[The Exiled]

AMD Threadripper 5000 series is expected to be released in August

The highly anticipated Zen 3 architecture Threadripper 5000 series HEDT CPU may be released in August. Threadripper 5000 is code-named "Chagall" and can be seen as the HEDT version of the already released Zen 3 EPYC Milan. Chagall succeeds Castle Peak, which is the existing Threadripper 3000 series. The main difference lies in the Zen 2 → Zen 3 architecture, and the single CCX 16MB → 32MB unified L3. There is no change in the number of cores, memory, PCIe channel IO, etc. After all, Milan's IOD is only a minor change, xGMI2 is upgraded to 18GT/s, and the rest remains unchanged.

On-chip water cooling: TSMC wants to cool up to 2 kW directly on the chip

At the VLSI Symposium, TSMC research associates gave an interesting presentation on a possible cooling solution for future chips that envisages a direct integration of water cooling into the chip itself. First of all, one should ask oneself why direct water cooling in or on the chip might be necessary. Chips such as the A100 accelerator from NVIDIA, together with the HBM2E and as an SXM4 module, already have a waste heat of up to 500 W. Intel's Xe HPC chip Ponte Vecchio even has up to 600 W in the room. Despite modern manufacturing techniques, it is becoming increasingly difficult to cool such chips. TSMC's goal is to develop cooling solutions for waste heat in the range of 10 W per square millimeter. Depending on the size of the chip, however, these 10 W/mm² are already very ambitious. For larger chips (500 mm² and more), TSMC targets a TDP of 2,000 W (2 kW).

Izvor: MoePC i HardwareLUXX