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Citiraj:
Migration to EUV lithography going well
Globalfoundries has improved its extreme ultraviolet (EUV) mask yield rate to nearly 65 percent and made progress in its movement to EUV lithography.
Company CTO Gary Patton told the assembled throngs at a Shanghai company shindig that chipmakers were finding EUV lithography mask defects in the development of EUV-based process technologies.
Globalfoundries expects more EUV mask fabrication challenges before moving forward to the high-volume manufacturing stage. However, he is pleased that the outfit has a 65 percent mask yield rate even if it still has to be 95 percent to be commercially viable.
Globalfoundries will first use EUV lithography technology in its 7nm FinFET node, and has started to work with AMD in the process development, Patton said.
The company is planning the rollout of its 12nm leading-performance (12LP) FinFET manufacturing process to deliver better density and a performance boost over its current-generation 14nm FinFET offering. The 12LP node will be ready for volume production in the first quarter of 2018, he said.
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Plavo je bitno za Zen 2 (Q4 2018 najranije, realno ~Q1 2019), a crno na ovaj zen+ ondnosno zen refresh