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The Exiled · 21.08.2022., 15:04

Da, AMD već sad ima arhitekturu koja im omogućava da preslože svoje LEGO kockice kak god ih volja, dok Intel mora koristiti hibridni dizajn i još k tome sve pojačati na 11, da budu konkurentni ili bolji.

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Citiraj:

TSMC (Not Intel) Makes the Vast Majority of Logic Tiles on Intel "Meteor Lake" MCM

Citiraj:

Japanese tech publication PC Watch has annotated the "Meteor Lake" SoC, and points out that the vast majority of the chip's tiles and logic die-area is manufactured on TSMC nodes. The MCM consists of four logic tiles—the CPU tile, the Graphics tile, the SoC tile, and the I/O tile. The four sit on a base tile that facilitates extreme-density microscopic wiring interconnecting the logic tiles. The base tile is built on the 22 nm HKMG silicon fabrication node. This tile lacks any logic, and only serves to interconnect the tiles. Intel has an active 22 nm node, and decided it has the right density for the job. The CPU tile is the only logic tile built on an Intel node, which in this case is the Intel 4 node. The company considers this process to be on-par or better than TSMC's N5, and it probably wanted the crown jewels of its IP—CPU cores—to be built on a native fab. The CPU tile contains the CPU cores, a last-level cache, and Foveros interfaces.

The Graphics tile is the second-most important logic tile, and contains an iGPU based on the Xe-LPG graphics architecture. An evolution of Xe-LP, the LPG features real-time ray tracing capabilities. Intel decided to use the TSMC N5 (5 nm EUV) node for this tile. Not all of the iGPU is based on this tile, some of it, such as the Display Engine, could be located on the I/O tile. The SoC tile is the largest in terms of area, and is built on the TSMC N6 (6 nm) node. This contains the memory controllers, PCIe root-complex, and the controllers and SerDes (serializer-deserializer) of the various on-package devices. The I/O die is the smallest die, and is essentially an extension of the SoC die. It's built on the same TSMC N6 node, and features the PHY (physical layer) components of the various I/O.

Intel confirmed that Meteor Lake and Arrow Lake are launching in 2023 and 2024 respectively. The series will launch for desktop and mobile platforms.

Izvor: TechPowerUp i Tom's Hardware

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Intel Introduces First-of-its-Kind Semiconductor Co-Investment Program

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Intel Corporation today announced a first-of-its-kind Semiconductor Co-Investment Program (SCIP) that introduces a new funding model to the capital-intensive semiconductor industry. As part of its program, Intel has signed a definitive agreement with the infrastructure affiliate of Brookfield Asset Management, one of the largest global alternative asset managers, which will provide Intel with a new, expanded pool of capital for manufacturing build-outs. SCIP is a key element of Intel's Smart Capital approach, which aims to provide innovative ways to fund growth while creating further financial flexibility to accelerate the company's IDM 2.0 strategy. Intel's partnership with Brookfield is expected to enhance the company's strong balance sheet by allowing Intel to tap into a new pool of capital below its cost of equity while protecting its cash and debt capacity for future investments and continuing to fund a healthy and growing dividend. Over the next several years, the structure is expected to provide a $15 billion cumulative benefit to Intel's adjusted free cash flow and is expected to be accretive to Intel's earnings per share during the construction and ramp phase. SCIP provides Intel the ability to replicate the co-investment model with other partners for other build-outs globally.

Izvor: TechPowerUp