12.12.2021., 14:06
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#5384
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McG
Datum registracije: Feb 2014
Lokacija: Varaždin
Postovi: 6,785
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Da, ali AMD zajedno s TSMC-om već ima spremne i funkcionalne proizvode (dostupne početkom 2022.) koji koriste 3D stacking, dok Intel u godinama koje dolaze tek mora izbaciti svoja alternativna rješenja. 
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Stacking is also at the top of the todo list at Intel, because here they are a little behind TSMC. TSMC's 3D stacking / packaging will go on sale shortly, it will still take a while at Intel, the direct opponent, dubbed Foveros Direct, will not be ready until 2023. Intel is researching the third dimension, which could gradually be introduced as a possible replacement / expansion of RibbonFET from the use of gate-all-around technology (ATM) and the year 2025. In terms of the density of connections, AMD's 3D V-Cache is on a level that Intel only wants to achieve with Foveros Direct.
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Izvor: ComputerBase i HardwareLuxx
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