[McG]

AMD has just announced two new dual-core, 18W TDP processors with an embedded-friendly ball grid array (BGA) package, the AMD Turion Neo X2 L625 and Athlon Neo X2 L325. Based on 65nm technology, Turion Neo X2 L625 and Athlon Neo X2 L325 feature 1.6GHz and 1.5GHz clock speed, L2 cache of 2×512KB and 2×256KB, supporting DDR2 667/533 SO-DIMM/U-DIMM memory. When combined with either the AMD 780E or M690E chipset, embedded system designers can take advantage of a complete x86-based solution that can help streamline development, minimize time to market and offers leading-edge graphics capability.

“We are committed to helping simplify the development cycle for our embedded customers with a platform that readily addresses the shifting needs of their markets,” said Buddy Broeker, director, Embedded Computing Solutions Division, AMD. “Systems such as digital signage, point of sale, and thin clients require PC-class performance and a rich graphics experience. Our ASB1 BGA platform is a ready-to-go, one-stop solution for these markets and at the same time offers the flexibility of multiple CPU and chipset choices.”

The industry-leading embedded system providers such as IBASE and IEI plan to launch systems based on the new dual-core processors.

Izvor: EXPreview