[The Exiled]

• AMD widens availability of Ryzen AI software for developers, XDNA 2 coming with Strix Point in 2024
  
  
• AMD Unveils Ryzen 8040 mobile series APUs: Hawk Point with Zen 4 and Ryzen AI
  
  
• AMD Instinct MI300 series architecture deep dive reveal: Advancing AI and HPC
  
  
• AMD Instinct MI300X GPU and MI300A APUs launched for AI era

The AMD Instinct MI300A and MI300X are fundamentally similar. At a high-level, the main difference is that the three CCDs used on the MI300A to integrate CPU cores are replaced by two additional XCDs on the MI300X. That means the total chiplet count is different, too. The MI300A is comprised of 13 chiplets (3 x CCD, 6 x XCD, 4 x IO) while the MI300X uses 12 (8 x XCD, 4 x IO). The MI300X also has more HBM3 memory (128GB vs. 192GB). Both have four base IO dies and are built using 3D hybrid bonded SoIC technology and 2.5D silicon interposers, in addition to traditional technologies. The combination of 3D stacking and the use of 2.5D silicon interposers is why AMD says the Instinct MI300 family uses advanced 3.5D packaging.