[Bullet1]

Autor Rajinder Gill

Behind the scenes, Foxconn admitted there was a socket update in June that was approved by Intel with planned implementation in the August time period. We have the test report papers and the revised Foxconn socket passed all of Intel’s stress tests before it was placed into production, which raises questions as to why there has been problems post retail release. Intel has only commented that they believe the problems can occur with improper force being placed on the socket. However, that does not explain the lack of pad contacts with a retail CPU cooler and new processor that we have experienced in several situations.

Whether the reported socket issues were down to poor contact, improper clamp force, or a limitation in design (limited tolerances beyond stock specifications) is unknown to us at present. We’ve spoken to a few board engineers and nobody has been able or willing to put a firm conclusion on the matter, at least on the record.

Off record, early results from failed boards or user reports appeared to be a serious enough problem that most of the manufacturers moved to the Lotes or Tyco AMP sockets in their high-end boards or others for that matter. We have to stress that our problems and those of others we have dealt with directly occurred under extreme overclocking conditions. Out on the forums, we’ve heard of one reported case where a user claims a failure has happened at stock operating frequency using an Intel air cooler. We also have verification of a Lotes socket failing recently, which does put a new light on this problem.

Citat iz jednog testa sa Ananda da situacija svima bude malo jasnija...