[The Exiled]

AMD backend orders for new 7nm chips split between 3 firms

AMD has unveiled recently its 7nm CPU and GPU lineup designed for high-performance PCs, gaming and data center applications. The new processor series are all reportedly being fabricated by Taiwan Semiconductor Manufacturing Company (TSMC). TSMC is also among the backend partners of AMD for its new 7nm computing and graphics products. Siliconware Precision Industries (SPIL) under Taiwan's ASE Technology Holding, and China-based Tongfu Microelectronics (TFME) are other backend service providers for the chips.

TSMC with its CoWoS (chip-on-wafer-on-substrate) packaging has grabbed orders for AMD's 7nm datacenter CPU, while SPIL and TFME share the flip-chip packaging orders placed by AMD for its new 7nm CPU and GPU designed for desktops and notebooks. TFME (formerly Nantong Fujitsu Microelectronics) through its acquisition of an 85% stake in AMD's Penang, Malaysia and Suzhou, China ATMP (assembly, test, mark, and pack) facilities has allowed the China-based company to win part of the orders for AMD's new 7nm processors.

Izvor: DigiTimes