[The Exiled]

AMD to implement TSMC SoIC tech with upcoming HPC chips

AMD will debut TSMC's ambitious System-on-Integrated-Chips (SoIC) technology with its upcoming HPC chips. SoIC will enable AMD to stack logic, memory, and I/O as separate chips within a single package. The article references a next-generation "HPC" chip, although it didn't delve into what this could be. Logically, AMD would want to integrate its EPYC and MI accelerator lines into a single package that can be used in HPCs. Such a product would combine its Zen-series x86-64 serial processing, with CDNA-series scalar processing, expertise in memory, leveraging large on-die victim-caches, and high-bandwidth memory (HBM); along with next-gen I/O. AMD company has just announced a special event which is to focus on high-performance computing hardware such as AMD’s HPC processor like EPYC or GPU-based accelerators known as Instinct series. AMD is expected to unveil its Milan-X EPYC series which are to feature a special 3D V-cache technology even before the consumer line known as Vermeer-X, which is too based on Zen3 microarchitecture. AMD will host its Accelerated Data Center Premiere on November 8, 2021.

Izvor: TechPowerUp