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Staro 03.03.2022., 14:44   #9541
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Pa zar će i Intel koristiti "ljepilo"?
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Staro 03.03.2022., 14:49   #9542
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Ne samo to, nego je cijela stvar prezentirana kao njihova ideja i inicijativa.
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Staro 03.03.2022., 15:37   #9543
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Ne samo to, nego je cijela stvar prezentirana kao njihova ideja i inicijativa.
Naravno, zašto se ne čudim
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Staro 10.03.2022., 15:34   #9544
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Russia’s invasion of Ukraine adds to pressure on chip supply chain https://www.ft.com/content/ac8733c4-...8-4997a77ad33f

Ukraine Crisis Cuts Neon Supply And Could Worsen Chip Shortage https://www.motor1.com/news/571764/u...p-crisis-neon/

TSMC 3nm Yield Problems May Derail AMD's CPU Plans https://www.tomshardware.com/news/ts...amds-cpu-plans

TSMC Potentially Facing 3nm Yield Problems, Could Spell Problems For AMD & NVIDIA, Opportunity for Intel https://wccftech.com/tsmc-potentiall...ity-for-intel/



Ukraine supplies 70 percent of the world's output of neon, a critical gas that runs lasers needed to manufacture microchips.





Nekoliko mjeseci "stari" ali itekako relevantni video uradci:





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Zadnje izmijenjeno od: Blue Spirit. 10.03.2022. u 16:57.
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Staro 10.03.2022., 16:27   #9545
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  • TSMC 3nm Yield Problems May Derail AMD's CPU Plans

  • TSMC Potentially Facing 3nm Yield Problems, Could Spell Problems For AMD & NVIDIA, Opportunity for Intel
Na stranu Wccftech i njihovi kontradiktorni članci i popratne analize, ali super mi je kak Intel zajedno s novim CEO-om uporno cijelu stvar prikazuje kao da su oni totalno samostalni i potpuno neovisi, do te mjere da se većina toga kaj kruži diljem Interneta, doima kao da Intel sam proizvodi svoje EUV mašine i imaju poseban recept za nanometre, dok su danas više, nego ikad ovisni o TSMC konkurenciji. Ukoliko ASML ili TSMC i malo posrnu, tj. spotaknu se za milimetar, a kamoli da naprave totalno krivi korak, ode sve nizbrdo: Intel, AMD, nVidia, ARM, itd., svi zajedno imaju zajeb svih zajeba i nijedan od njihovih planova za nadolazeće proizvode više nema uporište. Intel je tu IMHO najviše pogođen, jer su i dosad sve najavljeno odgađali u nedogled, do te mjere da su naposljetku odlučili kompletno preimenovati vlastite proizvodne procese, jer jedino to ih vraća u poziciju gdje mogu reći da su konkurentni. I onda povrh svega ovaj CEO koji jednostavno ne prestaje pričati, sve zajedno pakira u kontekstu da su oni najbolji, ali surađuju s ASML-om i TSMC-om, tako da pomognu tim firmama, jer su baš super. Mislim, komedija samo takva, frajer uporno iz dana u dana priča kak su Intel krafne najbolje, ali da bi bile najbolje, mora prvo kod nekog drugog (ASML) dobiti najbolju opremu za pripremu tih krafni i najbolje sastojke, tako da onda treća strana (TSMC) zahvaljujući superiornoj poziciji na tržištu, može za Intel pripremiti te njihove najbolje krafne.

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Intel will rely on TSMC for its rebound
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Intel is increasing its reliance on erstwhile rival Taiwan Semiconductor Manufacturing Co. (TSMC) in its attempt to boost sales and eventually regain dominance as the world leader in manufacturing scale and chip process technology. California-based Intel will join Apple to order the world’s first 3-nm chips from TSMC as the Taiwan chip foundry ramps up its newest process this year, according to three analysts surveyed. Intel and Apple are likely to be the only two TSMC customers at that most-advanced node during the ramp-up, according to the analysts. Intel’s leap depends on TSMC’s help at the 5- and 3-nm nodes. One of the challenges will be combining chiplets from TSMC with other chiplets made internally by Intel into one device like the Ponte Vecchio; that will involve matching chiplets made in TSMC’s 5nm process with Intel’s own silicon, using Intel’s new packaging technologies, which include embedded multi-die interconnect bridge (EMIB) and Foveros.

