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The Exiled · 14.05.2021., 10:01

AMD and GlobalFoundries Update Wafer Supply Agreement: Orders through 2024, now Non-Exclusive

Citiraj:

AMD this afternoon has revealed that it has once again amended its wafer supply agreement with US fab (and AMD fab spin-off) GlobalFoundries. Under the terms of the amended seventh amendment, AMD will see out its existing commitment to use GlobalFoundries through 2024, with the latest amendment setting purchase targets for 2022, 2023, and 2024. Beyond those new targets, however, the agreement releases AMD from all further exclusivity commitments to GlobalFoundries. AMD is now free to use any fab on any process node that it wants. As with the previous agreement, these targets are binding in both directions. GlobalFoundries is required to allocate a minimum amount of its capacity to orders from AMD, and AMD in turn is required to pay for these wafers, whether they use this capacity or not. For finished wafers, the agreement sets new, undisclosed prices. Meanwhile for any capacity AMD does not use, they will once again be required to pay GlobalFoundries a portion of the difference.

Now with that said, the net impact of this change is likely to be limited as AMD was already free to pursue other fabs for 7nm and smaller nodes – which will be the vast majority of AMD’s needs over the next three years. But it does underscore how AMD and GlobalFoundries are slowly moving farther apart, as GlobalFoundries has left the race for cutting-edge manufacturing nodes. In the meantime, however, AMD still has three years and $1.6 billion in wafer orders to place at GlobalFoundries. According to a separate statement from AMD, these 12/14nm wafer orders will be used to fulfill orders for trailing-edge logic products, as well as for I/O dies for AMD’s current-generation Ryzen and EPYC CPUs. As with their trailing-edge prodcts, the company will still need to keep producing their current-gen products for a time, even after they’re supplanted with newer technologies.

Izvor: AnandTech

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Citiraj:

TSMC looks to double down on U.S. chip factories & Korea unveils $450 billion push for global chipmaking crown

Citiraj:

Taiwan Semiconductor Manufacturing Co is weighing plans to pump tens of billions of dollars more into cutting-edge chip factories in the U.S. state of Arizona than it had previously disclosed, but is cool on prospects for an advanced European plant. Reuters this month reported that the previously disclosed factory could be the first of up to six planned plants at the site. Now, company officials are debating whether the next plant should be a more advanced facility that can make chips with so-called 3-nanometer chipmaking technology compared to the slower, less-efficient 5-nanometer technology used for the first factory. The more advanced 3-nanometer plant could cost $23 billion to $25 billion, one person familiar with the matter told Reuters. Details of TSMC's plans for the additional factories at the Arizona site have not been previously reported.

Citiraj:

South Korea unveiled ambitious plans to spend roughly $450 billion to build the world’s biggest chipmaking base over the next decade, joining China and the U.S. in a global race to dominate the key technology. Samsung is boosting its spending by 30% to $151 billion through 2030 while Hynix is committing $97 billion to expansion at existing facilities in addition to its $106 billion plan for four new plants in Yongin. The effort comes at a time when the U.S., China and the European Union seek to shore up their semiconductor capabilities after a global chip shortage exposed a reliance on just a handful of Asian manufacturers and hobbled efforts to repair pandemic-scarred economies.

Izvor: Reuters i Bloomberg