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Intel first moved to away from solder starting with Ivy Bridge. One of the issues cited was that the smaller die size from the 22nm, now 14nm process, would cause the solder to crack prematurely. The move to thermal compound was not well met and the decrease in overclocks coupled with high heat was bemoaned by many. Haswell exacerbated the situation with on package VRMs. Intel answered with Devil’s Canyon, with improved VRMs and next-generation polymer thermal interface material (NGPTIM).
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