is very relevant for the commercial market, where most of our CPUs have not had graphics, that's a big customer appetite, they don't buy discrete GPUs. Now we have a much richer portfolio of processors that can play into the commercial space. For enthusiasts, it will help diagnose a bad graphics card to get the system up and running when you're still waiting on the GPU to show up. The iGPU configuration [specifications] are consistent, and all of the CPUs will have it.

There's a bit of confusion about the CPU's PCIe 5.0 configuration. We've seen 24 and 28 lanes mentioned. Could you clarify?
There are 28 total lanes from the CPU, all Gen 5, of which 4 are peeled off for downlink to the chipset and the remaining 24 are available to the user. On X670 Extreme that means graphics operates at x16 Gen 5 or x8/x8 Gen 5, and there's one M.2 NVMe x4 Gen 5. On the X670 (non-Extreme) only the M.2 NVMe slot is required to be Gen 5, the top slot for graphics will optionally be Gen 5. On B650, only M.2 storage will be Gen 5. Of course, other components, like companion controllers or additional NVMe devices, can connect to Gen 5 on the CPU.

Izvor: TechPowerUp
Malo su pojasnili neke sitnice. iGPU je znači tu tek toliko da prikaže sliku na ekranu i da radi decode/encode video materijala. I baš su išli all-in za DDR5 i PCIE 5.0. Ima dovoljno PCIE 5.0 staza da se spoje GPU i 2 M.2 SSD-a direkt na CPU i još ostane 4x za chipset. Sve u svemu, AM5 platforma ima dovoljno PCIE staza da zamjeni Threadrippera u HEDT-u.
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Staro 27.05.2022., 10:39   #9569
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Adored opet nastavlja sa svojim teorijama . Jedini način da AMD ponudi više od 16 jezgri je kombinacija Zen 4 chipleta s 8 jezgri i Zen 4c chipleta sa 16 jezgri. Time bi dobili 24 jezgre, kao i Raptor Lake, ali možda više threadova (48), ako Zen 4c podržava SMT.
A čuj u pravu je u neku ruku jer je istu stvar AMD napravio sa zen2. Prikazali 8c16t, te ako nisu izričito rekli (ne sjećam se), onda su insinuirali da je to flagship. Odmah se vidjelo da na die ima mjesta za još jedan chiplet i tako je na kraju i ispalo 16c32t.

Ovdje postoji opcija da je jedan chiplet 12 jezgreni. Ako nije sad sa zen4, bit će sigurno kasnije povećanja, praktično su to i rekli za socket

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[URL="https://www.youtube.com/watch?v=WpY0T_Ql3_4"[U]
Ono što smo pričali cijelo vrijeme se i obistinilo. Mislim ono, bilo je očito
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Staro 27.05.2022., 17:28   #9570
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Al opet onih (samo) +15% performansi je skroz čudno. Ian Cutress je komentirao da je 10% do clocka, a 5% arhitektura i veći L2 cache.
Blender test u kojem su pregazili Intel je test u kojem i sad gaze Intel tak da ... IMHO izgleda ko AMD-ov "tick".
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