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BEIJING and TOKYO – Feb 7, 2017 – Lenovo (HKSE: 992) (ADR: LNVGY) today announced a new patent-pending Low Temperature Solder (LTS) process developed to improve PC manufacturing by conserving energy and increasing reliability.

The true innovation is in the science and testing required to develop and validate the new LTS process. Lenovo investigated thousands of combinations of solder paste material composed of a mixture of tin, copper, bismuth nickel and silver, specific compositions of flux material and unique profiles of time and heat temperatures that combine to enable this process.

With the new LTS process, soldering heat is applied at maximum temperatures of 180 degrees Celsius, a reduction of 70 degrees from the previous method.

After validation of the procedure, Lenovo discovered a significant reduction in carbon emissions as a result of using the new process. The procedure is already in production for ThinkPad E series and the 5th generation X1 Carbon recently announced at CES. Throughout 2017, Lenovo intends to implement the new LTS process on 8 SMT lines and estimates savings of up to 35% on carbon emissions1. By the end of 2018, Lenovo aims to have 33 SMT lines with 2 ovens per line using this new process, giving an estimated annual saving of 5,956 metric tons of CO22. To put this into perspective, the equivalent reduction in CO2 emissions is equal to the consumption of 670,170 gallons of gasoline3 per year.

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