nema posebna tema za TSMC pa cu ovdje naljepiti jer je AMD top klijent....
Citiraj:
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In ECTC2020, TSMC have presented its low-temperature SoIC technology, achieving good bonding for multi-layer stacking, including DRAM stacking with 4-Hi/ 8-Hi/ 12-Hi, and SRAM stacking with 4-Hi.
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