[The Exiled]

nVidia Hopper might have huge 1000 mm² die monolithic design

Hopper is still sporting a classic monolithic die design despite previous rumors, and it appears that nVidia's performance targets have led to the creation of a monstrous, ~1000 mm² die package for the GH100 chip, which usually maxes out the complexity and performance that can be achieved on a particular manufacturing process. This is despite the fact that Hopper is also rumored to be manufactured under TSMC's 5nm technology, thus achieving higher transistor density and power efficiency compared to the 8nm Samsung process that nVidia is currently contracting. At the very least, it means that the final die will be bigger than the already enormous 826mm² of nVidia's GA100.

If this is indeed the case and nVidia isn't deploying a MCM (Multi-Chip Module) design on Hopper, which is designed for a market with increased profit margins, it likely means that less profitable consumer-oriented products from nVidia won't be featuring the technology either. MCM designs also make more sense in nVidia's HPC products, as they would enable higher theoretical performance when scaling - exactly what that market demands. Of course, nVidia could be looking to develop an MCM version of the GH100 still; but if that were to happen, the company could be looking to pair two of these chips together as another HPC product (rumored GH-102). ~2,000 mm² in a single GPU package, paired with increased density and architectural improvements might actually be what nVidia requires to achieve the 3x performance jump from the Ampere-based A100 the company is reportedly targeting.

Izvor: TechPowerUp