[The Exiled]

Internal Intel docs reveal 500-watt Xe graphics, ’tile’ architecture

The documentation shows Intel’s Xe GPUs will use “tile” modules. Intel doesn’t call these “chiplets” in the documentation, but the company revealed in November that its Xe cards would use a multi-die system, packaged together by Foveros 3D stacking. The technique may be similar to that pioneered by AMD in its Zen processors (which makes sense: consider who Intel has hired). In graphics, this approach differs from how AMD and nVidia cards are designed. The cards listed include a one-tile GPU at the bottom of the stack, a two-tile card, and a maxed-out four-tile card. Intel has at least three distinct cards in the works, with a TDP ranging from 75 watts all the way up to 500. These numbers represent the full gamut of graphics, from entry-level consumer cards all the way up to server-class data center parts.

Izvor: Digital Trends