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The Exiled · 12.03.2025., 09:17

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Rumors about Intel splitting: Joint venture with TSMC, nVidia, AMD and more for Intel fabs

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TSMC has pitched U.S. chip designers nVidia, Advanced Micro Devices and Broadcom about taking stakes in a joint venture that would operate Intel's factories. Under the proposal, the Taiwanese chipmaking giant would run the operations of Intel's foundry division, which makes chips adapted for the needs of customers, but it would not own more than 50%. The talks, which are at an early stage, come after U.S. President Donald Trump's administration requested TSMC, the world's leading contract chipmaker, assist in turning around the troubled U.S. industrial icon.

The details of the plan for TSMC to take no more than a 50% stake and its overtures to potential partners are being reported for the first time. Any final deal - the value of which is unclear - would need approval from the Trump administration, which does not want Intel or its foundry division to be fully foreign-owned. At stake is the future of the U.S. chipmaking giant, whose shares have lost more than half of their value in the last year. Intel reported a 2024 net loss of $18.8 billion, its first since 1986, driven by large impairments. The foundry division's property and plant equipment had a book value of $108 billion as of December 31, according to a company filing.

TSMC's joint venture pitch was made to potential backers before the Taiwanese chipmaker announced with Trump on March 3 that the company planned to make a fresh $100 billion investment in the United States that involves building five additional chip facilities there in coming years. Talks about the joint venture over Intel's foundry division have since continued, with TSMC looking to have more than one chip designer as a partner. Multiple companies have expressed interest in buying parts of Intel, but two of the four sources said the U.S. company has rejected discussions about selling its chip design house separately from the foundry division.

Intel board members have backed a deal and held negotiations with TSMC, while some executives are firmly opposed. Intel's contract manufacturing business, or foundry division, was a crucial part of former CEO Pat Gelsinger's effort to save Intel. Gelsinger was forced out by the board in December, which named two interim co-CEOs who have mothballed its forthcoming AI chip. Any deals between historical rivals TSMC and Intel would face major challenges and be costly and laborious. The two companies currently use vastly different processes, chemicals, and chipmaking tool setups at their factories, according to separate sources at the companies. Intel has previously had manufacturing partnerships with Taiwan's UMC and Israel's Tower Semiconductor that could offer a precedent for the two companies to operate together, but it remains unclear how such a partnership would work regarding trade manufacturing secrets.

The Taiwanese chipmaker wants potential investors in the joint venture to also be Intel advanced manufacturing customers. Reuters reported last week, citing sources, that nVidia and Broadcom are running manufacturing tests with Intel, using the company's most advanced production techniques, known as 18A. AMD is also evaluating whether Intel's 18A manufacturing process is suitable for it. But 18A has been an area of contention in negotiations between Intel and TSMC.

Izvor: ComputerBase i Reuters

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Intel announces appointing Lip-Bu Tan as new CEO

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Intel Corporation today announced that its board of directors has appointed Lip-Bu Tan, an accomplished technology leader with deep semiconductor industry experience, as chief executive officer, effective March 18. He succeeds Interim Co-CEOs David Zinsner and Michelle (MJ) Johnston Holthaus. Tan will also rejoin the Intel board of directors after stepping down from the board in August 2024. Zinsner will remain executive vice president and chief financial officer, and Johnston Holthaus will remain CEO of Intel Products. Frank D. Yeary, who took on the role of interim executive chair of the board during the search for a new CEO, will revert to being the independent chair of the board upon Tan becoming CEO.

Tan is a longtime technology investor and widely respected executive with more than 20 years of semiconductor and software experiences as well as deep relationships across Intel's ecosystem. He formerly served as CEO of Cadence Design Systems from 2009 to 2021, where he led a reinvention of the company and drove a cultural transformation centered on customer-centric innovation. During his time as CEO, Cadence more than doubled its revenue, expanded operating margins and delivered a stock price appreciation of more than 3,200%. Tan served as a member of the Cadence board of directors for 19 years, from his appointment in 2004 through his service as executive chairman from 2021 to 2023 following his tenure as CEO. He is also a founding managing partner of Walden Catalyst Ventures and chairman of Walden International. He has significant public company board experience, currently serving on the boards of Credo Technology Group and Schneider Electric.

Tan holds a Bachelor of Science in physics from Nanyang Technological University in Singapore, a Master of Science in nuclear engineering from the Massachusetts Institute of Technology and an MBA from the University of San Francisco. In 2022, he received the Robert N. Noyce Award, the Semiconductor Industry Association's highest honor.

Izvor: TechPowerUp

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Intel may follow AMD's Lisa Su by spinning off its foundry business to GlobalFoundries

Intel's new CEO plots overhaul of manufacturing and AI operations

New Intel CEO Lip-Bu Tan will pick up where Pat Gelsinger left off

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Intel’s new CEO gets pay package valued at about $69 million

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Incoming Intel Corp. Chief Executive Officer Lip-Bu Tan, who was named to the position this week, will receive compensation valued at about $69 million if he reaches targets over the coming years. The package includes a salary of $1 million, plus a 200% performance-based bonus, the chipmaker said in a filing Friday. It also includes $66 million in long-term equity awards and stock options and new-hire incentives. Separately, Tan agreed to buy $25 million in Intel shares in the first 30 days of taking the job. “Lip-Bu’s purchase reflects his belief in Intel and commitment to creating shareholder value,” the company said in a statement.

Earlier this week, Intel announced Tan was filling the role left vacant when the board ousted his predecessor, Pat Gelsinger. The semiconductor industry veteran, who previously served as an Intel board member, is tasked with trying to return the company to the forefront of an industry that it dominated for decades. Tan, 65, will assume the role on March 18, the company said Wednesday. He will rejoin the board as well after stepping down in August 2024. Intel’s stock has rallied this year, gaining 20%, including a surge of 15% on Thursday following the announcement of Tan’s appointment.

Izvor: Bloomberg

Daniel Nenni u svojoj vječnoj stručnosti kao prvu reakciju na vijest o novom Intel direktoru, sav sretan priželjkuje porast vrijednosti dionica, dok istovremeno ne gubi ni sekunde vremena da Lip-Bu Tan direktora obasipa istim havlospjevima koje je godinama pjeval o Patu Gelsingeru. Tak jasno, Daniel Nenni i ovog novog Intel direktora osobno poznaje već dva desetljeća i jamči da je čovjek na mjestu, inženjer baš kao i Pat koji zna kaj radi, prava osoba koja u ovom trenu treba Intelu da firmu izvuče iz problema.

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Autor The Exiled

Moguće da tip ima neke gadne pare uložene u Intel, pa je sad lagano panika i zato idu ovakve priče. Makar i u prijašnjim gostovanjima je imal kojekakvih bisera, pa puna usta hvale za direktora Pata koji je "pravi inženjer, on će njih posložiti i postrojiti". Svašta je Daniel napričal, ovisno o tome kak je vjetar zapuhal, ali ova friška epizoda je u rangu bulažnjenja nekog dede koji je davno radil nešto u svijetu mikroprocesora i poluvodiča, pa sad pametuje, a sav zbunjen ne zna da li mu je nešto zagorilo na šporetu.