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The Exiled · 09.10.2025., 15:36

Citiraj:

Intel takes the wraps off Panther Lake — first 18A client processor brings the best of Lunar Lake and Arrow Lake together in one package

Citiraj:

Intel revealed new information about its upcoming Panther Lake chips made on its new 18A node at an event in Arizona, including claims that the chips can deliver 50% more performance at similar power to its Lunar Lake chips or reduce power by 30% in multi-threaded work compared to its Arrow Lake-H processors. The chips will launch at CES 2026, with availability in Q1 of 2026. Panther Lake SoCs are all built up from the same cutting-edge P-cores, E-cores, and iGPU architecture, while affording laptop makers more freedom to tailor their products to a wider range of buyers and price points. And as Intel's first product to ship with a compute tile fabricated on the latest 18A process node, Panther Lake has a ton to prove.

Panther Lake employs Foveros-S, a 2.5D version with fine-pitch interconnects of 36 micrometers. It links compute, graphics, and platform controller tiles into a cohesive SoC. Foveros is Intel's in-house implementation of a broader industry shift toward multi-die packaging, which now includes competing technologies such as AMD's Infinity Fabric, TSMC's CoWoS, and Samsung's I-Cube. These packaging methods have collectively reshaped chip production by allowing companies to mix different process nodes and IP blocks in one package. Processes used: the compute tile is Intel 18A; the 12-Xe GPU tile uses TSMC N3E; the 4-Xe GPU tile is on Intel 3; and the platform controller (PCH) tile is on TSMC N6—joined using Foveros-S 2.5D. Using different nodes per tile is part of Intel's IDM 2.0 flexibility to meet timing/yield/performance goals.

Intel Panther Lake is the company's first processor to use its new Intel 18A process for the compute tile with GPU tiles built on Intel 3 or TSMC N3E, all paired with externally manufactured tiles produced by TSMC. This mix of in-house and external manufacturing marks a shift toward a hybrid supply strategy where Intel Foundry Services focuses on core logic, while other tiles continue to come from outside partners. The exact processes used are: compute (Intel 18A); 12-Xe GPU (TSMC N3E); 4-Xe GPU (Intel 3); PCT/PCH (TSMC N6).

Izvor: Tom's Hardware i TechPowerUp