Intel’s plan will count heavily on ASML’s high NA extreme ultraviolet (EUV) lithography tools. Intel is ASML’s first high-NA customer in an EUV business (which currently includes only a handful of customers, including TSMC, Samsung, Intel and Micron). TSMC foundry rivals Samsung and Intel are leading in the adoption of gate all around 3D technology combined with EUV in hopes of surpassing the FinFET and EUV knowhow that TSMC has used to maintain sales and process leadership.TSMC will start production of its “N3” (3 nm process) with its top-two clients Intel and Apple doing small-volume wafer production in late 2022, according to Credit Suisse analyst Randy Abrams in a report provided to EE Times. TSMC will see N3 revenue kicking in by the first quarter of 2023, around the time Samsung ramps up GAA.
Izvor: EETimes
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Staro 26.03.2022., 01:39   #9546
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Kad se mogu ocekivati Apu 6000 za desktop? Laptopi sa Apu Rdna 2 grafikom su vec u prodaji.
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Staro 30.03.2022., 13:57   #9547
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AMD Ryzen 7000 "Raphael" Zen 4 CPU enter mass-production by April-May?
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AMD Ryzen 7000 Zen 4 could come as early as summer the plant for assembling the CPUs (packaging) is said to have already made preparations for the start of production of Raphael aka Ryzen 7000 in April or May. With reference to earlier periods of four or five months between the start of production and the market launch, a window of August to October can be speculated. "Raphael" is a multi-chip module of "Zen 4" CCDs fabricated on the TSMC N5 (5 nm) node, combined with a cIOD built on a yet-unknown node. A plant in China performs packaging. The "Zen 4" CPU cores are expected to introduce an IPC increase, as well as higher clock speeds. Also on offer will be next-gen connectivity, including PCI-Express Gen 5 (including CPU-attached Gen 5 NVMe), and DDR5 memory. These processors will launch alongside Socket AM5 motherboards based on the new AMD 600 series chipsets.
Izvor: TechPowerUp
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Zadnje izmijenjeno od: The Exiled. 30.03.2022. u 14:45.
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Staro 09.05.2022., 19:05   #9548
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AMD's Phoenix APU will reportedly challenge Nvidia's mobile RTX 3060 with integrated graphics
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Phoenix is a mobile CPU from AMD that will feature Zen 4 CPU cores, feature PCIe 5.0 support, and will reportedly feature up to eight CPU cores and a powerful integrated graphics processor. It is claimed that this APU will feature AMD's RDNA 3 graphics architecture, adding to it design improvements over today's RDNA 2 based graphics chips. If AMD can deliver mid-level discrete gaming performance with their Phoenix APU, AMD will be able to offer OEMs a solution that will deliver ample gaming performance for many users, require a simplified cooling setup (as only a single processor needs to be cooled), and potentially enable the creation of slimmer gaming notebooks. AMD's Phoenix APU will outperform nVidia's RTX 2060 and AMD's RX 6500 XT. The iGPU reportedly clocks to 3GHz or more, and the CPU side of Phoenix reportedly had a base clock speed of 4 GHz and a single core boost clock speed of 5GHz. With Phoenix, AMD's is reportedly moving its mobile products to Zen 4 CPU cores and an RDNA 3 graphics component. Two architectural leaps within a single product generation. Beyond that, Phoenix will likely be manufactured using 5nm silicon, delivering additional power efficiency and performance benefits.
Izvor: OC3D
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Staro 13.05.2022., 08:21   #9549
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Staro 20.05.2022., 20:31   #9550
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AMD signals its intent to showcase Zen 4 at Computex 2022
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At Computex, AMD is likely to showcase their upcoming Ryzen 7000 series processors alongside their new AM5 motherboard platform. Multiple motherboard manufacturers have already confirmed that they will be showcasing X670 motherboards at Computex, which means that we should learn a lot more about AMD's future products at the event. AMD's Ryzen 7000 series processors will use Zen 4 cores, will deliver consumers higher clock speeds than their existing Zen 3 counterparts, support DDR5 memory, and support PCIe 5.0 connectivity. With their Ryzen 7000 series, AMD plans to deliver once of their largest generational performance leaps to date. AMD's Computex 2022 keynote will be hosted on May 23rd at 2 pm Taipei time. For viewers in the UK, this translates to 7 am UK time.
Izvor: OC3D
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Staro 23.05.2022., 15:47   #9551
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Kreće lagano vlakić za Zen4:





TLDR:

5,3-5,5ghz SC boost 5.0ghz AC boost
Svi Ryzeni će imati RDNA2 iGPU kao i Intelovi procovi
cca 15% veći IPC u odnosu na Zen3

2 chipseta tj kao fol 3:
-X670 extreme za OCere
-X670 normalan
-B650 PCIe 5.0 samo za nvme, grafa je valjda 4.0
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Zadnje izmijenjeno od: Disco. 23.05.2022. u 16:42.
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Staro 23.05.2022., 16:50   #9552
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Staro 23.05.2022., 18:15   #9553
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IPC će vjerojatno biti veći za 3-5%, ako uopće bude i toliko, AMD je sad samo rekao za ukupne ST performanse da su najmanje 15% više od Zen 3. To ukuljučuje IPC + clock.
za B650 može i slot za grafičku biti 5.0, ali nije obavezno. Ionako taj slot ide direkt iz CPU-a i nema veze s chipsetom.
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Staro 23.05.2022., 18:43