[The Exiled]

Intel 28-core fantasy vs. AMD 32-core reality

At Computex 2018, we witnessed two major HEDT (high-end desktop) processor announcements. Intel unveiled a client-segment implementation of its "Skylake XCC" (extreme core count) silicon, which requires a new motherboard, while AMD announced a doubling in core-counts of its Ryzen Threadripper family, with the introduction of new 24-core and 32-core models, which are multi-chip modules of its new 12 nm "Zen+" die, and compatible with existing X399 chipset motherboards. Intel is frantically putting together a new HEDT platform positioned above its current LGA-2066 (X299) platform, built around its Purley enterprise platform, and a variant of the LGA-3647 socket (1 - 2). This socket is needed to wire out the 28-core Skylake XCC (extreme core count) silicon, which has a six-channel DDR4 memory interface. Rival AMD, meanwhile, showed off its 24-core and 32-core Ryzen Threadripper II processors, with its 24-core part beating Intel's i9-7980XE 18-core chip under ordinary air cooling.

Consider the AMD EPYC 7601 for a moment, which is the fastest 32-core 1P EPYC SKU. It ticks at 2.20 GHz, with a boost frequency of 3.20 GHz, but has its TDP rated at 180W. Now consider the fact that AMD is building the 32-core Threadripper II with more advanced 12 nm "Zen+" dies, and it becomes clear that the 24-core and 32-core Threadrippers are the stuff of nightmares for Gregory Bryant, not because AMD will make more money out of them than Intel makes out of its 28-core G-man in a football jersey, but because AMD's offering could be cheaper and more efficient, besides being fast. An overall superior halo product almost always has a spillover PR to cheaper client-segment products across platforms; and the client GPU industry has demonstrated that for the past two decades. Intel cannot beat the 32-core Threadripper II on the X299/LGA-2066 platform, because it has maxed out the number of cores the platform can pull. The Skylake HCC (high core count) silicon, deployed on 12-core, 14-core, 16-core, and 18-core LGA2066 processors, is already motherboard designers' nightmare, many of whom have launched special "XE" variants of their top motherboard models that offer acceptable overclocking headroom on these chips, thanks to beefed up VRM.

Intel readying 22-core LGA-2066 and 8-core LGA-1151 processors

Intel is readying a refresh to its "Basin Falls" HEDT platform (LGA-2066 client high-end desktop), with a new 22-core silicon. This part is neither Skylake HCC (20 tiles, up to 18 cores) nor Skylake XCC (30 tiles, up to 28 cores), but a new die with four more tiles than the Skylake HCC silicon, all of which are cores. The new silicon could let Intel design 20-core and 22-core SKUs for the X299 Express chipset, and is seen as a direct response to AMD's 24-core Ryzen Threadripper II processor, which was recently shown beating the 18-core i9-7980X in tech demos. The 32-core Threadripper II could face competition from the 28-core HEDT processor Intel is readying for Q4-2018, but that processor won't be compatible with LGA-2066.

In related news, the company is giving finishing touches to a new 8-core "Coffee Lake" die for the mainstream-desktop platform (LGA-1151 socket, 300-series chipset). This die features 8 cores, and likely 16 MB of shared L3 cache, while retaining the iGPU and uncore components from the existing Coffee Lake-S die. The chip could retain the classic "Ring Bus" design. The new 8-core mainstream-desktop SKUs, and at least two new high-end desktop SKUs (20-core and 22-core), could be launched in September 2018. The "Basin Falls" refresh, coupled with the new LGA-3647 "Purley" derivative for the 28-core monstrosity, will be all Intel has to face AMD this year, with the company's next HEDT silicon, "Cascade Lake-X" being reportedly delayed to the second half of 2019, probably due to foundry problems.

Izvor: TechPowerUp i TechSpot